JPWO2009119772A1 - Glass substrate processing method and apparatus - Google Patents

Abstract

The present invention provides a glass substrate processing method and apparatus capable of shortening the time spent measuring the dimensions of the glass substrate and improving the operating efficiency of the processing apparatus. In this invention, the dimension measuring apparatus 10 is installed in the machine of the chamfering apparatus 12, and the vertical and horizontal dimensions of the glass substrate G before the chamfering process are measured, and the vertical and horizontal dimensions after the chamfering process are measured and displayed. Therefore, since the work of measuring the glass substrate G processed by the front-end folding device or the chamfering processing device with another dimension measuring device can be omitted as in the prior art, the measurement of the size of the glass substrate G is expended. Time can be shortened and the operating efficiency of the chamfering apparatus 12 can be improved.

Description

  The present invention relates to a glass substrate processing method and apparatus, and more particularly to a glass substrate processing method and apparatus for chamfering a rectangular glass substrate used in an FPD (Flat Panel Display).

  FPD glass substrates such as liquid crystal displays and plasma displays are manufactured by cutting and folding plate glass into a predetermined rectangular size in the cutting process, and chamfering the edge part in the chamfering process. Manufactured on a glass substrate. Then, the glass substrate is transferred to the surface polishing step through a cleaning step and an inspection step arranged after the chamfering step, and is manufactured into a glass substrate having a product thickness here. These processes are often performed in one line from the viewpoint of production efficiency, but in the case of one-piece production, a glass substrate may be brought into each apparatus for processing.

  By the way, in the above-mentioned glass substrate cutting process or chamfering process, the size of the glass substrate after processing is determined when searching for the conditions of the cutting device or the chamfering processing apparatus accompanying the job change or the replacement of the cutter or the chamfering grindstone. Measurement is performed, and a condition search of the processing apparatus is performed based on the dimensions. Moreover, the dimension measurement of the glass substrate after a process is implemented also in the periodic sampling inspection.

  Conventionally, dimensional measurement of a glass substrate has been performed manually using a caliper or a dial gauge after taking out the processed glass substrate from a processing apparatus. However, in such a manual measurement method, a large-sized glass substrate in recent years is used. As the process becomes easier, workability deteriorates and the measurement takes a long time, so that there is a problem that the working efficiency of the process is lowered and the measurement error is increased. In particular, when searching for the conditions of a cutting device or chamfering device due to job change, cutter or chamfering wheel replacement, it is rare to end with a single dimension measurement, and several measurements are required. The reduction in work efficiency due to the increase in size of the substrate is remarkable. Furthermore, glass substrates to be dimensioned cannot be denied that the surface is wrinkled when being taken out of the processing equipment or measured by the dimension device, and glass substrates with wrinkles are discarded depending on the degree of wrinkles. There was a case that I had to.

  Patent Document 1 discloses a dimension measuring device that solves the above-mentioned problems. The dimension measuring apparatus includes a light source that irradiates the glass substrate surface on a glass inspection table that supports the glass substrate in an inclined posture, and an imaging unit that includes a camera that images a region irradiated by the light source. Yes. Further, a head moving unit that allows the head having the imaging unit to move in both directions of the XY axes, a head position detecting unit that can detect the XY coordinates of the head, and an image of the peripheral edge portion of the glass substrate imaged by the camera are processed. An image processing device, and an arithmetic processing device for calculating and measuring the dimensions of the glass substrate based on the position information of the XY axes by the head position detecting means and the peripheral edge position coordinate information of a plurality of locations of the glass substrate calculated by the image processing device. ing.

JP 2007-205724 A

  However, although the accuracy of the glass substrate dimension measuring apparatus of Patent Document 1 is improved, the glass substrate processed for the condition search is taken out from the processing apparatus and transported to the dimension measuring apparatus of Patent Document 1. It takes several hours to measure its dimensions. Therefore, since the processing apparatus is stopped while measuring the dimensions, the problem that the operation efficiency of the processing apparatus is poor has not been solved.

  The present invention has been made in view of such circumstances, and provides a glass substrate processing method and apparatus capable of reducing the time spent measuring the dimensions of the glass substrate and improving the operating efficiency of the processing apparatus. For the purpose.

  In order to achieve the above object, the present invention comprises a step of measuring an external dimension of a rectangular glass substrate processed by a glass substrate processing apparatus using a dimension measuring apparatus disposed in the processing apparatus. A method for processing a substrate is provided.

  In order to achieve the above object, the present invention provides a processing apparatus for a glass substrate, which is a processing apparatus for a rectangular glass substrate, and includes a dimension measuring apparatus for measuring the outer dimensions of the glass substrate.

  According to this invention, the dimension measuring apparatus was arrange | positioned at the processing apparatus of a glass substrate, and the glass substrate processed with this processing apparatus was measured with the said dimension measuring apparatus. That is, since the external dimensions of the glass substrate are measured in the machine of the processing apparatus without taking out the glass substrate from the processing apparatus, it is possible to eliminate the above-described problems of Patent Document 1. Therefore, the time spent for measuring the dimensions of the glass substrate can be greatly shortened, and the operating efficiency of the processing apparatus is improved.

  Moreover, in this invention, the processing apparatus of a glass substrate has a chamfering means and a positioning means, and a glass substrate and the said chamfering means are moved relatively to the direction of the 2 sides which the said glass substrate opposes. It is preferable that the chamfering apparatus chamfers the glass substrate. The external dimension of the glass substrate before chamfering positioned by the positioning means arranged on the upstream side of the chamfering processing apparatus or the positioning means provided in the chamfering processing apparatus is measured by the dimension measuring apparatus. Is displayed. Thereby, the operation | work which measures the glass substrate processed with the cutting device which is a front process with another measuring apparatus can be omitted, and the operating efficiency of a glass substrate processing apparatus improves more. Further, it is possible to reduce the occurrence of a problem that the glass substrate is wrinkled.

  Moreover, in this invention, you may measure the external dimension of the glass substrate after a chamfering process with the said dimension measuring apparatus.

  When a dimension measuring device is installed in the chamfering machine and the external dimensions of the glass substrate after chamfering are measured and displayed, the external dimensions of the glass substrate after chamfering are different. The work of measuring with the measuring device can be omitted, and the operation efficiency of the chamfering device is further improved. Further, it is possible to reduce the occurrence of a problem that the glass substrate is wrinkled.

  In short, the dimensions of the cut product and the chamfered product may be measured at the same point, and the respective dimensions may be displayed, or the difference may be calculated to display the grinding allowance that is the chamfer amount. Accordingly, the condition search can be completed in the chamfering apparatus without taking out the glass substrate from the processing apparatus and measuring the dimensions. Moreover, when the dimension of the displayed chamfered product is measured, the additional processing amount of the chamfering grindstone of the chamfering means with respect to the glass substrate can be adjusted based on the measurement result.

  Further, in the present invention, the chamfering apparatus includes a deviation amount calculating unit, and the positional deviation amount of the glass substrate from the position of the glass substrate set based on the dimension measured by the deviation amount calculating unit. It is preferable to perform chamfering by the chamfering means after calculating and positioning the glass substrate at the set position of the glass substrate based on the positional deviation amount by the positioning means.

  In a preferred aspect of the present invention described above, based on the dimensions of the glass substrate measured by the dimension measuring device, the amount of positional deviation from a preset position of the glass substrate is calculated by the amount of deviation calculating means, and the calculated positional deviation is calculated. When the positioning means positions the glass substrate at the set position based on the amount, the additional adjustment amount of the positioning roller can be easily changed (automatic adjustment by servo), and the chamfering means Chamfering can be performed after position correction.

  In the present invention, the dimension measuring device is attached so as to be movable integrally with the chamfering means, and in the direction of two sides of the glass substrate facing the glass substrate, It is preferable that the dimension of the glass substrate is measured by relatively moving the chamfering means integrally.

  In the above preferred embodiment of the present invention, the dimension measuring device is attached so as to be able to move integrally with the chamfering means that is relatively moved in the directions of the two opposing sides of the glass substrate, The dimension of a glass substrate is measured by moving relatively. For example, in the case of chamfering by moving the chamfering means with respect to the glass substrate, the moving means of the chamfering means can also be used as the moving means of the dimension measuring device, thus simplifying the overall apparatus configuration. it can.

  According to the glass substrate processing method and apparatus therefor according to the present invention, the dimension measuring device is arranged in the glass substrate processing device, and the external dimensions of the glass substrate processed by this processing device are set in the processing device. Since it measured with the apparatus, the time spent measuring the dimension of a glass substrate can be reduced significantly and the operating efficiency of a processing apparatus can be improved.

Operation | movement explanatory drawing of the chamfering processing apparatus by which the dimension measuring apparatus of 1st Embodiment is arrange | positioned Block diagram showing the configuration of the dimension measuring apparatus of FIG. Operation | movement explanatory drawing of the chamfering processing apparatus by which the dimension measuring apparatus of 2nd Embodiment is arrange | positioned

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Dimension measuring apparatus, 12 ... Chamfering processing apparatus, 13 ... Processing part, 14, 16 ... Chamfering grindstone, 18, 20 ... Length measuring sensor, 22 ... Spindle, 24 ... Dolly, 26 ... Piston, 28 ... Spindle, DESCRIPTION OF SYMBOLS 30 ... Carriage, 46 ... Air cylinder, 48 ... Drive part, 50 ... Air supply mechanism, 52 ... Control means, 54 ... Air cylinder, 56 ... Drive part, 58 ... Air supply mechanism, 60 ... Suction table, 62 ... For positioning Roller, 64 ... arithmetic unit, 66 ... display means, 68 ... suction table drive unit, 69 ... positioning roller drive unit, 80 ... dimension measuring device, 82 ... positioning device, 84, 86 ... length measuring sensor.

  Hereinafter, preferred embodiments of a glass substrate processing method and apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a plan view in which a dimension measuring device 10 according to the first embodiment is arranged on a chamfering device 12. This dimension measuring device 10 is a device that measures the vertical and horizontal width dimensions of a glass substrate G that is cut into a rectangular shape and flows through the chamfering processing device 12 before and after the chamfering processing. It is installed in the machine of a chamfering machine 12 that chamfers the edges of the four sides of G. In addition, although embodiment demonstrates the dimension measuring apparatus 10 installed in the chamfering apparatus 12, it is not limited to this, The glass substrate G folding apparatus, The washing | cleaning apparatus of the back | latter stage of a chamfering apparatus The dimension measuring apparatus 10 may be installed in the inspection apparatus and the surface polishing apparatus following the inspection apparatus. That is, as long as it is a processing apparatus for the glass substrate G, the dimension measuring apparatus 10 according to the embodiment can be installed in any processing apparatus. Here, the glass substrate G that flows through the processing apparatus may be a glass substrate G that is flowing in the processing apparatus along a processing step, or may be a glass substrate G that is separately charged into the processing apparatus. In the embodiment, the long side direction of the glass substrate G is defined as vertical, and the short side direction is defined as horizontal.

  The glass substrate G shown in FIG. 1 has a regular position, that is, two sides of the glass substrate G are chamfered grindstones 14 and 16 by the positioning roller 62 of the positioning means 82 disposed in the processing unit 13 of the chamfering processing device 12. Is positioned at a position that is parallel to the chamfering movement paths A and B without being inclined, and is sucked by the suction table 60 and fixed to the suction table 60. The positioning roller 62 is placed on a carriage 24, 30, 38, 44 on which the spindles 22, 28, 36, 42 of the chamfering grindstones 14, 16, 34, 40 are mounted via a positioning roller driving unit 69 (see FIG. 2). Installed. The installation location of the positioning roller 62 is not limited to the carriages 24, 30, 38, and 44. When the glass substrate G is installed and positioned below the suction table 60 at a predetermined position where the glass substrate G can be positioned, The positioning roller 62 may be lowered below the suction table after the glass substrate G is sucked by the suction table 60 after being lifted to a position where it can be positioned. After that, in the processing section 13, the vertical and horizontal dimensions before chamfering and the vertical and horizontal dimensions after chamfering are measured by a pair of length measuring sensors arranged oppositely across the glass substrate G, for example, contact type length measuring sensors 18 and 20. Measured. Note that a non-contact type length measuring sensor such as a laser meter may be used instead of the contact type length measuring sensor.

  The length measuring sensors 18 and 20 are installed on the carriages 24 and 30 on which the spindles 22 and 28 of the chamfering grindstones 14 and 16 are mounted via the air cylinders 46 and 54, respectively. It is attached to the tip of pistons 26 and 32. The carriages 24 and 30 have their home positions at the positions indicated by two-dot chain lines in FIG. 1, and are linearly moved from the positions along the movement paths A and B to the positions indicated by the solid lines by the drive units 48 and 56 in FIG. The By this moving operation, the positions of the two vertical sides of the glass substrate G are measured by measuring the four points (P1, P1 ′, P2, P2 ′) of the length measuring sensors 18 and 20, and the dimensions of the horizontal sides are measured based on the measurement data. Is calculated. In addition to this measuring operation, the chamfering grindstone 14 can also chamfer the first vertical side of the glass substrate G by this moving operation.

  As shown in FIG. 2, the air cylinder 46 to which the length measuring sensor 18 is attached is connected to an air supply mechanism 50, and the air supply to the air cylinder 46 by the air supply mechanism 50 is controlled by the control means 52. . When the glass substrate G is positioned and sucked at the chamfering position, the control means 52 controls the air supply mechanism 50 so that air is supplied to the air cylinder 46 at the home position in FIG. Thereby, the piston 26 is extended, and the length measurement sensor 18 is brought into contact with the first measurement point P1 (upper side-right side portion in FIG. 1) of the first long side portion of the glass substrate G. Next, when the sensing at the first measurement point P <b> 1 ends, the control unit 52 controls the air supply mechanism 50 to contract the piston 26. Thereafter, the control means 52 controls the drive unit 48 to move the carriage 24 along the movement path A, and the carriage 24 moves when it reaches the second measurement point P2 (upper side-left side in FIG. 1) indicated by a solid line. Stop. Thereafter, the control means 52 controls the air supply mechanism 50 so as to supply air to the air cylinder 46. Accordingly, the piston 26 is extended, and the length measurement sensor 18 is brought into contact with the second measurement point P2 on the first vertical side of the glass substrate G.

  Note that the measurement operation of the length measurement sensor 20 is the same as that of the length measurement sensor 18 and is therefore omitted. 2 is an air supply mechanism of the air cylinder 54, and 56 is a drive unit of the carriage 30. The first measurement point of the length measuring sensor 20 is P1 ', and the second measurement point is P2'.

  On the other hand, when measuring the dimension of the vertical side of the glass substrate G and chamfering the horizontal side, the glass substrate G is rotated 90 degrees in FIG.

  Reference numerals 34 and 40 are corner chamfering grindstones. The spindles 36 and 42 of the grindstones 34 and 40 are mounted on the carriages 38 and 44, and the carriages 38 and 44 are moved along the corners of the glass substrate G, whereby the corner portions of the glass substrate G are chamfered.

  Next, the operation of the dimension measuring apparatus 10 configured as described above will be described.

  As shown in FIG. 1, when the glass substrate G is positioned by the positioning rollers 62, 62... In the processing unit 13 of the chamfering processing device 12, the first measurement points P <b> 1, P <b> 1 ′ by the length measuring sensors 18, 20. Sensing at is performed. Thereafter, the length measuring sensors 18 and 20 are moved together with the chamfering grindstones 14 and 16 toward the second measurement points P2 and P2 ′ by the driving units 48 and 56, and sensing at the second measurement points P2 and P2 ′ is performed. Is called.

  The four measurement data from the length measuring sensors 18 and 20 are output to the control means 52 shown in FIG. 2, and the control means 52 calculates the dimension of the horizontal side of the glass substrate G by the calculation unit 64 based on these measurement data. The result is displayed on the display means 66.

  When the measurement of the horizontal side dimension is completed, the control unit 52 controls the suction table driving unit 68 to rotate the suction table 60 by 90 degrees, and acquires the dimension of the vertical side of the glass substrate G by the method described above. Display. Thereby, the vertical and horizontal dimensions of the glass substrate G before chamfering are measured.

  Next, the chamfering grindstones 14 and 16 chamfer the vertical and horizontal sides of the glass substrate G. This chamfering may be performed by a known chamfering method. In this embodiment, one chamfering grindstone is described per side. However, two or more chamfering grindstones may be provided on one side to improve the surface roughness.

  When the chamfering is completed, the vertical and horizontal dimensions of the glass substrate G after the chamfering are obtained by the method described above. Then, the vertical and horizontal dimensions of the glass substrate G after the chamfering process are divided from the vertical and horizontal dimensions of the glass substrate G before the chamfering process, a grinding allowance as a chamfering amount is calculated, and this is displayed on the display means 66. Thereby, the measured value of the grinding allowance can be confirmed. When the actual measurement value is away from the target value, the control means 52 controls the additional processing amount of the chamfering grindstones 14 and 16 with respect to the glass substrate G so as to approach the target value. Moreover, the additional processing amount with respect to the glass substrate G of the chamfering grindstones 14 and 16 can be adjusted in real time based on the vertical and horizontal dimensions after the chamfering.

  Thus, according to the dimension measuring apparatus 10 of the embodiment, the dimension measuring apparatus 10 is installed in the machine of the chamfering processing apparatus 12, and the vertical and horizontal dimensions of the glass substrate G before the chamfering processing are measured and the chamfering processing is performed. The subsequent vertical and horizontal dimensions were measured, and those dimensions were displayed. Therefore, it is possible to omit the work of taking out the glass substrate for dimension measurement from the chamfering processing line and measuring the dimension of the glass substrate with another dimension measuring device as before, so that the time spent for measuring the dimension of the glass substrate G is shortened. The operating efficiency of the chamfering apparatus can be improved. In addition, it is possible to reduce the occurrence of defects such as wrinkles on the glass substrate G whose dimensions are measured, and it is possible to reduce production loss.

  In short, the dimension measuring apparatus 10 according to the embodiment can complete the condition search in the chamfering apparatus without taking out the glass substrate G from the chamfering apparatus 12 and measuring the dimensions repeatedly until the condition can be obtained. .

  In addition, since the length measuring sensors 18 and 20 of the dimension measuring apparatus 10 according to the embodiment are attached to the carriages 24 and 30 of the chamfering grindstones 14 and 16 that are moved with respect to the edge of the glass substrate G, the chamfering is performed. The carriages 24 and 30 of the grindstones 14 and 16 can also be used as moving means for the length measuring sensors 18 and 20. Therefore, the overall configuration of the dimension measuring apparatus 10 is simplified.

  In the procedure of the above embodiment, the vertical and horizontal dimensions of the glass substrate G before chamfering are measured, then chamfering on four sides is performed, and finally the vertical and horizontal dimensions of the glass substrate G after chamfering are calculated. Although described as measuring, it is not limited to this procedure.

For example, the length measuring sensors 18 and 20 are brought into contact with the vertical sides of the glass substrate G before chamfering processing to acquire the horizontal side dimensions, and then the vertical chamfering processing of the vertical sides of the glass substrate G is performed on the chamfering grindstone 14. , 16, and then the length measuring sensors 18 and 20 are brought into contact with the vertical side after the chamfering process to acquire the horizontal side dimension, thereby obtaining the grinding allowance of the vertical side. Then, the glass substrate G is rotated by 90 degrees, and according to the above procedure, the length measuring sensors 18 and 20 are brought into contact with the horizontal sides of the glass substrate G before chamfering processing, and the dimensions of the vertical sides are obtained. By chamfering the lateral sides of the glass substrate G with the chamfering grindstones 14 and 16, and then measuring the longitudinal sides by contacting the length measuring sensors 18 and 20 with the lateral sides after the chamfering. You may make it acquire the grinding allowance of a horizontal side. In addition, as described in the present embodiment, vertical and horizontal dimension measurement and chamfering may be carried out with one chamfering machine 12, but another chamfering machine is provided at two positions. It is efficient to perform vertical and horizontal dimension measurement and chamfering.
Furthermore, a length measuring sensor may be attached to the carriages 38 and 44 on which the corner-exclusive chamfering stones 34 and 40 are mounted. Although the number of measuring sensors increases, the sensing operation can be shortened because the sensing operation only needs to be performed once.

  In the above embodiment, the case of measuring the dimensions of both the chamfered glass substrate before and after chamfering is described. However, in order to adjust the processing accuracy of the folding machine, the dimensions of only the glass substrate before chamfering are measured. Alternatively, only the dimension of the glass substrate after chamfering may be measured in order to adjust the processing accuracy of the chamfering apparatus.

  FIG. 3 is a plan view showing a dimension measuring apparatus 80 according to the second embodiment.

  In the first embodiment, the configuration and operation in the case of performing chamfering by moving the chamfering grindstones 14 and 16 are described in detail, but in the second embodiment, the chamfering grindstones 14 and 16 are fixed, The case where chamfering is performed by moving the glass substrate G relative to the chamfering grindstones 14 and 16 in the direction of two opposing sides of the glass substrate G will be described in detail. This dimension measuring device 80 is provided with a positioning means 82 on the upstream side of the processing portion 13 of the chamfering processing device 12 with respect to the dimension measuring device 10 shown in FIG. 1, and between the chamfering processing device 12 and the positioning means 82. 1 is structurally different in that a pair of length measuring sensors 84 and 86 are provided facing each other.

The glass substrate G is positioned by the positioning rollers 62, 62... Of the positioning means 82 on the upstream side of the processing unit 13 of the chamfering processing device 12, is suction fixed by the suction table 60, and then moves the suction table 60. Thus, the glass substrate G is conveyed to the processing unit 13. While the glass substrate G is being transported, the dimension measuring device 80 is positioned at the upstream side in the transport direction of the glass substrate G indicated by the two-dot chain line in FIG. (Not shown), the length measurement sensor 84 is brought into contact, and the length measurement sensor 86 is brought into contact with the second measurement point P2 ′ (not shown) on the second vertical side. Then, the glass substrate G is further conveyed, and the length measurement sensor 84 is brought into contact with the second measurement point P2 on the first vertical side at the position downstream of the conveyance direction of the glass substrate G indicated by the solid line, and the second The length measurement sensor 86 is brought into contact with the first measurement point P1 ′ on the vertical side of the dimension to measure the dimension. Thereafter, the glass substrate G is transported to the processing unit 13, and the chamfering process is performed by moving the glass substrate G relative to the chamfering grindstones 14 and 16. After chamfering the glass substrate G, the glass substrate G is conveyed again to the positioning device side, that is, upstream, the length measuring sensor 84 is brought into contact with the second measurement point P2 on the first vertical side, and the second vertical The length measurement sensor 86 is brought into contact with the first measurement point P1 ′ on the side, the glass substrate G is further conveyed upstream, the length measurement sensor 84 is brought into contact with the first measurement point P1 on the first vertical side, The length measurement sensor 86 is brought into contact with the second measurement point P2 ′ on the second vertical side to perform dimension measurement. When the length measurement sensor is brought into contact with the second measurement point P2 on the first vertical side and the first measurement point P1 ′ on the second vertical side, the glass substrate G may be transported but stopped. It is preferable because the accuracy is high. In the second embodiment, one chamfering grindstone is described for one side, but two or more chamfering grindstones may be provided on one side to improve the surface roughness. In addition, the vertical and horizontal dimension measurement and chamfering may be performed by rotating the glass substrate G 90 degrees with one chamfering processing device 12, but another chamfering processing device is provided, and two positions are provided. It is efficient to perform vertical and horizontal dimension measurement and chamfering. In that case, the corner-specific chamfering grindstone may be provided downstream of each chamfering device, but a position for performing only corner chamfering processing may be provided downstream of each of the vertical and horizontal chamfering devices.
In addition to the pair of length measuring sensors 84 and 86, a pair of length measuring sensors are provided opposite to each other, and the four length measuring sensors are simultaneously brought into contact with all four measurement points to measure the dimensions. You may make it do.

  Here, the positioning operation of the glass substrate G by the positioning means 82 will be described. First, air is ejected from the air ejection holes of the suction table 60 to float the glass substrate G on the suction table 60. In this state, the glass substrate positioning roller 62 provided in the previous stage of the chamfering process is moved to the glass substrate. The glass substrate G is moved in contact with the edge of G, and the glass substrate G is positioned at a preset position. Next, when the positioned glass substrate G is sucked by the suction table 60, the positioning roller 62 is retracted from the glass substrate G at the same time or after the suction. The above is the positioning operation. Thereafter, the glass substrate G is chamfered.

  In the embodiment, two positioning rollers 62 are arranged in parallel with each other in the conveying direction. However, even if one side is pressed at one point and the other side is pressed at two points, positioning is performed at a total of three points. Good. For positioning in the transport direction, positioning rollers may be arranged before and after the transport direction. As long as the glass substrate G can be positioned, the number of positioning rollers and the arrangement position are not limited.

  The material of the positioning roller 62 constituting the positioning means is made of resin, metal, or rubber. However, even when any material is selected, it is worn out by long-term use. When the wear amount increases, the positioned glass substrate G is inclined (inclined from the normal position) by the wear amount, although the positioning roller 62 attempts to position the normal position. When chamfering is performed in this inclined state, the traveling paths A and B of the chamfering grindstones 14 and 16 with respect to the edge of the glass substrate G are inclined, so that the chamfering allowance is small in some parts and the chamfering allowance is large in other parts. As a result, there arises a problem that the chamfering quality deteriorates.

  Therefore, in the embodiment, the calculation unit (deviation amount calculation means) 64 shown in FIG. 2 calculates the positional deviation amount from the preset position of the glass substrate G based on the positional information of the length measurement sensor, Based on the amount of displacement, the control means 52 changes the additional adjustment amount of the positioning roller 62 and positions the glass substrate G at the set position. That is, since the inclination amount of the glass substrate G is calculated by measuring two edges of one side of the glass substrate G (two-side four-point measurement), the inclination amount is corrected when the inclination amount exceeds the threshold value. Thus, the additional adjustment amount of the positioning roller 62 is changed. Specifically, the control means 52 controls the positioning roller drive unit (servo motor) 69 to perform automatic adjustment. As a result, the chamfer allowance becomes uniform and the processing quality is improved. Thus, even when the positioning roller 62 is worn, the position after positioning can be grasped and adjusted in the apparatus, so that the production efficiency is improved.

In another embodiment, chamfering and dimension measurement may be performed one side at a time, or two sides may be performed simultaneously, but it is preferable to perform two sides at the same time because processing efficiency is better.
Furthermore, when a glass substrate is fixed and a chamfering grindstone is conveyed, four sides may be simultaneously used.

Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application No. 2008-080269 filed on Mar. 26, 2008, the contents of which are incorporated herein by reference.

Claims (9)

  A method for processing a glass substrate, comprising a step of measuring an external dimension of a rectangular glass substrate processed by a processing apparatus for a glass substrate by a dimension measuring device arranged in the processing apparatus.   The glass substrate processing apparatus includes chamfering means and positioning means, and the glass substrate and the chamfering means are moved relative to each other in the direction of the two opposing sides of the glass substrate. 2. The glass substrate processing method according to claim 1, wherein the glass substrate is a glass substrate before chamfering in which the glass substrate is positioned by the positioning unit.   The chamfering apparatus includes a deviation amount calculation unit, the deviation amount calculation unit calculates a positional deviation amount of the glass substrate from a position of the glass substrate set based on the measured dimension, and the positioning unit The glass substrate processing method according to claim 2, wherein the chamfering is performed by the chamfering unit after the glass substrate is positioned at the set position of the glass substrate based on the positional deviation amount.   The glass substrate processing apparatus has chamfering means, and the glass substrate and the chamfering means are chamfered by moving the glass substrate relative to each other in the direction of two opposing sides of the glass substrate. The glass substrate processing method according to claim 1, wherein the glass substrate is a chamfered glass substrate measured by the dimension measuring device.   5. The dimension of the glass substrate is measured by moving the dimension measuring device and the chamfering unit integrally in the direction of two sides of the glass substrate facing the glass substrate. The processing method of the glass substrate in any one of. A processing apparatus for a rectangular glass substrate,
A glass substrate processing apparatus comprising a dimension measuring device for measuring an outer dimension of the glass substrate.   The glass substrate processing apparatus has chamfering means, and the glass substrate and the chamfering means are chamfered by relatively moving the glass substrate and the chamfering means in the direction of two opposing sides of the glass substrate. The glass substrate processing apparatus according to claim 6, which is a chamfering apparatus. Based on the dimensions of the glass substrate measured by the dimension measuring device, a deviation amount calculating means for calculating a positional deviation amount from the set position of the glass substrate;
Positioning means for positioning the glass substrate at the position based on the positional deviation amount calculated by the deviation amount calculating means, and the chamfering means performs the chamfering after positioning the glass substrate by the positioning means. The processing apparatus of the glass substrate of Claim 7 to perform.   The glass substrate processing apparatus according to claim 7 or 8, wherein the dimension measuring apparatus is attached so as to be movable integrally with the chamfering means.

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