JPWO2011021484A1 - ガラスセラミック組成物、セラミックグリーンシートおよび多層セラミック基板 - Google Patents
ガラスセラミック組成物、セラミックグリーンシートおよび多層セラミック基板 Download PDFInfo
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- H05K3/46—Manufacturing multilayer circuits
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- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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Abstract
Description
まず、表1に示すような粒度分布をそれぞれ有する、アルミナからなるセラミック粉末A1〜A4およびガラス粉末G1〜G5を準備した。ガラス粉末G1〜G5については、SiO2を59%、CaOを26.5%、B2O3を8.7%、およびAl2O3を5.7%それぞれ含む組成を有するものを用い、乾式ミルによる粉砕工程を実施した。ガラス粉末G1〜G4については、粉砕工程の後、分級機による分級工程を経て得た。ガラス粉末G5については分級機を用いなかった。
2 セラミック粉末
11 多層セラミック基板
12 セラミック層
Claims (7)
- CaO−SiO2−Al2O3−B2O3からなるガラス粉末と、Al2O3からなるセラミック粉末とを混合してなる、ガラスセラミック組成物であって、
ガラス粉末の50%通過粒径D50が3.5μm未満であり、
ガラス粉末の99%通過粒径D99が15μm未満であり、
セラミック粉末の50%通過粒径D50が1.0μm未満であり、かつガラス粉末の50%通過粒径D50よりも小さい、
ガラスセラミック組成物。 - ガラス粉末の50%通過粒径D50が1.0μm以上かつ2.5μm未満であり、セラミック粉末の50%通過粒径D50はガラス粉末の50%通過粒径D50の1/2以下である、請求項1に記載のガラスセラミック組成物。
- ガラス粉末の50%通過粒径D50が2.5μm以上かつ3.5μm未満であり、セラミック粉末の50%通過粒径D50はガラス粉末の50%通過粒径D50の1/3以下である、請求項1に記載のガラスセラミック組成物。
- さらにアノーサイト結晶粉砕粉を混合してなる、請求項1ないし3のいずれかに記載のガラスセラミック組成物。
- アノーサイト結晶粉砕粉の50%通過粒径D50は、ガラス粉末の50%通過粒径D50より小さい、請求項4に記載のガラスセラミック組成物。
- 請求項1ないし5のいずれかに記載のガラスセラミック組成物を含む、セラミックグリーンシート。
- 請求項6に記載のセラミックグリーンシートの焼結体からなる複数のセラミック層を備える、多層セラミック基板。
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JP2011527622A JP5633707B2 (ja) | 2009-08-18 | 2010-07-28 | ガラスセラミック組成物、セラミックグリーンシートおよび多層セラミック基板 |
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JP2009189190 | 2009-08-18 | ||
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JP2011527622A JP5633707B2 (ja) | 2009-08-18 | 2010-07-28 | ガラスセラミック組成物、セラミックグリーンシートおよび多層セラミック基板 |
PCT/JP2010/062677 WO2011021484A1 (ja) | 2009-08-18 | 2010-07-28 | ガラスセラミック組成物、セラミックグリーンシートおよび多層セラミック基板 |
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JPWO2011021484A1 true JPWO2011021484A1 (ja) | 2013-01-17 |
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WO2013099944A1 (ja) * | 2011-12-27 | 2013-07-04 | 株式会社村田製作所 | 多層セラミック基板およびそれを用いた電子部品 |
WO2014196348A1 (ja) * | 2013-06-05 | 2014-12-11 | 株式会社村田製作所 | セラミック基板用組成物およびセラミック回路部品 |
JP6777164B2 (ja) * | 2016-12-08 | 2020-10-28 | 株式会社村田製作所 | 多層セラミック基板及び電子装置 |
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JP2712930B2 (ja) * | 1991-08-29 | 1998-02-16 | 日本電気株式会社 | 多層ガラスセラミック基板とその製造方法 |
JP2001010858A (ja) * | 1999-06-22 | 2001-01-16 | Murata Mfg Co Ltd | セラミック基板用組成物およびセラミック回路部品 |
JP4852778B2 (ja) * | 1999-06-22 | 2012-01-11 | 株式会社村田製作所 | セラミック基板用組成物およびセラミック回路部品 |
JP2006083014A (ja) * | 2004-09-16 | 2006-03-30 | Toray Ind Inc | セラミックス焼結体およびそれを用いたセラミックス多層基板 |
JP2008074679A (ja) * | 2006-09-22 | 2008-04-03 | Ngk Spark Plug Co Ltd | セラミック多層部品及びその製造方法 |
JP4863975B2 (ja) * | 2007-02-06 | 2012-01-25 | 三菱電機株式会社 | グリーンシート用セラミック粉末及び多層セラミック基板 |
JP2009158523A (ja) * | 2007-12-25 | 2009-07-16 | Kyocera Corp | 配線基板およびその製造方法 |
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