JPWO2010067866A1 - 半導体セラミック及び正特性サーミスタ - Google Patents
半導体セラミック及び正特性サーミスタ Download PDFInfo
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- JPWO2010067866A1 JPWO2010067866A1 JP2010542135A JP2010542135A JPWO2010067866A1 JP WO2010067866 A1 JPWO2010067866 A1 JP WO2010067866A1 JP 2010542135 A JP2010542135 A JP 2010542135A JP 2010542135 A JP2010542135 A JP 2010542135A JP WO2010067866 A1 JPWO2010067866 A1 JP WO2010067866A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 239000000919 ceramic Substances 0.000 title claims abstract description 49
- 239000000203 mixture Substances 0.000 claims abstract description 31
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 29
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 24
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 12
- 230000000630 rising effect Effects 0.000 abstract description 28
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 239000011812 mixed powder Substances 0.000 description 10
- 238000010304 firing Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000011572 manganese Substances 0.000 description 6
- 238000001354 calcination Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- AREPHAPHABGCQP-UHFFFAOYSA-N 1-(dimethylamino)-3-[2-[2-(4-methoxyphenyl)ethyl]phenoxy]propan-2-ol Chemical compound C1=CC(OC)=CC=C1CCC1=CC=CC=C1OCC(O)CN(C)C AREPHAPHABGCQP-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910003322 NiCu Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005621 ferroelectricity Effects 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 150000002697 manganese compounds Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000008279 sol Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
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- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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Abstract
Description
ここで、M1は、Li、Na、Kに代表されるアルカリ金属元素を示している。また、Lnは半導体化剤となる希土類元素を示している。この希土類元素Lnとしては、半導体化剤としての作用を奏するものであれば、特に限定されるものではないが、La、Y、Sm、Nd、Dy、及びGdの群から選択された1種以上を好んで使用することができる。
このようにモル比mを、上記数式(1)の範囲に設定することにより、抵抗値の立ち上がり特性を良好なものとすることができる。
すなわち、Baの一部をCaで置換することにより、結晶軸のc軸とa軸の比が大きくなって結晶の正方晶性が向上し強誘電性が高くなる。そしてその結果、自発分極が大きくなって粒界障壁を打ち消すことができ、これにより半導体セラミックの低抵抗化が可能となり、例えばヒータに好適なPTCサーミスタを実現することが可能となる。
すなわち、Aサイト中のCaのモル比yが0.042未満の場合は、Caの含有量が少ないため、結晶の正方晶性を十分に上げることができず、結晶粒径も大きくならず、所望の低抵抗を有する半導体セラミックを得るのは困難である。
(Ba1-w-x-y-zM1wBixCayLnz)mTiO3+nMn…(D)
ただし、nは、0.0001≦n≦0.0020である。
ここで、ρ100、ρ10は、室温25℃で測定したときの電気抵抗率ρ0に対し、それぞれ100倍、10倍のときの電気抵抗率を示し、T100−T10は、ρ100、ρ10における温度を示している。
2a、2b 外部電極
Claims (6)
- 実質的にPbを含まない非鉛系の半導体セラミックであって、
一般式AmBO3で表されるペロブスカイト型構造を有するBamTiO3系組成物を主成分とし、
Aサイトを構成するBaの一部が、少なくともアルカリ金属元素、Bi、及び希土類元素で置換されると共に、
AサイトとBサイトのモル比mが、0.990≦m≦0.999であることを特徴とする半導体セラミック。 - 前記Baの一部がCaで置換されると共に、前記Aサイトを構成する元素の総モル数を1モルとしたときの前記Caの含有量が、モル比換算で0.042〜0.20であることを特徴とする請求項1記載の半導体セラミック。
- 前記Caの含有量は、モル比換算で0.125〜0.175であることを特徴とする請求項2記載の半導体セラミック。
- 前記モル比mは、0.990≦m≦0.995であることを特徴とする請求項1乃至請求項3のいずれかに記載の半導体セラミック。
- AサイトとBサイトのモル比mが、0.996≦m≦0.999であることを特徴とする請求項3記載の半導体セラミック。
- 部品素体の表面に一対の外部電極が形成された正特性サーミスタにおいて、
前記部品素体が、請求項1乃至請求項5のいずれかに記載の半導体セラミックで形成されていることを特徴とする正特性サーミスタ。
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