TWI413569B - Defect correction method and device - Google Patents

Abstract

The invention relates to a defect correcting method and a device thereof, which can improve the use efficiency of the belt and greatly reducing the operation cost. The defect correcting device uses an abrasion belt to correct or remove convex defect on the surface of a workpiece. The invention comprises a platform for holding a workpiece; a abrasion unit for abrading the workpiece; and a first moving mechanism for moving the abrasion unit in a fist direction perpendicular to the abrasion belt moving direction corresponding to the workpiece on the platform. The abrasion unit comprises an abrasion belt moving mechanism for moving the abrasion belt; a head part which is movably arranged in a direction perpendicular to the belt moving direction corresponding to the abrasion unit, so as to abut the abrasion belt with the workpiece surface; and a second moving mechanism for moving the head part in a second direction opposite to the first direction and perpendicular to the belt moving direction corresponding to the abrasion unit. During abrasion procession, the convex defect moves in the direction perpendicular to the belt moving direction corresponding to the abrasion belt, while the head part is maintained in an idle state corresponding to the convex defect.

Description

Defect correction method and device Technical field

The present invention relates to a defect correction method and a defect correction device for correcting a convex defect existing on a surface of various workpieces such as a color filter substrate by polishing.

Background of the invention

A method of correcting a convex defect by a traveling polishing belt has been put into practical use as a method of correcting a convex defect existing on the surface of various work such as a glass substrate for an FPD (flat panel display). In the defect correction method using the polishing tape, the polishing unit on which the traveling mechanism is mounted is lowered by a predetermined amount, and the convex defect is polished by the traveling polishing belt to correct the convex defect to an allowable height or less. In the belt polishing method, a pressing roller attached to the front end of the polishing unit is used as a mechanism for abutting the polishing tape against the convex defect, and the polishing tape is advanced by a predetermined length while applying a predetermined pressing force to the convex defect by the pressing roller ( For example, refer to Patent Document 1). As a method of correcting the convex defect, a head pin which is displaceable in the Z-axis direction is disposed at the front end of the polishing unit, and the head pin is used to press the polishing tape against the convex defect and the polishing tape travels (for example) Refer to Patent Document 2).

In the conventional defect correction device described above, when the convex defect is corrected, the polishing unit is lowered and the polishing tape is brought into contact with the convex defect. At the same time, the winding reel is driven to advance the abrasive belt, and the raised defects are ground by the traveling abrasive belt. When the polishing tape is advanced for a predetermined length or a predetermined polishing time is advanced, the polishing is ended, and the polishing unit is raised to a predetermined position. Next, the grinding unit is moved toward the position of the other convex defects to perform a correction process for the next defect.

[Patent Document 1] Japanese Patent Publication No. 6-189054

[Patent Document 2] JP-A-2007-253317

As described above, the defect correction method using the polishing tape can accurately correct or remove minute projection defects of a few tens of μm, and is extremely useful as a device for correcting the convex defects of the color filter substrate. However, since the polishing tape is wound up by a predetermined length per polishing process, there is a disadvantage that the belt is inefficient in use. Fig. 1 is a view showing the polishing trace of the polishing tape after the grinding treatment. As shown in Fig. 1, the width of the polishing tape 1 is about 3.81 mm, and the width of the polishing region 2 used for polishing in contact with the convex defect is about 200 μm. Therefore, most of the remaining area is not used for the grinding process, and the belt is extremely inefficient in use and has the disadvantage of high operating cost.

An object of the present invention is to improve a belt use efficiency and to realize a defect correction device and a defect correction method in which the operation cost is greatly reduced.

A defect correction device constructed according to the present invention is a defect correction device for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, characterized by comprising: a table for holding a workpiece; a polishing unit for polishing; and a first moving mechanism that relatively moves the polishing unit relative to the workpiece on the stage toward a first direction orthogonal to a traveling direction of the belt as a traveling direction of the polishing belt; and the polishing unit includes: a polishing tape traveling mechanism that travels on the polishing tape; a head wafer that is relatively movable in the first direction by being attached to the polishing unit, and that abuts the polishing tape against the surface of the workpiece; and the head wafer is oriented along the polishing unit The second moving mechanism that relatively moves in the first direction; in the polishing process, the polishing unit and the head wafer are synchronized with each other, and relatively move in opposite directions along the first direction.

According to the defect correction device of the present invention, not only the polishing tape is moved during the polishing process, but also the polishing unit and the head wafer are moved in a direction orthogonal to the traveling direction of the tape. The polishing unit is moved in a direction orthogonal to the traveling direction of the belt while the polishing belt is being advanced, and the traveling polishing belt is brought into contact with the convex defect while moving in a direction orthogonal to the traveling direction of the belt. That is, the velocity vector of the polishing tape includes a velocity vector component in a traveling direction of the tape with respect to the convex defect and a velocity vector component in a direction orthogonal to the traveling direction of the tape. On the other hand, the head wafer which abuts the projections on the projections is relatively moved in the opposite direction to the movement direction of the polishing unit with respect to the polishing unit, and therefore is maintained in a stationary state with respect to the projection defects. As a result, in the polishing process, the convex defects abut against the traveling polishing tape in the oblique direction with respect to the traveling direction (the direction of progress). Therefore, the polishing tape is formed on the polishing tape at an oblique angle (angles other than 90° and 0°) with respect to the center of the polishing tape, so that the polishing tape can be substantially utilized for the polishing process.

The relative movement of the workpiece relative to the overhead structure and the relative movement of the workpiece disposed on the correction head of the overhead structure can be utilized, or the polishing unit can be oriented relative to the correction head relative to the direction of travel of the belt. The mechanism that moves in the direction is a mechanism that moves the polishing unit in a direction orthogonal to the traveling direction of the tape.

A defect correcting device constructed according to the present invention is a defect correcting device for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, characterized by comprising: a table for holding a workpiece; and a table edge An elevated structure that moves in one direction; a first moving mechanism that moves the overhead structure; a correction head that is attached to the overhead structure and movable in a direction orthogonal to the moving direction; and a second movement that moves the correction head The correction head includes: a polishing unit that polishes the workpiece; and an optical head that observes defects existing in the workpiece; the polishing unit includes: a polishing belt traveling mechanism that advances the polishing belt; and the grinding a head wafer abutting against the surface of the workpiece; a guiding mechanism for guiding the head wafer toward a first direction orthogonal to a traveling direction of the belt as a traveling direction of the polishing tape; and a head wafer along the guiding mechanism a third moving mechanism that moves relative to the polishing unit; in the polishing process, the polishing unit is moved by the first moving mechanism or the second movement The mechanism moves in a first direction orthogonal to a traveling direction of the polishing tape, and the head wafer is opposed to the polishing unit in a direction opposite to a moving direction of the polishing unit in the first direction by the third moving mechanism. During the polishing process, the polishing unit and the head wafer are synchronized with each other and relatively moved in opposite directions along the first direction, and the head wafer is maintained in a substantially stationary state with respect to the defect to be corrected.

A defect correction device constructed according to the present invention is a defect correction device for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, characterized by comprising: a table for holding the workpiece; and a table orientation An elevated structure that moves in one direction; and a correction head that is relatively movable when mounted on the elevated structure; the correction head includes: a polishing unit that polishes the workpiece; and moves the polishing unit in the first direction a first moving mechanism; the polishing unit includes: a polishing tape traveling mechanism that moves the polishing tape in a second direction orthogonal to the first direction; and is mounted to be relatively movable in the first direction, and to perform the polishing a head wafer that abuts against the surface of the workpiece; and a second moving mechanism that relatively moves the head wafer relative to the polishing unit in the first direction; in the polishing process, the polishing tape travels in the second direction, and the polishing unit and the head The wafers are synchronized with each other and relatively moved in opposite directions along the first direction, and the head wafer is opposite to the defect dimension to be corrected. Substantially stationary state.

A belt grinding device constructed in accordance with the present invention is a belt grinding device for use in a defect correction device for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive belt, characterized in that it comprises: winding a polishing tape a winding reel; a supply reel housing the polishing tape; a first rotation driving mechanism that drives the winding reel in a direction in which the polishing tape is wound; and the supply reel is oriented in a direction opposite to the winding direction a second rotation driving mechanism that drives the winding direction; a head wafer that abuts the polishing tape against the surface of the workpiece; and a head wafer moving mechanism that moves the head wafer in a direction orthogonal to the traveling direction of the tape; In the polishing process in which the protrusion is in contact with the convex defect, the head wafer is moved in the direction orthogonal to the traveling direction with respect to the traveling of the polishing tape in synchronization with the progress of the polishing tape.

A defect correction method according to the present invention is a defect correction method for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, characterized in that the method comprises: lowering the polishing unit to abut the polishing tape a step of bulging a defect, wherein the polishing unit is equipped with: a polishing tape traveling mechanism that advances the polishing tape; a head wafer that causes the polishing tape to abut against a convex defect existing on the surface of the workpiece; and the head wafer is oriented and polished a head wafer moving mechanism that moves in a first direction in which the traveling direction of the tape is orthogonal to the direction of travel; a defect correcting step of moving the polishing tape to correct a convex defect on the surface of the workpiece; and after the defect correction processing is completed, the polishing unit is caused a step of ascending to a predetermined position; in the defect correction step, the polishing unit and the head wafer are synchronized with each other and relatively moved in opposite directions along the first direction.

According to the present invention, in the grinding process in which the traveling polishing tape abuts against the convex defect to correct the convex defect, the polishing tape moves relative to the convex defect in a direction orthogonal to the traveling direction of the tape, and the head wafer Maintaining a stationary state with respect to the raised defect. Therefore, the polishing tape can be formed obliquely across the polishing tape by contact with the convex defect. As a result, the polishing tape can be roughly utilized for the grinding process, and the operation cost of the defect processing device is greatly reduced.

Simple illustration

Fig. 1 is a view showing a grinding trace of a grinding belt in accordance with a conventional defect processing method.

Fig. 2 (A) and (B) are views showing the overall structure of the defect correcting device constructed in accordance with the present invention.

Fig. 3 is a diagram showing an example of a correction head.

Fig. 4 is a view showing an example of a belt traveling mechanism mounted on a polishing unit.

Figure 5 is a side elevational view of the direction of travel of the belt of the grinding unit.

Fig. 6 is a view showing the formation marks formed on the polishing tape.

Fig. 7 is a flow chart showing an example of an algorithm of a defect correction method constructed in accordance with the present invention.

Fig. 8 is a view showing a modification of the correction head of the defect correction device constructed in accordance with the present invention, and is a schematic view seen from the front direction.

Fig. 9 is a view showing the correction head shown in Fig. 8 seen from the traveling direction of the belt.

Fig. 10 is a view showing a modification of the rewinding method of the polishing tape in the defect correction method constructed in accordance with the present invention.

Detailed description of the preferred embodiment

Fig. 2 is a view showing the overall structure of a defect correcting device constructed in accordance with the present invention, and Fig. 2(A) is a plan view schematically showing a second (B) view of the elevated structure. The defect correction device 10 includes a gantry 11 that is disposed on the gantry 11. The table 14 supporting the work piece 13 is disposed on the base 12. In the present example, a color filter substrate in which color filter elements of RGB are arranged is used as a workpiece to be subjected to defect correction to correct convex defects existing on the surface of the color filter substrate 13. The table 14 can be equipped with a vacuum suction device (not shown), and the workpiece 13 can be held on the table 14 by vacuum suction.

The elevated structure 16 on which the correction head 15 for correcting the convex defect is mounted is disposed on the base 12 . The elevated structure 16 includes an X-axis driving mechanism and a Y-axis driving mechanism. The two driving mechanisms are driven according to the address information of the defect supplied by the controller (not shown), so that the correction head 15 can be opposite to the working member 13 Move in the dimension and place it directly above the defect. The elevated structure 16 includes two support shafts 17a and 17b and is mounted to move the two support shafts to the two Y-axis guide rails 18a and 18b provided on the base 12. For example, a linear motor can be used as the Y-axis drive mechanism, and the overhead structure 16 is moved along the Y-axis guide by the driving force from the linear motor.

The elevated structure 16 drives the X-axis drive mechanism to move the correction head 15 in the X-axis direction. The ball screw mechanism 19 and the motor 20 are used as an example of the X-axis drive mechanism. The rotary encoder 21 is coupled to the motor 20 and detects the position of the correction head 15 in the X-axis direction. The detected position information is supplied to the controller. As will be described later, the X-axis driving mechanism of the overhead structure 16 in the present example is used as a moving mechanism that moves the polishing unit in a direction orthogonal to the traveling direction of the tape in the polishing process. Therefore, the position information output by the rotary encoder 21 can be used as the position information in the direction orthogonal to the traveling direction of the belt of the grinding unit in the grinding.

Fig. 3 is a diagram showing an example of a correction head. The correction head includes a fixed base member 30 coupled to the elevated structure 16. The two guide rails 31a and 31b extending in the Z-axis direction are provided to the fixed base member 30, and the movable base member 41 constituting the polishing unit 40 is connected to the guide rails 31a and 31b so as to be movable up and down. The motor 32 for driving the Z-axis is attached to the fixed base member 30, and the screw shaft constituting the ball screw 33 is coupled to the motor 32. The nut that has been mounted to the movable base member 41 is movably mounted to the screw shaft of the ball screw 33. Therefore, the movable base member 41 can be freely moved up and down along the Z-axis direction by the driving of the motor 32. Further, various drive mechanisms other than the combination of the motor and the ball screw can be used as the Z-axis drive device.

In order to detect the position of the grinding unit in the Z-axis direction, a linear encoder 34 as a position detecting means is mounted. A Z-axis scale 35 of the linear encoder is provided to the fixed base member 30, and a scale head 36 is provided to the movable base member 41. The position information read by the scale head is supplied to the controller and used as position information in the Z-axis direction of the polishing unit of the reference coordinate system.

The belt rim 45 including the supply reel 43 around which the polishing tape 42 is wound and the winding reel (winding reel) 44 are replaceably attached to the movable base member 41. The polishing tape 42 is attached between the two reels by, for example, four guide rollers and a head pin 46, and travels at a predetermined traveling speed by a motor coupled to the winding reel.

Fig. 4 is a view for explaining a polishing belt traveling mechanism mounted on a polishing unit. The first and second motors 47 and 48 as the rotation driving device are attached to the movable base member 41 constituting the polishing unit. The first motor 47 drives the supply reel 43, and the second motor 48 drives the winding reel 44. A rotary encoder (not shown) is coupled to the guide roller disposed in the travel path of the polishing tape. With this rotary encoder, the amount of tape winding (the amount of tape winding) after the completion of the polishing process was measured together with the measurement of the travel length of the polishing tape in the polishing process. The measured travel length and roll-up amount are output to the controller. The controller controls the amount of rolling up and the amount of rewinding of the polishing belt based on the output signal from the rotary encoder.

Here, the traveling direction of the polishing tape will be described. In the present specification, the traveling direction of the polishing tape is set to be a direction in which the supply reel is oriented toward the winding up of the reel. Specifically, in the examples shown in FIGS. 2 to 4, the polishing tape travels in the Y direction which is the moving direction of the overhead structure. Therefore, the direction orthogonal to the traveling direction of the belt is used as the X direction of the moving direction of the correction head.

Fig. 5 is a side view showing the operation of the wafer to be mounted on the polishing unit and seen from the traveling direction side of the polishing tape. A guide member 50 that extends in the X direction is provided to the movable base member 41. The head wafer 46 is coupled to the guiding member 50 to be movable in the X direction. Moreover, the head wafer moving mechanism that moves the head wafer 46 in the X direction is provided in the movable base member 41. This example uses a ball screw mechanism as a head wafer moving mechanism. The ball screw mechanism includes a third motor 51 that is attached to the movable base member 41, a screw shaft 52 as a rotating shaft thereof, and a nut (not shown) that is coupled to the head wafer 46. The head wafer that presses the polishing tape 42 against the convex defect 53 can be moved in the X direction by the guiding member 50 and the ball screw mechanism. Further, a position detector (not shown) that can detect the position of the head wafer in the X direction is provided, and position information in the X direction of the detected head wafer is supplied to the controller. For example, a linear encoder can be used as the position detector. Further, various driving mechanisms can be used as the head wafer moving mechanism, and for example, a linear actuator or a direct acting actuator can be used.

Next, the optical head provided in the correction head will be described. While the height of the convex defect is measured, the optical head 55 which also observes the convex defect is attached to the movable base member 41. The optical head 55 includes an imaging device composed of a confocal optical system. The imaging device includes an illumination optical system capable of generating a bundled linear beam, a scanning system for scanning a surface of the workpiece by a linear beam, and a line sensor for receiving reflected light from the surface of the workpiece. The workpiece surface is scanned by the bundled beam of light to capture a quadratic confocal image of the surface of the workpiece. The output signal from the line sensor is supplied to the controller as an image signal, and the secondary image signal on the surface of the workpiece is outputted to display a secondary image of the workpiece surface 2 on the screen. Therefore, the operator can observe the image of the convex defect through the optical head, thereby grasping the shape and the like of the defect. Further, the state of the corrected convex defect is grasped based on the observation by the optical head 55, and it is determined by one correction process whether or not the correction is within the allowable range, and when the correction is determined to be insufficient according to the observation result, It can be corrected again for the same convex defect.

The characteristic of the confocal optical system is that when the focusing point of the illumination beam is continuously displaced relative to the workpiece surface and Z-axis scanning is performed, when the focusing point (focus) is on the surface of the sample, The light receiving element can detect the maximum brightness value. Therefore, the positional information when the focus is on the face of the work piece and the positional information when the focus is on the surface of the convex defect are supplied to the signal processing device for signal processing, whereby the height of the convex defect can be measured.

Next, the relative movement of the polishing unit and the head wafer with respect to the convex defects will be described. As described above, in the polishing process, the polishing unit 40 including the polishing tape traveling mechanism and the head wafer moves in the first direction orthogonal to the tape traveling direction by the X-direction movement of the correction head 15. At the same time, the head wafer 46 which presses the polishing tape 42 against the convex defect 54 is directed in the X direction with respect to the polishing unit, and is oriented at the same speed as the moving speed of the polishing unit in the second direction opposite to the first direction. Synchronous movement. Therefore, in the process of correcting the convex defect, the polishing tape 42 relatively moves toward the first direction which is a direction orthogonal to the traveling direction of the tape with respect to the convex defect. Further, the head wafer 46 relatively moves in the second direction opposite to the first direction with respect to the polishing tape, but is maintained in a stationary state with respect to the convex defect 53. That is, the head wafer is offset from the movement of the polishing unit in the first direction by the movement of the head wafer itself in the second direction. Therefore, the head wafer is maintained in a stationary state with respect to the projection defect, and only the polishing tape is oriented with respect to the projection defect. Moves in a direction orthogonal to the direction of travel of the belt.

The defect correcting device of this example is controlled to roll up only a predetermined length of the polishing tape for each polishing process, and only rewinds the predetermined length after the polishing is completed, and returns the polishing unit and the head wafer to the original position, and then performs new grinding. deal with. In this example, the polishing time is set as the time control, and the winding amount of the polishing tape in the primary polishing processing time is set to d1, and the rewinding amount after the polishing process is set to d2, and the difference between the winding amount and the rewinding amount is obtained. An example is set to 300 μm. That is, it is empirically known that the width of the polishing tape in contact with the convex defect in the primary polishing treatment is at most about 200 μm. Therefore, the tolerance was set and the interval in the width direction of the polishing tape at the time of the polishing treatment was set to 300 μm. That is, it is set to d1-d2=300 μm. Moreover, when the polishing tape having a belt width of 3.81 mm is used, an example of the amount of movement W in the direction orthogonal to the traveling direction of the belt of the polishing unit is 3.4 mm.

Figure 6 shows the traces of the grinding formed by the abrasive belt by the grinding process. Moreover, in order to make the drawings clear, the interval between the polishing marks is enlarged and illustrated. The abrasive tape begins to travel while the abrasive tape begins to contact the raised defect. The relative movement of the polishing unit and the head wafer is also started simultaneously with the start of the travel of the polishing belt. At this time, the polishing tape moves only the distance W in the direction (X direction) orthogonal to the traveling direction of the tape while traveling the belt length d1. As a result, traces of oblique grinding with respect to the centerline of the belt can be formed on the abrasive belt. As the polishing time ends, the relative movement of the polishing unit and the head wafer also ends. When the grinding time is over, the rewinding is driven by the motor to rewind the belt only by the tape length d2. Further, the correction head and the head wafer are returned to the original position during the tape rewinding period, and the head unit is moved to the start position while the polishing unit returns to the start position of the polishing. Next, the position of the address of the downward convex defect is corrected, and the correction operation of the next convex defect is started. According to the defect correction device of the present invention, the polishing marks formed on the polishing tape by the polishing process are formed obliquely with respect to the polishing tape, so that the polishing tape can be substantially utilized for the entire polishing. deal with.

Next, an algorithm for the defect correction method according to the present invention will be described. Fig. 7 is a flow chart showing an example of a correction algorithm of the defect correcting device constructed in accordance with the present invention. Prior to grinding, the address information of the defect detected by the defect inspection device is used, and the correction head is located directly above the convex defect. Next, the height of the convex defect is measured while observing the convex defect to be corrected by the optical head, and the amount of drop of the polishing unit is set.

In step 1, the address information of the defect is used, so that the grinding unit is located directly above the convex defect to be corrected, and the grinding unit is started to be lowered. The amount of drop of the grinding unit is measured in advance by an optical head. Then, the polishing tape is started to be rolled up only after a delay (step 2). Furthermore, in step 3, the relative movement of the polishing unit and the head wafer is started corresponding to the start of the polishing tape. That is, the polishing unit is moved in the opposite direction to the head wafer at the same speed and opposite to each other in the direction orthogonal to the traveling direction of the belt. Further, in Fig. 7, the start of the rolling up of the polishing tape (step 2) and the relative movement of the polishing tape and the head wafer are respectively described (step 3), but these steps 2 and 3 start simultaneously.

In step 4, it is determined whether a predetermined grinding time has elapsed. In the case where the predetermined polishing time has elapsed, the grinding process is ended (step 5). As a result, the winding of the polishing tape, the lowering of the polishing unit, and the relative movement of the polishing unit and the head wafer are stopped.

At step 6, the rise of the grinding unit is started and returned to the predetermined standby position.

In step 7, the rewinding of the polishing tape is started, and only the tape length D2 is retracted in accordance with the output of the rotary encoder attached to the winding motor. Further, the amount of rewinding of the polishing tape is an example, and can be appropriately set depending on the characteristics of the projection defects or the purpose and grade of polishing.

In step 8, corresponding to the rewinding of the polishing tape, the polishing unit and the head wafer are moved by a distance W in the opposite direction, respectively, and moved to the polishing start position using the output from the rotary encoder.

In step 9, the optical head is set to be directly above the corrected convex defect, and the convex defect in which the comment has been corrected is observed. As a result of observing the comment, it was confirmed that the correction of the convex defect was completed, and the polishing process was terminated to shift to the correction of the next convex defect. When the polishing treatment is insufficient, the polishing unit is lowered by a necessary distance and re-grinding is performed.

Fig. 8 and Fig. 9 show a modification of the defect correcting device according to the present invention, Fig. 8 is a side view showing the grinding unit seen from the front side, and Fig. 9 is a side view showing the correction head seen from the traveling direction of the belt. In the above-described embodiment, the polishing belt is moved in the direction orthogonal to the traveling direction of the belt by the X-direction movement of the correction head provided in the overhead structure. On the other hand, in this example, the polishing unit is relatively moved with respect to the correction head, whereby the polishing belt is moved in a direction orthogonal to the traveling direction of the belt. The same components as those used in FIGS. 2 to 6 are denoted by the same reference numerals. The Z-axis drive motor 32 is attached to the fixed base member 30 of the correction head 15. The motor 32 constitutes a ball screw mechanism 33, and a nut of the ball screw is fixed to the first support member 60. Therefore, the first support member 60 is guided along the two guide rails 31a and 31b provided in the fixed base member 30 and extending in the Z-axis direction, and is moved up and down along the Z-axis direction. The second support member 61 extending in the XY plane is attached to the first support member 60.

The linear motor 62 is attached to the second support member 61. The stator member of the linear motor 62 extends in the X-axis direction and is fixed to the second support member 61. Further, the mover member is fixed to the third support member 63 that extends inward in the XY plane. The movable base member 41 constituting the polishing unit is attached to the third support member 63. As described above, the belt traveling mechanism and the head wafer moving mechanism are attached to the movable base member 41.

The two guide rails 64a and 64b extending in the X-axis direction are attached to the second support member 61. Further, the sliding members 65a and 65b that are engaged with the guide rails 64a and 64b, respectively, are attached to the third support member 63. Further, the linear scale 66 is attached to the third support member 63 to detect the position of the third support member in the X-axis direction, that is, the position of the polishing unit and the polishing tape in the X-axis direction can be detected. The output signal of the linear scale 66 is supplied to the controller. When the linear motor 62 is driven, the movable belt member 41 supporting the belt traveling mechanism and the head wafer moving mechanism reciprocates in the X-axis direction, and the polishing unit relatively moves in the X-axis direction with respect to the correction head. Further, the position of the polishing tape and the head wafer in the X-axis direction can be detected by the linear scale 66.

When the convex defect is corrected, the head wafer is positioned directly above the convex defect according to the address information of the defect. Next, the motor 32 is driven to lower the polishing unit to start correction of the convex defect. At the same time, the belt traveling mechanism including the polishing tape 42 starts to move in the first direction along the X-axis direction. Further, in synchronization with the movement of the tape traveling mechanism in the X-axis direction, the head wafer 46 moves in the opposite direction to the first direction at the same speed in the X-axis direction. As a result, the polishing tape moves in the X-axis direction orthogonal to the traveling direction of the tape with respect to the convex defect to be corrected, and the head wafer is maintained in a stationary state with respect to the convex defect. In this manner, by moving the polishing unit relatively in the X direction with respect to the correction head, it is possible to move only the polishing tape in a direction orthogonal to the traveling direction of the tape.

Fig. 10 is a view showing a modification of the rewinding method. In Fig. 10, reference numeral 70 denotes a polishing tape, and reference numeral 71 denotes a polishing trace formed on the polishing tape. The foregoing embodiment is set so that the polishing unit and the head wafer are returned to the original position and the post-grinding treatment is performed after the polishing belt is wound back only for a predetermined length. On the other hand, as shown in FIG. 10, after the primary polishing process, the polishing unit and the head wafer are not returned to the original position, and the position after the polishing process is set to the start position, so that the polishing tape only travels. A slightly longer distance d3 than the grinding trace. This state is set to the start state, and correction of other convex defects is performed. At this time, the rewinding motor is driven and the polishing unit is lowered to perform the polishing process while rewinding the polishing tape only by a predetermined length. After the end of the grinding process, the polishing tape is caused to travel only a small distance d3, and then the next convex defect is subjected to a grinding process. When the polishing treatment is performed in this manner, the entire thickness of the polishing belt can be achieved.

1. . . Grinding tape

2. . . Grinding area

10. . . Defect correction device

11. . . shelf

12. . . Abutment

13. . . Work piece

14. . . Workbench

15. . . Correction head

16. . . Elevated structure

17a, 17b. . . Support shaft

18a, 18b‧‧‧Y-axis guide

19‧‧‧Rolling screw mechanism

20‧‧‧Motor

21‧‧‧Rotary encoder

30‧‧‧Fixed base member

31a, 31b‧‧‧ rails

32‧‧‧Motor

33‧‧‧Rolling screw

34‧‧‧Linear encoder

35‧‧‧Z-axis scale

36‧‧‧ scale head

40‧‧‧grinding unit

41‧‧‧ movable base member

42‧‧‧grinding tape

43‧‧‧Supply reel

44‧‧‧Rolled up the reel

45‧‧‧匣

46‧‧‧ head wafer

47‧‧‧1st motor

48‧‧‧2nd motor

50‧‧‧Guide members

51‧‧‧3rd motor

52‧‧‧ Screw shaft

53‧‧‧ convex defects

55‧‧‧ Optical head

60‧‧‧1st support member

61‧‧‧2nd support member

62‧‧‧Linear motor

63‧‧‧3rd support member

64a, 64b‧‧‧ rails

65a, 65b‧‧‧ sliding members

66‧‧‧linear scale

70‧‧‧grinding tape

71‧‧‧ grinding marks

D1‧‧‧ Roll up

D2‧‧‧Rewind volume

D3‧‧‧Small distance

W‧‧‧Mobile

S1~S9‧‧‧Steps

Fig. 1 is a view showing a grinding trace of a grinding belt in accordance with a conventional defect processing method.

Fig. 2 (A) and (B) are views showing the overall structure of the defect correcting device constructed in accordance with the present invention.

Fig. 3 is a diagram showing an example of a correction head.

Fig. 4 is a view showing an example of a belt traveling mechanism mounted on a polishing unit.

Figure 5 is a side elevational view of the direction of travel of the belt of the grinding unit.

Fig. 6 is a view showing the formation marks formed on the polishing tape.

Fig. 7 is a flow chart showing an example of an algorithm of a defect correction method constructed in accordance with the present invention.

Fig. 8 is a view showing a modification of the correction head of the defect correction device constructed in accordance with the present invention, and is a schematic view seen from the front direction.

Fig. 9 is a view showing the correction head shown in Fig. 8 seen from the traveling direction of the belt.

Fig. 10 is a view showing a modification of the polishing tape rewinding method in the defect correction method according to the present invention.

13. . . Work piece

14. . . Workbench

41. . . Movable base member

42. . . Grinding tape

44. . . Roll up the roll

46. . . Head wafer

47. . . First motor

50. . . Guide member

51. . . Third motor

52. . . Screw shaft

53. . . Bump defect

Claims (17)

A defect correction device is a method for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive belt, characterized in that: a table is included, which is a holder for holding a workpiece; and a polishing unit is used for grinding the workpiece And a first moving mechanism that moves the polishing unit relative to the workpiece on the stage toward a first direction orthogonal to a traveling direction of the belt as a traveling direction of the polishing tape; and the polishing unit includes: polishing a belt traveling mechanism for moving the polishing tape; the head wafer is attached to the polishing unit to be relatively movable in the first direction, and the polishing tape is in contact with the surface of the workpiece; and the second moving mechanism is The head wafer is relatively moved in the first direction with respect to the polishing unit. In the polishing process, the polishing unit and the head wafer are synchronized with each other and relatively moved in opposite directions along the first direction. The defect correction device according to claim 1, wherein in the polishing process, the first moving mechanism relatively moves the polishing unit relative to the workpiece along the first direction, and the second moving mechanism causes the head wafer to follow the first The one direction relative to the polishing unit relatively moves in a direction opposite to the moving direction, and the head wafer is maintained in a substantially stationary state with respect to the workpiece. For example, the defect correction device described in the first or second patent application scope is further included. An overhead structure including a relative movement relative to the workpiece on the stage, a moving mechanism for relatively moving the overhead structure, and a correction head attached to the overhead structure, wherein the polishing unit is provided on the correction head, and is used The moving mechanism that moves the elevated structure is the first moving mechanism, and the polishing unit moves in the first direction by the movement of the elevated structure during the polishing process. The defect correction device according to claim 1 or 2, further comprising an elevated structure that relatively moves relative to the workpiece on the stage, a correction head that is attached to the elevated structure and that is relatively movable relative to the workpiece, and a moving mechanism for moving the correction head relative to the workpiece, wherein the polishing unit is provided in the correction head, and a moving mechanism for relatively moving the correction head is used as the first moving mechanism, and is corrected in the polishing process. The movement of the head causes the polishing unit to move in the first direction. The defect correction device according to claim 1 or 2, further comprising an elevated structure that relatively moves relative to the workpiece on the stage, and a correction head attached to the elevated structure, wherein the polishing unit is supported The polishing unit is relatively movable relative to the correction head, and the polishing unit is moved toward the first direction by relative movement of the correction head. The defect correction device according to claim 1 or 2, wherein the head wafer includes a convex bay curved surface that abuts against the polishing tape. The defect correction device according to the first or second aspect of the invention, wherein the polishing tape traveling mechanism includes: a winding up roll that winds a polishing tape used, and a supply roll that stores an unused polishing tape; Roll up volume The first rotation drive mechanism that drives the cylinder in the winding direction and the second rotation drive mechanism that drives the supply spool in the rewinding direction opposite to the winding direction, and is set to be the first in the polishing process. When the amount of winding of the polishing tape wound by the driving of the rotation driving mechanism is L1, and the amount of rewinding by the driving of the second rotation driving mechanism after the completion of the polishing process is L2, L1>L2. The defect correction device according to the first or second aspect of the invention, wherein the surface of the polishing tape whose polishing process has been completed is formed with a polishing mark having an oblique angle other than 0° and 90° with respect to a center line of the polishing tape. A defect correction device is a method for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, and is characterized by comprising: a table for holding a workpiece; and an elevated structure for a table edge The first moving mechanism moves the overhead structure; the correction head is attached to the overhead structure and is movable in a direction orthogonal to the moving direction; and the second moving mechanism is configured to Correcting the head mover; the correction head includes: a grinding unit for polishing the workpiece; and an optical head for observing defects existing in the workpiece; the grinding unit includes: a polishing belt traveling mechanism, The polishing tape traveler; the head wafer is such that the polishing tape abuts the surface of the workpiece; the guiding mechanism is to direct the head wafer toward the polishing tape a first direction guide in which the traveling direction of the tape is orthogonal; and a third moving mechanism that moves the head wafer relative to the polishing unit along the guiding mechanism; in the polishing process, the polishing unit The first moving mechanism or the second moving mechanism moves in a first direction orthogonal to a traveling direction of the polishing tape, and the head wafer is oriented along the first direction with respect to the polishing unit by the third moving mechanism. The polishing unit moves in a direction opposite to the opposite direction of movement; in the polishing process, the polishing unit and the head wafer are synchronized with each other and relatively move in opposite directions along the first direction, and the head wafer is opposite to the head wafer to be corrected. The defect remains in a substantially stationary state. A defect correction device is a method for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, and is characterized by comprising: a table for holding a workpiece; and an elevated structure for a table edge And a correction head that is mounted on the overhead structure and relatively movable; the correction head includes: a polishing unit that polishes the workpiece; and a first moving mechanism that grinds The unit is moved along the first direction; the polishing unit includes: a polishing tape traveling mechanism that causes the polishing tape to travel in a second direction orthogonal to the first direction; and the head wafer is attached to the front surface The first direction moves relatively, And the second moving mechanism moves the head wafer relative to the polishing unit in the first direction; and the polishing belt travels in the second direction during the polishing process. The polishing unit and the head wafer are synchronized with each other and relatively moved in opposite directions along the first direction, and the head wafer is maintained in a substantially stationary state with respect to the defect to be corrected. A belt grinding device for use in a defect correction device for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, characterized in that it comprises: a roll-up reel which winds up the abrasive tape The supply reel includes a polishing tape; the first rotation driving mechanism drives the winding reel in a direction in which the polishing tape is wound; and the second rotation driving mechanism guides the supply reel toward a winding direction driver having an opposite winding direction; a head wafer that abuts the surface of the workpiece; and a head wafer moving mechanism that moves the head wafer in a direction orthogonal to the traveling direction of the belt; In the polishing process in which the polishing tape travels while abutting against the convex defect, the head wafer is moved in a direction orthogonal to the traveling direction with respect to the traveling polishing tape in synchronization with the progress of the polishing tape. A belt grinding device as recited in claim 11, wherein the aforementioned head The wafer moving mechanism includes a guiding mechanism that supports the head wafer and guides the head wafer in a direction orthogonal to the traveling direction of the tape, and a moving mechanism that moves the head wafer along the guiding mechanism. The belt polishing apparatus according to claim 12, wherein the first rotation driving mechanism, the second rotation driving mechanism, the guiding mechanism, and the head wafer moving mechanism are attached to a single supporting member, and the head wafer is in the polishing process. The head wafer moving mechanism is relatively moved in a direction orthogonal to the traveling direction of the belt with respect to the support member. A defect correction method for correcting or removing a convex defect existing on a surface of a workpiece by a traveling abrasive tape, characterized by comprising: a step of lowering the polishing unit to abut the abrasive tape against the convex defect, The polishing unit is equipped with: a polishing tape traveling mechanism for advancing the polishing tape; a head wafer for abutting the polishing tape with a convex defect existing on the surface of the workpiece; and a head wafer moving mechanism for the head wafer a first direction shifter that is orthogonal to a belt traveling direction that is a traveling direction of the polishing tape; a defect correcting step of causing the polishing tape to travel to correct a convex defect on the surface of the workpiece; and after the defect correction processing is completed, the aforementioned a step of raising the polishing unit to a predetermined position; and in the defect correction step, the polishing unit and the head wafer are synchronized with each other and relatively moved in opposite directions along the first direction. The defect correction method according to claim 14, wherein in the polishing process, the head wafer is maintained substantially in a stationary state with respect to the workpiece. The defect correction method according to claim 14 or 15, wherein the grinding unit is mounted on the correction head, and the correction head is movably mounted on the elevated structure, and the elevated structure is configurable on the stage The workpiece moves relatively, and the movement of the grinding unit in the first direction is performed by relative movement of the overhead structure relative to the workpiece or relative movement of the correction head relative to the workpiece. The defect correction method according to claim 14 or 15, wherein the polishing unit is disposed on the correction head, and the correction head is relatively movably mounted on the elevated structure, and the elevated structure is configurable on the stage The workpiece moves relative to each other, and the polishing unit is attached to the correction head to move in a direction orthogonal to the traveling direction of the belt, and the movement of the polishing unit in the first direction is performed by relative movement of the polishing unit relative to the correction head. .