200948536 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種玻璃基板之加工方法及其裝置，本發 明特別係關於一種對用於FPD(Flat Panel Display，平板顯 示器）中之矩形玻璃基板進行去角加工之玻璃基板之加工 方法及其裝置。 【先前技術】 液晶顯示器或電漿顯示器等FPD用玻璃基板係於切斷步 驟中將板玻璃切斷加工為特定之矩形大小，並於去角步驟 中對其端緣部進行去角加工，藉此製成產品外形尺寸之玻 璃基板。接著，該玻璃基板經過位於去角步驟之後段之清 洗步驟、及檢查步驟後被轉移到表面研磨步驟，於此製成 產品厚度之玻璃基板。再者，自生產效率之觀點考慮該等 步驟大多係於-條生產線上進行，當生產一件產品時，亦 存在將玻璃基板裝入各裝置令進行加工之情形。 然而，上述玻璃基板之切斷步驟或去角步驟中，於伴隨 任務改變或者切割器或去角磨石之更換而探索切斷裝置或 去角加工裝置之條件時’係敎加工後之玻璃基板之尺 寸’並根據該尺寸來探索加工裝置之條件。又，於定期之 抽樣：查中亦實施加工後之玻璃基板之尺寸測定。 先前’玻璃基板之尺寸測定係自加U中取出加工後 之玻璃基板’並使用游標卡尺或針盤量規藉由人工而實施 測定，但隨著近年來破璃基板之大型化，如此之人工測定 方法之作業性變差，料會㈣較長時間，因此存在加工 139403.doc 200948536 之運轉效率下降、且測定誤差亦增大之問題…特別係 於伴隨任務改變或者切割器或去角磨石之更換而探索切斷 裝置或去角加王裝置之條件時’進行—次尺寸敎便完事 之情形較少，必需進行多次測定，故而伴隨㈣基板之大 型化，作業效率顯著降低。進而，將要進行尺寸測定之玻 璃基板自加卫裝置巾搬糾或於尺寸敎裝置巾測定時， 表面上會不可避免地帶有瑕疵，帶有瑕疵之玻璃基板有時 會根據瑕疫之程度而不得不廢棄。 於專利文獻1中揭示有解決上述不良情況之尺寸測定裝 置°亥尺寸測疋裝置於使玻璃基板以傾斜姿勢受到支撐之 玻璃檢查臺上具備攝像機構，該攝像機構包括：光源，其 照射玻璃基板面；以及相機，其對該光源所照射之區域進 行攝像。又，上述尺寸測定裝置包括：頭部移動機構，其 使具有該攝像機構之頭部於又丫轴兩方向上自如移動；頭 部位置檢測機構，其自如檢測頭部之χγ座標；圖像處理 裝置，其對由相機所攝像之玻璃基板周邊端緣部之圖像進 行處理；以及運算處理裝置，其根據由頭部位置檢測機構 所檢測之ΧΥ轴之位置資訊、及由圖像處理裝置計算之玻 璃基板之複數個部位的周邊端緣位置座標資訊，對玻璃基 板之尺寸進行運算測定。 [專利文獻1]日本專利特開2007-205724號公報 【發明内容】 [發明所欲解決之問題] 然而’專利文獻1之玻璃基板之尺寸測定裝置雖然提高 139403.doc 200948536 I:二=係為進行條件探索而自加工裝置中取出加工 璃基板，並將該破璃基板㈣至專利文獻i之尺寸 測定裝置後進行測定，因此 小時1此，測定尺寸之期寸4止需要數個 寸之期間加工裝置處於停止狀態，故 而並未解決加卫裝置之運轉效率較低之問題。 本發明係鑒於如此之情形研製而成者，其目的在於提供 :種可縮短玻璃基板之尺寸測定所耗費之時間，從而可提 咼加工裝置之運轉效率的玻璃基板之加工方法及其裝置。 [解決問題之技術手段] 為達成上述目的，本發明提供一種玻璃基板之加工方 法，其包括如下步驟：藉由配置於玻璃基板之加工裝置中 之尺寸敎裝置，而測^由上述加工裝置所加R矩形玻 璃基板的外形尺寸。 為達成上述目的，本發明提供一種玻璃基板之加工裝 置’其係矩形玻璃基板之加工裝置，i包括測定上述玻璃 基板之外形尺寸之尺寸測定裝置。 根據本發明，將尺寸測定裝置配置於玻璃基板之加工裝 置中，並藉由上述尺寸測定裝置而測定由該加工裝置所加 工之玻璃基板。即，無需自加工裝置中取出玻璃基板，於 加工裝置之裝置内便可測定玻璃基板之外形尺寸，因此可 消除專利文獻1中產生的上述不良情形。由此，可大幅縮 短玻璃基板之尺寸測定所耗費之時間，從而可提高加工裝 置之運轉效率。 又’本發明中’較好的是玻璃基板之加工裝置係如下之 139403.doc 200948536 去角加工裝置’該去角加工裝置具有去角機構及定位機 構，其藉由使玻璃基板與上述去角機構於上述玻璃基板之 相對向的兩邊之方向上相對移動而對玻璃基板進行去角。 由配置於去角加工裝置之上游側之定位機構、或由去角加 工裝置所具備之定位機構定位之去角加工前之玻璃基板的 外形尺寸係藉由上述尺寸測定裝置而測定，並顯示測定結 果。藉此’可省去利用其他測定裝置來測定由前步驟之切 斷裝置所加工過之玻璃基板的作業，從而可進一步提高玻 ® 璃基板加工裝置之運轉效率。又，可減少玻璃基板上帶有 瑕疵之不良情形之產生。 又，本發明中，亦可藉由上述尺寸測定裝置而測定去角 加工後之玻璃基板之外形尺寸。 於去角加工裝置之裝置内設置有尺寸測定裝置，對去角 加工後之玻璃基板之外形尺寸進行測定後顯示測定結果， t*時可省去藉由其他測定裝置而測定去角加工後之玻璃基 ❷ 板之外形尺寸的作業，從而進-步提高去角加工裝置之運 轉效率X，可減少玻璃基板上帶有瑕疲之不良情形之產 生。 ’ t而5之’可於相同點測定切斷品、去角後品之尺寸並 * 。各自之尺寸，亦可計算其差分後顯示作為去角量之研 削知，。由此，無需自加工裝置中取出玻璃基板來進行尺 二”’亦可於去角加工裝置内完成條件探索。又，當測 :顯不之去角後品之尺寸時亦可根據測定結果來調 整去角機構之去角磨石對玻璃基板的追加加工量。 139403.doc 200948536 進而，本發明中較好的是上述去角加工裝置包括偏移量 β十算機構，上述偏移量計算機構根據所測定之上述尺寸計 算玻璃基板自所設定之玻璃基板之位置起的位置偏移量， 藉由上述定位機構根據該位置偏移量而將玻璃基板定位於 上述設定之玻璃基板之位置上，之後藉由上述去角機構而 進行去角加工。 上述本發明之較佳態樣中，根據由尺寸測定裝置所測定 出之玻璃基板之尺寸，藉由偏移量計算機構而計算玻璃基 板自預設位置之位置偏移量，且定位機構根據所計算之位 置偏移量而將玻璃基板定位於設定位置上，此時可簡便地 變更定位用輥之追加調整量（利用伺服來自動調節），且去 角機構可於定位機構對玻璃基板之位置進行了修正後進行 去角加工。 又，本發明較好的是上述尺寸測定裝置係安裝為可與上 述去角機構-體移動’使上述尺寸測定裝置與上述去角機 構一體地相對於玻璃基板而於玻璃基板之相對向的兩邊方 向上相對移動，藉此來測定玻璃基板之尺寸。 上述本發明之較佳態樣中，以可與去角機構一體地於玻 璃基板之相對向的兩邊方向上相對移動之方式來安裝尺寸 測定裝置’錢尺寸敎裝置相料玻璃基板而相對移 動，藉此來測定玻璃基板的尺寸1如，於使去角機構相 對於玻璃基板移動而進行去角加卫之形態之情形時，可將 去角機構之移動機構兼用做尺寸測定裝置之移動機構，因 此可簡化裝置全體之構成。 139403.doc 200948536 [發明之效果] 根據本發明之玻璃基板之加工方法及其裝置，藉由將尺 寸測定裝置配置於玻璃基板之加工裝置中，並利用設置於 加工裝置中之尺寸測定裝置來測定由該加工裝置所加工之 玻璃基板的外形尺寸，因此可大幅度縮短玻璃基板之尺寸 測疋所耗費之時間，從而可提高加工裝置之運轉效率。 【實施方式】 以下，按照附圖對本發明之實施形態之玻璃基板之加工 方法及其裝置的較佳形態進行詳細說明。 圖1係表示於去角加工裝置12中配置有第i實施形態之尺 寸測疋裝置ίο之平面圖。該尺寸測定裝置1〇係測定被切斷 加工為矩形且經過去角加工裝置12之玻璃基板G之去角加 工蝻、及去角加工後之縱橫寬度尺寸的裝置，其設置於對 玻璃基板G之縱橫四邊之端緣進行去角加工之去角加工裝 置12的裝置内。再者，實施形態中對設置於去角加工裝置 12中之尺寸測定裝置10進行說明，但並不限定於此，亦可 於玻璃基板G之切斷加工裝置、去角加工鼓置之後段之清 洗裝置、檢查裝置、檢查裝置之後段的表面研磨裝置中設 置該尺寸測定裝置10。即，只要係玻璃基板G之加工裝 置，任何加工裝置之裝置内均可設置實施形態之尺寸測定 裝置10。於此所謂經過加工裝置之玻璃基板G，可為按照 加工步驟而進入加工裝置中之狀態下的玻璃基板G，亦可 為投入其他加工裝置中之玻璃基板G。又，實施形態中， 將玻璃基板G之長邊方向規定為縱向，將短邊方向規定為 139403.doc 200948536 橫向。 圖1所示之玻璃基板G藉由配置於去角加工裝置i2之加工 部13中之定位機構82的定位用輥62而定位於標準位置上， 即定位於玻璃基板G之兩邊相對於去角磨石14、16之去角 移動路徑A、B平行而不傾斜的位置上，由吸附台6〇吸附 而固定於吸附台60上。定㈣輥62經由定位用輥驅動部 69(參照圖2)，而分別設置於搭載有去角磨石14、16、34、 40之主軸22、28、36、42的托架24、3〇、38、料上。再 者，定位用輥62之設置場所並不限定於托架24、3〇、％、 44,亦可設置於能夠對破璃基板G進行定位之特定位置之 吸附台60的下方，於進行定位時上升至能夠對玻璃基板g 進行定位之位置來進行定位，其後藉由吸附台6〇而吸附玻 璃基板G之後，使定位用輥62朝向吸附台下方下降。其 後，藉由夾持玻璃基板G而相對向配置於加工部13上之一 對測長感測器、例如接觸式測長感測器18、2〇,而測定玻 璃基板G之去角加工前之縱橫尺寸、及去角加工後之縱橫 尺寸。再者，亦可使用雷射計等非接觸式測長感測器，來 代替接觸式測長感測器。 測長感測器1 8、20經由氣缸46、54而分別設置於搭載有 去角磨石14、16之主轴22、28的托架24、30上，並且安裝 於4氣缸46、54之活塞26、32之前端。托架24、30將圖i 上兩點鏈線所示之位置作為起始位置，自該位置起沿著移 動路徑A、B分別藉由圖2之驅動部48、56而直線移動至實 線所不的位置。藉由該移動動作，而利用測長感測器I 8、 I39403.doc 200948536 20之4點（P1、ΡΓ、P2、P2’）測定來測定玻璃基板g之兩個 縱邊的位置，並根據該測定資料而計算橫邊之尺寸。又， 除了該敎動作之外，亦可藉由該移動動作而利用去角磨 石14來對玻璃基板G之第丨縱邊進行去角。 如圖2所示，安裝有測長感測器18之氣缸46連接於空氣 供給機構50,藉由控制機構52而控制該空氣供給機構5〇對 氣缸46的空氣供給。若玻璃基板〇定位且吸附於去角加工The invention relates to a method and a device for processing a glass substrate, and the invention relates to a rectangular glass substrate for use in an FPD (Flat Panel Display). A method and apparatus for processing a glass substrate subjected to chamfering. [Prior Art] A glass substrate for FPD such as a liquid crystal display or a plasma display is cut into a specific rectangular size in a cutting step, and the edge portion is subjected to chamfering in the chamfering step. This is made into a glass substrate of the outer dimensions of the product. Next, the glass substrate is transferred to a surface grinding step by a cleaning step after the step of the chamfering step and an inspection step, thereby producing a glass substrate having a product thickness. Furthermore, from the viewpoint of production efficiency, most of these steps are carried out on a production line, and when a product is produced, there is also a case where a glass substrate is loaded into each device for processing. However, in the cutting step or the chamfering step of the glass substrate, the glass substrate after the processing is processed when the conditions of the cutting device or the chamfering device are explored along with the change of the task or the replacement of the cutter or the dehorned grindstone. The size 'and explore the conditions of the processing device based on this size. In addition, in the regular sampling: the size of the glass substrate after processing is also measured. Previously, the sizing measurement of the glass substrate was carried out by adding the processed glass substrate from the U, and the measurement was performed manually using a vernier caliper or a dial gauge. However, with the recent enlargement of the glass substrate, such manual measurement The workability of the method is deteriorated, and it is expected that (4) it will take a long time. Therefore, there is a problem that the operation efficiency of the processing 139403.doc 200948536 is lowered, and the measurement error is also increased... especially with the change of the task or the cutter or the dehorning grindstone. When the condition of the cutting device or the dehorning device is changed and replaced, the case where the size is completed is small, and it is necessary to perform a plurality of measurements. Therefore, with the increase in the size of the substrate, the work efficiency is remarkably lowered. Further, when the glass substrate to be subjected to the dimensional measurement is removed from the cleaning device towel or measured in the size of the device, the surface is inevitably carried with flaws, and the glass substrate with the flaw may not be according to the degree of the plague. Not discarded. Patent Document 1 discloses a sizing device that solves the above-described problem. The cymbal measuring device includes an imaging mechanism on a glass inspection table that supports the glass substrate in an inclined posture. The imaging mechanism includes a light source that illuminates the glass substrate. And a camera that images the area illuminated by the light source. Further, the above-described size measuring device includes: a head moving mechanism that freely moves the head having the image capturing mechanism in both directions of the axis; the head position detecting mechanism freely detects the χ γ coordinate of the head; image processing a device for processing an image of a peripheral edge portion of a glass substrate imaged by a camera; and an arithmetic processing device that calculates position information of the x-axis detected by the head position detecting mechanism and is calculated by the image processing device The coordinate information of the peripheral edge position of the plurality of portions of the glass substrate is calculated and measured for the size of the glass substrate. [Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-205724 [Draft of the Invention] [Problems to be Solved by the Invention] However, the size measuring device for a glass substrate of Patent Document 1 is improved by 139403.doc 200948536 I: two = After the conditional search is carried out, the processed glass substrate is taken out from the processing apparatus, and the glass substrate (4) is measured by the size measuring device of Patent Document i. Therefore, the time period of the size measurement is required to be several inches. The processing device is in a stopped state, so the problem that the operating efficiency of the security device is low is not solved. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method and apparatus for processing a glass substrate which can reduce the time required for dimensional measurement of a glass substrate, thereby improving the operational efficiency of the processing apparatus. [Means for Solving the Problems] In order to achieve the above object, the present invention provides a method for processing a glass substrate, comprising the steps of: measuring, by the processing device, by a size device disposed in a processing device of a glass substrate Add the outer dimensions of the R rectangular glass substrate. In order to achieve the above object, the present invention provides a processing apparatus for a glass substrate, which is a processing apparatus for a rectangular glass substrate, and i includes a size measuring device for measuring the outer dimensions of the glass substrate. According to the invention, the dimension measuring device is disposed in a processing apparatus for a glass substrate, and the glass substrate processed by the processing device is measured by the dimension measuring device. In other words, it is not necessary to take out the glass substrate from the processing apparatus, and the outer dimensions of the glass substrate can be measured in the apparatus of the processing apparatus, so that the above-described problems occurring in Patent Document 1 can be eliminated. Thereby, the time taken for the dimensional measurement of the glass substrate can be greatly shortened, and the operation efficiency of the processing apparatus can be improved. Further, in the present invention, it is preferred that the processing apparatus for the glass substrate is 139403.doc 200948536. The cornering processing apparatus has a chamfering mechanism and a positioning mechanism by causing the glass substrate to be chamfered The mechanism relatively moves in the opposite directions of the glass substrate to chamfer the glass substrate. The outer dimensions of the glass substrate before the chamfering process by the positioning mechanism disposed on the upstream side of the chamfering apparatus or the positioning mechanism provided by the chamfering apparatus are measured by the above-described dimension measuring device, and the measurement is displayed. result. By this, the operation of the glass substrate processed by the cutting device of the previous step can be omitted by using another measuring device, and the operating efficiency of the glass substrate processing device can be further improved. Further, it is possible to reduce the occurrence of defects in the glass substrate. Further, in the present invention, the outer dimensions of the glass substrate after the chamfering may be measured by the above-described dimensional measuring device. A dimension measuring device is provided in the device for the chamfering device, and the measurement result is measured after the outer dimension of the glass substrate after the chamfering process, and the measurement result is omitted after the t* processing by the other measuring device. The operation of the outer dimensions of the glass-based slab further improves the operating efficiency X of the chamfering device, thereby reducing the occurrence of defects in the glass substrate. The size of the cut product, the chamfered product, and the * can be measured at the same point. The size of each can also be calculated by the difference and displayed as the amount of degaussing. Therefore, it is not necessary to take out the glass substrate from the processing device to perform the ruler "" or to perform the conditional exploration in the deangulation processing device. Moreover, when measuring: the size of the product after the de-orientation is also determined according to the measurement result. Adjusting the additional processing amount of the dehorning grindstone to the glass substrate. 139403.doc 200948536 Further, in the present invention, it is preferable that the above-described chamfering processing apparatus includes an offset amount β calculating mechanism, and the offset calculating mechanism Calculating a positional deviation amount of the glass substrate from the position of the set glass substrate according to the measured size, and positioning the glass substrate on the set glass substrate according to the positional displacement by the positioning mechanism, Then, the chamfering processing is performed by the above-described chamfering mechanism. In the preferred aspect of the present invention, the glass substrate self-predicting is calculated by the offset calculating mechanism based on the size of the glass substrate measured by the dimension measuring device. The positional displacement amount of the position is set, and the positioning mechanism positions the glass substrate at the set position according to the calculated positional shift amount, and can be easily changed at this time. The additional adjustment amount of the position roller (automatically adjusted by the servo), and the chamfering mechanism can perform the chamfering processing after the position of the glass substrate is corrected by the positioning mechanism. Further, the present invention preferably uses the above-described dimensional measuring device. The size of the glass substrate can be measured by moving the above-described dimension measuring device and the above-described chamfering mechanism integrally with respect to the glass substrate in the opposite directions of the glass substrate. In the above preferred aspect of the present invention, the dimensional measuring device 'money size 敎 device phase glass substrate is relatively moved in such a manner as to be movable relative to the chamfering mechanism integrally in the opposite directions of the glass substrate. Therefore, when the size of the glass substrate 1 is measured, for example, when the chamfering mechanism is moved away from the glass substrate, the moving mechanism of the chamfering mechanism can also be used as the moving mechanism of the dimension measuring device. Therefore, the constitution of the entire apparatus can be simplified. 139403.doc 200948536 [Effects of the Invention] Processing of a glass substrate according to the present invention The method and the device thereof are configured by arranging the dimension measuring device in a processing device for a glass substrate, and measuring the outer dimensions of the glass substrate processed by the processing device by using a dimension measuring device provided in the processing device. The operation time of the processing of the glass substrate can be improved by shortening the time taken for the dimensional measurement of the glass substrate. [Embodiment] Hereinafter, a preferred embodiment of a method for processing a glass substrate and an apparatus thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a dimension measuring device of the i-th embodiment in a chamfering device 12. The measuring device 1 is configured to be cut into a rectangular shape and passed through a chamfering device 12. The apparatus for chamfering the glass substrate G and the vertical and horizontal width dimensions after the chamfering process are provided in the apparatus for the chamfering apparatus 12 which performs the chamfering process of the edge of the longitudinal direction of the glass substrate G. Further, in the embodiment, the dimension measuring device 10 provided in the chamfering apparatus 12 will be described. However, the present invention is not limited thereto, and may be applied to the cutting device of the glass substrate G or the cornering processing drum. The size measuring device 10 is provided in the surface polishing device in the subsequent stage of the cleaning device, the inspection device, and the inspection device. That is, the size measuring apparatus 10 of the embodiment can be provided in any apparatus of the processing apparatus as long as it is a processing apparatus for the glass substrate G. Here, the glass substrate G that has passed through the processing apparatus may be the glass substrate G in a state in which it enters the processing apparatus according to the processing steps, or may be a glass substrate G that is placed in another processing apparatus. Further, in the embodiment, the longitudinal direction of the glass substrate G is defined as the longitudinal direction, and the short-side direction is defined as the 139403.doc 200948536 lateral direction. The glass substrate G shown in FIG. 1 is positioned at a standard position by the positioning roller 62 of the positioning mechanism 82 disposed in the processing portion 13 of the chamfering device i2, that is, positioned on both sides of the glass substrate G with respect to the chamfering The detouring paths A and B of the grindstones 14, 16 are parallel and not inclined, and are adsorbed by the adsorption stage 6 to be fixed to the adsorption stage 60. The fixed (four) roller 62 is provided on the brackets 24 and 3 of the main shafts 22, 28, 36, and 42 on which the chamfering stones 14, 16, 34, and 40 are mounted, via the positioning roller drive unit 69 (see FIG. 2). , 38, on the material. Further, the installation place of the positioning roller 62 is not limited to the brackets 24, 3〇, %, and 44, and may be provided below the suction stage 60 at a specific position where the glass substrate G can be positioned. At this time, the position is raised to the position where the glass substrate g can be positioned, and then the glass substrate G is adsorbed by the adsorption stage 6〇, and then the positioning roller 62 is lowered toward the lower side of the adsorption stage. Thereafter, the glass substrate G is placed opposite to the length measuring sensor, for example, the contact length measuring sensors 18 and 2, which are disposed on the processing unit 13, thereby measuring the chamfering of the glass substrate G. The vertical and horizontal dimensions of the front and the vertical and horizontal dimensions after the chamfering. Furthermore, a non-contact length measuring sensor such as a laser meter can be used instead of the contact length measuring sensor. The length measuring sensors 18 and 20 are respectively disposed on the brackets 24 and 30 of the main shafts 22 and 28 on which the chamfering stones 14 and 16 are mounted via the air cylinders 46 and 54, and are mounted to the pistons of the four cylinders 46 and 54. 26, 32 front end. The brackets 24 and 30 take the position indicated by the two-dot chain line on the figure i as the starting position, and from the position, the moving paths A and B are linearly moved to the solid line by the driving portions 48 and 56 of Fig. 2, respectively. No location. By the movement operation, the positions of the two longitudinal sides of the glass substrate g are measured by the measurement of four points (P1, ΡΓ, P2, P2') of the length measuring sensors I 8 and I39403.doc 200948536 20, and according to The measurement data is used to calculate the size of the lateral side. Further, in addition to the squeaking operation, the decant grinding wheel 14 may be used to perform chamfering of the longitudinal side of the glass substrate G by the moving operation. As shown in Fig. 2, the cylinder 46 to which the length measuring sensor 18 is attached is connected to the air supply mechanism 50, and the air supply mechanism 5 is controlled by the control mechanism 52 to supply air to the cylinder 46. If the glass substrate is positioned and adsorbed to the cornering process
位置上，則控制機構52以於圖丨之起始位置向氣缸牝供給 空氣之方式來控制空氣供給機構5〇。藉此，活塞26伸長， 測長感測器18抵接於玻璃基板（}之第丨長邊部之第丨測定點 P1(圖1上邊-右侧部”其次，當於第丨測定點P1之測定結束 後，控制機構52控制空氣供給機構5〇而使活塞以收縮。之 後，控制機構52控制驅動部48，使托架24沿著移動路徑a 移動，並於到達實線所示之第2測定點p2(圖〗上邊-左側部） 時使托架24停止移動。接著，控制機構52以向氣缸粍供給 空氣之方式來控制空氣供給機構50 ^藉此，活塞26伸長， 測長感測器1 8抵接於玻璃基板g之第〖縱邊之第2測定點 P2。 -再者，由於測長感測器20之測定動作與測長感測器丨各相 同，故而省去說明。又，圖2之符號58係氣缸54之空氣供 給機構，符號56係托架30之驅動部。測長感測器2〇之第'i 測定點為Ρ Γ，第2測定點為P2'。 另一方面，當進行玻璃基板G之縱邊尺寸測定、及橫邊 去角加工時，只要於圖i中使玻璃基板G轉動9〇度，並重複 139403.doc -11 - 200948536 實施上述動作即可。 符號34、40係轉角專用之去角磨石。該磨石34、40之主 軸36、42搭載於托架38、44上，藉由該托架38、44沿著玻 璃基板G之轉角而移動而對玻璃基板G之轉角部進行去 角。 其次’對以如上所述之方式構成之尺寸測定裝置1〇之作 用加以說明。 如圖1所示，當藉由定位用報62、62…而將玻璃基板G定 位於去角加工裝置12之加工部13時，利用測長感測器18、 2〇於第1测定點P1、P1，進行測定。之後，藉由驅動部鈞、 56而使測長感測器！ 8、2〇與去角磨石i4、16 一併向第2測 疋點P2、P2’移動，於第2測定點p2、p2，進行測定。 一來自測長感測器18、20之四個測定資料將輸出至圖2所 示之控制機構52中，控制機構52根據該等測定資料，藉由 運算部64而計算玻璃基板G之橫邊尺寸，並於表示機構66 中顯示該計算結果。 當如此之橫邊尺寸之測定結束後’控制機構52控制吸附 〇 台驅動部68而使吸附台6〇轉動9〇度，以上述方法取得玻璃 基板G之縱邊尺寸並加以顯示。藉此，可測定去角加工前 之玻璃基板G之縱橫尺寸。 其次，藉由去角磨石14、16而實施玻璃基板〇之縱橫邊. 部之去角。只要利用眾所周知之去角方法來實施該去角即 可。再者’本實施形態中說明了設1邊有i個去角磨石，作 亦可於1邊上設置有2個以上去角磨石來提高表面粗糙度。 139403.doc •12- 200948536 田去角結束後，以上述方法取得去角結束後之玻璃基板 G之縱橫尺寸。接著，自去角加工前之玻璃基板〇之縱橫 尺寸中減去去角加工後之玻璃基板G之縱橫尺寸而計算作 為去角量的研削損耗，並使其顯示於顯示機構66。藉此， 可確w研削損耗之實測值。再者，當實測值偏離目標值 時，由控制機構52控制去角磨石14、16對玻璃基板Θ之追 加加工#以使實測值接近於目標值。χ，亦可根據去角加 工後之縱橫尺寸，來即時地調整去角磨石14、16對玻璃基 ❹ 板G之追加加工量。 如此根據實施形態之尺寸測定裝置1〇，將尺寸測定裝置 10設置於去角加工裝置12之裝置内，測定去角加工前之玻 璃基板G之縱橫尺寸，並且測定去角加工後之玻璃基板G 之縱橫尺寸，且顯示該等尺寸。由此，由於省去了如先前 般自去角加工線上取出尺寸測定用之玻璃基板並利用其他 尺寸測定裝置來測定玻璃基板之尺寸的作業，故而可縮短 ❹ I璃基板G之尺寸測定所耗費之時間，從而可提高去角加 工裝置之運轉效率。又’亦可減少尺寸敎後之玻璃基板 G上帶有㈣之不良情形之產生，從而可減少生產損失。 .總而5之’無需直至能夠發現條件為止多次自去角加工 I置12取出玻璃基板(5來敎尺寸，實施形態之尺寸測定 裝置10可於去角加工裝置内完成條件探索。 實施幵八1之尺寸測定裝置! 〇之測長感測器】8、係 安裝於相對於玻璃基糾之端緣而移動的去角磨石Μ、Μ 之托架24、30上，因此亦可將去角磨石⑷μ之托架μ、 139403.doc -13. 200948536 30兼用做測長感測器18、2〇之移動機構。因此，可簡化尺 寸測定裝置10之全體構成。 再者，上述實施形態之順序中，說明了測定去角加工前 之玻璃基板G之縱橫尺寸，其次進行四邊之去角加工，最 後測定去角加工後之玻璃基板G之縱橫尺寸，但並不限定 於該順序。 例如，亦可使測長感測器18、2〇抵接於去角加工前之玻 璃基板G之縱邊而取得橫邊之尺寸，其次藉由去角磨石 14、16而進行玻璃基板G之縱邊之去角加工，接著使測長 感測器18、20抵接於去角加工後之縱邊而取得橫邊之尺 寸，藉此取得縱邊之研削損耗。接著，使玻璃基板g轉動 90度，並按照上述順序使測長感測器丨8抵接於去角加 工前之玻璃基板G之橫邊而取得縱邊之尺寸，繼而藉由去 角磨石14、16而進行玻璃基板G之橫邊之去角加工，然後 使測長感測器18、20抵接於去角加工後之橫邊而取得縱邊 之尺寸，藉此取得橫邊之研削損耗。又，如本實施形態所 述般，亦可藉由一台去角加工裝置12而實施縱橫之尺寸測 定、及去角加工，但若另外設置有一台去角加工裴置於 兩個地點分別進行縱橫之尺寸測定、及去角加工，則效率 良好。 進而，亦可將測長感測器安裝於搭载有轉角專用之去角 磨石34、40的托架38、44上。雖然測長感測器增多，但由 於測定動作一次即結束，故而可縮短測定節拍。 又，上述實施形態中揭示了進行去角前、去角後此兩方 139403.doc -14- 200948536 ^ ^ 但為調整切斷機之加工精 之破璃基板之尺寸，為了調整去角 亦可僅測定去离後之玻璃基板之尺 圖3係表示第2實施形離 之尺寸測定裝置80之平面圖。 第1實施形態中對藉由使去角磨石14、16移動而進行去 角加工之情形時的構成及動作進行了詳細說明，第2實施 形態中對去角磨石14、16In position, the control mechanism 52 controls the air supply mechanism 5 to supply air to the cylinder bore at the starting position of the figure. Thereby, the piston 26 is extended, and the length measuring sensor 18 abuts on the second measuring point P1 of the third long side portion of the glass substrate (the upper side to the right side of FIG. 1), and the second measuring point P1. After the measurement is completed, the control unit 52 controls the air supply mechanism 5 to contract the piston. Thereafter, the control unit 52 controls the drive unit 48 to move the carriage 24 along the movement path a, and reaches the line indicated by the solid line. 2 When the measurement point p2 (upper side - left side portion) is taken, the carriage 24 is stopped from moving. Then, the control mechanism 52 controls the air supply mechanism 50 by supplying air to the cylinder bore, whereby the piston 26 is elongated and the length of the piston is measured. The detector 18 abuts on the second measurement point P2 of the longitudinal side of the glass substrate g. - Furthermore, since the measurement operation of the length measuring sensor 20 is the same as that of the length measuring sensor, the explanation is omitted. Further, reference numeral 58 in Fig. 2 denotes an air supply mechanism of the air cylinder 54, and reference numeral 56 denotes a drive portion of the bracket 30. The first measurement point of the length measuring sensor 2 is Ρ Γ, and the second measurement point is P2'. On the other hand, when measuring the longitudinal dimension of the glass substrate G and the lateral edge chamfering, as long as in the figure i The glass substrate G is rotated by 9 degrees, and the above operation is performed by repeating 139403.doc -11 - 200948536. The symbols 34 and 40 are used for the corner grindstone dedicated to the corner. The main shafts 36 and 42 of the grindstones 34 and 40 are mounted on The brackets 38 and 44 are moved by the brackets 38 and 44 along the corners of the glass substrate G to chamfer the corner portions of the glass substrate G. Next, the size measuring device configured as described above The action of 1 is explained. As shown in Fig. 1, when the glass substrate G is positioned by the positioning reports 62, 62, ..., the processing unit 13 of the chamfering apparatus 12 is used, the length measuring sensors 18, 2 are used. The measurement is performed at the first measurement points P1 and P1. Then, the length measuring sensors! 8 and 2 are separated from the dehorned grindstones i4 and 16 by the driving units 钧 and 56 to the second measuring point. P2 and P2' move, and are measured at the second measurement points p2 and p2. One of the four measurement data from the length measuring sensors 18 and 20 is output to the control unit 52 shown in Fig. 2, and the control unit 52 is based on The measurement data is calculated by the calculation unit 64 to calculate the lateral size of the glass substrate G, and the display unit 66 displays the measurement. As a result, after the measurement of the lateral dimension is completed, the control unit 52 controls the adsorption stage driving unit 68 to rotate the adsorption stage 6 to 9 degrees, and obtains the vertical dimension of the glass substrate G by the above method and displays it. Therefore, the aspect ratio of the glass substrate G before the chamfering process can be measured. Next, the chamfering of the longitudinal and lateral sides of the glass substrate is performed by the chamfering stones 14 and 16. As long as the well-known chamfering method is used In addition, in the present embodiment, it is described that one dehorn grindstone is provided on one side, and two or more scissor grindstones may be provided on one side to improve the surface roughness. 139403.doc •12- 200948536 After the end of the field, the vertical and horizontal dimensions of the glass substrate G after the chamfering is obtained by the above method. Then, the longitudinal and lateral dimensions of the glass substrate G after the chamfering process are subtracted from the longitudinal and lateral dimensions of the glass substrate 前 before the chamfering process, and the grinding loss as the amount of deangulation is calculated and displayed on the display mechanism 66. Thereby, it is possible to determine the measured value of the loss. Further, when the measured value deviates from the target value, the control unit 52 controls the chamfering grinding stones 14, 16 to apply the processing of the glass substrate 以 to make the measured value close to the target value. χ 亦可 亦可 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , According to the dimension measuring apparatus 1 of the embodiment, the dimension measuring apparatus 10 is installed in the apparatus of the chamfering apparatus 12, and the vertical and horizontal dimensions of the glass substrate G before the chamfering process are measured, and the glass substrate G after the chamfering process is measured. The aspect ratio is displayed and displayed. Therefore, since the glass substrate for dimension measurement is taken out from the cornering processing line as before, and the size of the glass substrate is measured by another dimension measuring device, the cost of measuring the size of the glass substrate G can be shortened. The time can thus improve the operating efficiency of the chamfering device. Further, it is also possible to reduce the occurrence of a problem with (4) on the glass substrate G after the size reduction, thereby reducing production loss. In addition, it is not necessary to take out the glass substrate a plurality of times until the condition can be found, and the size of the size measuring device 10 can be completed in the chamfering apparatus. The size measuring device of VIII! 测The measuring length sensor 88 is attached to the brackets 24 and 30 of the horn grindstone and the cymbal that move relative to the edge of the glass base, so The horn grindstone (4) μ bracket μ, 139403.doc -13. 200948536 30 is also used as the moving mechanism of the length measuring sensors 18 and 2, so that the overall configuration of the dimension measuring device 10 can be simplified. In the order of the form, the aspect ratio of the glass substrate G before the chamfering process is measured, and then the four-sided chamfering process is performed. Finally, the aspect ratio of the glass substrate G after the chamfering process is measured, but the order is not limited thereto. For example, the length measuring sensors 18 and 2 may be brought into contact with the longitudinal side of the glass substrate G before the chamfering process to obtain the size of the lateral side, and then the glass substrate G may be performed by the chamfering stones 14 and 16. The longitudinal edge of the cornering process, and then the sense of length The 18, 20 abuts the longitudinal side after the chamfering process to obtain the size of the lateral side, thereby obtaining the grinding loss of the longitudinal side. Then, the glass substrate g is rotated by 90 degrees, and the length measuring sensor is made in the above-described order. The crucible 8 abuts the lateral side of the glass substrate G before the chamfering process to obtain the dimension of the longitudinal side, and then performs the chamfering processing of the lateral side of the glass substrate G by the dehorning grindstones 14, 16 and then lengthens the length The sensors 18 and 20 are abutted on the lateral side after the chamfering process to obtain the dimension of the longitudinal side, thereby obtaining the grinding loss of the lateral side. Further, as described in the embodiment, the degaussing can be performed by one The processing device 12 performs the dimension measurement and the chamfering process in the vertical and horizontal directions. However, if one additional chamfering tool is provided, and the vertical and horizontal dimension measurement and the chamfering processing are performed at two locations, the efficiency is good. The length measuring sensor is attached to the brackets 38 and 44 on which the corner grindstones 34 and 40 for corners are mounted. Although the length measuring sensor is increased, the measuring operation is completed once, so that the measurement beat can be shortened. Moreover, in the above embodiment, it is disclosed that the chamfering is performed. After the cornering, the two sides 139403.doc -14- 200948536 ^ ^ However, in order to adjust the size of the glass substrate of the cutting machine, in order to adjust the chamfering, only the rule of the glass substrate after the separation can be measured. The plan view showing the size measuring device 80 of the second embodiment is described in detail. In the first embodiment, the configuration and operation of the case where the chamfering grinding stones 14 and 16 are moved and chamfered are described in detail. 2 in the embodiment, the dehorning grindstones 14, 16
16固疋’使玻璃基板G於玻璃基板 G之相對向的兩邊方向上與去角磨石14、⑹目對移動，藉 去角加工裝置12之加卫部13之上游側設置有定位機構， 並於去角加工裝置1 2與定位機構82之間相對向設置有一對 測長感測器84、86。16 solid 疋 'moves the glass substrate G in the opposite directions of the glass substrate G with the chamfering grindstones 14 and (6), and the positioning mechanism is provided on the upstream side of the urging portion 13 of the corner processing device 12 . A pair of length measuring sensors 84, 86 are disposed opposite to the deangulation processing device 12 and the positioning mechanism 82.
之玻璃基板之尺寸測定 度’亦可僅測定去角前 加工裝置之加工精度， 寸。 進行去角加工的情形進行詳細說明。該尺寸測定裝置 ，、圖1所:Tt之尺寸測定裝置〗Q之構成上的不同點在於：於 玻璃基板G藉由去角加工裝置12之加工部n之上游側之 定位機構82的定位用輥62、62_.而定位，並由吸附台6〇吸 附固定’接著使吸附台60移動，藉此將玻璃基板g搬送至 加工部13。於搬送玻璃基板g之途中，尺寸測定裝置8〇於 圖3之兩點鏈線所示之玻璃基板g之搬送方向上游側的位置 上’使測長感測器84抵接於第1縱邊之第1測定點p 1 (省去 圖示），並且使測長感測器86抵接於第2縱邊之第2測定點 P2'(省去圖示）。然後，進而搬送玻璃基板G，於實線所示 之玻璃落板G之搬送方向下游侧之位置上，使測長感測器 84抵接於第1縱邊之第2測定點P2，並且使測長感測器86抵 139403.doc •15· 200948536 接於第2縱邊之第1測定點ΡΓ，藉此進行尺寸測定。其 後，向加工部13搬送玻璃基板（3 ,使玻璃基板g相對於去 角磨石14、16相對移動，藉此進行去角加工。玻璃基板〇 進行了去角加工之後，再次將玻璃基板G向定位裝置側、 即上游搬送’使測長感測器84抵接於第1縱邊之第2測定點 ρ2 ’並且使測長感測器86抵接於第2縱邊之第1測定點 - ρ 1，進而將玻璃基板G向上游搬送，使測長感測器84抵接 . 於第1縱邊之第1測定點pi，並且使測長感測器86抵接於第 2縱邊之第2測定點P2·，藉此進行尺寸測定。再者，使測 ^ 長感測器抵接於第1縱邊之第2測定點p2及第2縱邊之第1測 疋點P1時，雖可搬送玻璃基板G,但由於停止搬送時精度 良好，故而較佳。再者，第2實施形態中說明了設1邊上有 1個去角磨石，但亦可於丨邊上設置有2個以上去角磨石來 提咼表面粗糙度。又，雖可藉由以一台去角加工裝置12使 玻璃基板G旋轉90度而實施縱橫之尺寸測定、及去角加 工，但右另外設置有一台去角加工裝置，分別於兩個地點 進行縱橫之尺寸測定、及去角加工，則效率良好。該情形 ❹ 時’轉角專用之去角磨石可設置於各去角裝置之下游，但 亦可將僅進行轉角去角加工之地點設置於縱橫之各去角加 工裝置的下游。 、 又，除了設置一對測長感測器84、86之外，亦可進而相 . 對向設置一對測長感測器，使四台測長感測器分別同時抵 接於四個測定點之全部來測定尺寸。 於此’說明利用定位機構82對玻璃基板G進行之定位動 139403.doc -16- 200948536 作。首先’自吸附台60之空氣喷射孔喷射空氣，使玻璃基 板G於吸附台60上浮動’於該狀態下使去角步驟之前段所 設置之玻璃基板之定位用輥62抵接於玻璃基板G之端緣並 使玻璃基板G移動，從而將玻璃基板G定位於預定之位置 上。其次’藉由吸附台60而吸附定位後之玻璃基板〇，同 時或者於吸附之後使定位用輥62脫離玻璃基板以上為 • 定位動作。之後對玻璃基板G進行去角加工。 實施形態中’定位用輥62係於與搬送方向平行之方向上 Ο 分別各配置有兩台’但亦可為3點定位，即按壓一方之單 側之1點，且按壓另一方之單側之2點。又，為實現搬送方 向之定位，亦可於搬送方向之前後配置有定位用輕。再 者’只要能夠對玻璃基板G進行定位，定位用輥之台數、 配置位置並無限定》 構成定位機構之定位用輥62之材質為樹脂製、金屬製、 橡膠裝，但無論選擇何種材質，長時間使用後均會磨損。 ❹若其磨損量增大，則即便利用定位用輥6〇定位於標準位置 上，定位後玻璃基板G亦會產生相當於磨損量之傾斜（自樑 準位置傾斜）。若於該傾斜狀態下進行去角加工，則會因 .去角磨石14、16相對於玻璃基板G之端緣之移動路徑A、B 傾斜，而導致於某些部分之去角損耗較小，其他部分之去 角損耗變大，故而會產生去角品質惡化之不良情形。 因此，實施形態中，圖2所示之運算部（偏移量計算機 構）64根據測長感測器之位置資訊，而計算玻璃基板g自預 疋位置之位置偏移量，控制機構52根據該位置偏移量而變 139403.doc 17 200948536 更定位用輥62之追加調整量，從而將玻璃基板〇定位於所 〇又疋之位置上即、藉由對玻璃基板G之一邊之端緣進行2 點測定（兩邊4點測定）而運算出玻璃基板〇之傾斜量，因此 以傾斜量超過其臨限值時將變更定位用輥62之追加調整量 之方式來修正傾斜量。具體而言，控制機構52控制定位用 輥驅動部（伺服馬達）69而使之進行自動調節。藉此，去角 損耗將變得均勻，加工品質得以提高。如此，即便於定位 用輥62磨損之情形時，亦可於裝置内把握、調整定位後之 位置，故而生產效率提高。 又，作為其他實施形態，去角加工及尺寸測定可逐條邊 實施，亦可於兩邊同時實施，若兩邊同時實施則加工效率 良好，故而較佳。進而，當玻璃基板為固定而搬送去角磨 石時，亦可於四邊同時實施。 參照詳細且特定之實施形態對本發明進行了說明，但業 者應明瞭，於不脫離本發明之精神及範圍的情況下可添加 各種變更及修正。 本申明案係基於2008年3月26日申請之日本專利申請宰 2〇〇8_〇80269者，該申請案内容係以參照之方式併入本 文。 【圖式簡單說明】 圖1係配置有第1實施形態之尺寸測定裝置之去角加工裝 置的動作說明圖； 圖2係表示圖1之尺寸測定裝置之構成之方塊圖；及 圖3係配置有第2實施形態之尺寸測定裝置之去角加工裳 139403.doc 200948536 置的動作說明圖。 【主要元件符號說明】 10 尺寸測定裝置 12 去角加工裝置 13 加工部 • 14、16 去角磨石 * 18 、 20 測長感測器 22 主軸 φ 24 托架 26 活塞 28 主軸 30 托架 46 氣缸 48 驅動部 50 空氣供給機構 52 控制機構 ⑩ 54 氣缸 56 驅動部 58 空氣供給機構 60 吸附台 62 定位用輥 64 運算部 66 顯示機構 68 吸附台驅動部 139403.doc -19- 200948536 69 定位用輥驅動部 80 尺寸測定裝置 82 定位裝置 84、86 測長感測器 139403.doc -20·The dimensional measurement degree of the glass substrate can also be measured only for the processing accuracy of the pre-bevel processing device. The case of performing the chamfering processing will be described in detail. The difference between the size measuring device and the size measuring device Q of Tt in FIG. 1 is that the positioning of the positioning mechanism 82 on the upstream side of the processing portion n of the glass substrate G by the chamfering device 12 is used. The rollers 62 and 62_. are positioned and adsorbed and fixed by the adsorption stage 6'. Then, the adsorption stage 60 is moved, whereby the glass substrate g is transported to the processing unit 13. In the middle of transporting the glass substrate g, the dimension measuring device 8 is placed on the upstream side in the transport direction of the glass substrate g indicated by the two-dot chain line in FIG. 3, and the length measuring sensor 84 is brought into contact with the first longitudinal side. The first measurement point p 1 (not shown) is placed, and the length measuring sensor 86 is brought into contact with the second measurement point P2' of the second longitudinal side (the illustration is omitted). Then, the glass substrate G is conveyed, and the length measuring sensor 84 is brought into contact with the second measuring point P2 of the first longitudinal side at a position on the downstream side in the conveying direction of the falling glass G shown by the solid line, and The length measuring sensor 86 is 139403.doc •15·200948536 connected to the first measuring point 第 of the second longitudinal side, thereby performing dimensional measurement. Thereafter, the glass substrate (3 is transported to the processing unit 13 and the glass substrate g is relatively moved with respect to the scissorstones 14, 16 to perform the chamfering process. After the glass substrate is subjected to the chamfering process, the glass substrate is again used. G conveys to the positioning device side, that is, the upstream side, the first measurement point ρ2' in which the length measuring sensor 84 is brought into contact with the first longitudinal side, and the length measuring sensor 86 is brought into contact with the first measurement of the second longitudinal side. Point - ρ 1, and further, the glass substrate G is transported upstream, and the length measuring sensor 84 is brought into contact with the first measuring point pi of the first longitudinal side, and the length measuring sensor 86 is brought into contact with the second longitudinal direction. Dimensional measurement is performed by the second measurement point P2· at the side. Further, the measurement sensor is brought into contact with the second measurement point p2 of the first longitudinal side and the first measurement point P1 of the second longitudinal side. In the case where the glass substrate G can be conveyed, it is preferable because the accuracy of the conveyance is stopped, and in the second embodiment, it is described that one dehorn grindstone is provided on one side, but it may be on the side of the crucible. Two or more chamfering stones are provided to improve the surface roughness. Further, although the glass substrate G is rotated by 90 degrees by one cornering processing device 12, the longitudinal direction is performed. Dimensional measurement and chamfering, but there is also a deangulation processing device on the right side, which is used for dimension measurement and deangulation processing at two locations, which is efficient. In this case, the corner is dedicated to the corner. The grindstone may be disposed downstream of each of the chamfering devices, but may be disposed at a position where only the corner chamfering processing is disposed downstream of each of the out-angle processing devices. Further, in addition to providing a pair of length measuring sensors 84, In addition to 86, a pair of length measuring sensors may be provided in the opposite direction, so that the four length measuring sensors respectively abut against all of the four measuring points to measure the size. 82 positioning operation of the glass substrate G 139403.doc -16- 200948536. First, 'the air is sprayed from the air injection hole of the adsorption stage 60 to float the glass substrate G on the adsorption stage 60'. In this state, the deangulation step is performed. The positioning roller 62 of the glass substrate provided in the previous stage abuts on the edge of the glass substrate G and moves the glass substrate G to position the glass substrate G at a predetermined position. Secondly, it is adsorbed by the adsorption stage 60. In the subsequent glass substrate, the positioning roller 62 is removed from the glass substrate or the positioning operation after the adsorption. The glass substrate G is then subjected to the chamfering process. In the embodiment, the positioning roller 62 is parallel to the conveying direction. There are two units in the direction ', but they can also be positioned at 3 points, that is, pressing one point on one side and pressing one point on the other side. In addition, in order to achieve the positioning of the transport direction, The position of the positioning roller is not limited as long as the glass substrate G can be positioned before the conveyance direction. The material of the positioning roller 62 constituting the positioning mechanism is made of resin. It is made of metal or rubber, but it will wear out after long-term use regardless of the material selected.增大 If the amount of wear increases, even if the positioning roller 6 is positioned at the standard position, the glass substrate G after positioning will have a tilt corresponding to the amount of wear (inclination from the beam position). If the chamfering is performed in the inclined state, the moving paths A and B of the corner grindstones 14 and 16 with respect to the edge of the glass substrate G are inclined, resulting in a small angular loss in some portions. The degaussing loss of other parts becomes large, so that the deteriorating quality deteriorates. Therefore, in the embodiment, the calculation unit (offset calculation unit) 64 shown in FIG. 2 calculates the positional shift amount of the glass substrate g from the pre-pit position based on the position information of the length measuring sensor, and the control unit 52 is based on The position shift amount is changed by 139403.doc 17 200948536. The additional adjustment amount of the positioning roller 62 is used to position the glass substrate 于 at the position of the 〇 and the 即, that is, by the edge of one side of the glass substrate G. Since the amount of inclination of the glass substrate 〇 is calculated by the two-point measurement (measured at four points on both sides), the amount of tilt is corrected so that the additional adjustment amount of the positioning roller 62 is changed when the amount of tilt exceeds the threshold value. Specifically, the control unit 52 controls the positioning roller drive unit (servo motor) 69 to perform automatic adjustment. Thereby, the deangulation loss becomes uniform and the processing quality is improved. As described above, even when the positioning roller 62 is worn, the position after positioning can be grasped and adjusted in the apparatus, so that the production efficiency is improved. Further, as another embodiment, the chamfering and the dimensioning may be carried out one by one, or may be carried out simultaneously on both sides, and if both sides are simultaneously performed, the processing efficiency is good, which is preferable. Further, when the glass substrate is fixed and the dehorned grindstone is transported, it may be simultaneously performed on four sides. The present invention has been described with reference to the specific embodiments thereof. It is understood that various changes and modifications may be added without departing from the spirit and scope of the invention. This application is based on a Japanese patent application filed on March 26, 2008, which is incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an operation explanatory view of a chamfering apparatus in which a dimension measuring apparatus according to a first embodiment is arranged; Fig. 2 is a block diagram showing a configuration of a dimension measuring apparatus of Fig. 1; There is an operation explanatory diagram of the chamfering processing 139403.doc 200948536 of the dimension measuring device according to the second embodiment. [Description of main component symbols] 10 Dimensional measuring device 12 Deangulation processing device 13 Machining department • 14, 16 Dehorned grindstone* 18, 20 Length measuring sensor 22 Spindle φ 24 Bracket 26 Piston 28 Spindle 30 Bracket 46 Cylinder 48 drive unit 50 air supply mechanism 52 control mechanism 10 54 cylinder 56 drive unit 58 air supply mechanism 60 adsorption stage 62 positioning roller 64 calculation unit 66 display mechanism 68 adsorption stage drive unit 139403.doc -19- 200948536 69 positioning roller drive Section 80 Dimensional Measuring Device 82 Positioning Device 84, 86 Length Measuring Sensor 139403.doc -20·