TW200732086A - Tape grinding method and device - Google Patents

Tape grinding method and device

Info

Publication number
TW200732086A
TW200732086A TW095136856A TW95136856A TW200732086A TW 200732086 A TW200732086 A TW 200732086A TW 095136856 A TW095136856 A TW 095136856A TW 95136856 A TW95136856 A TW 95136856A TW 200732086 A TW200732086 A TW 200732086A
Authority
TW
Taiwan
Prior art keywords
tape
abrasion
substrate
protrusion
head pin
Prior art date
Application number
TW095136856A
Other languages
Chinese (zh)
Inventor
Shizuka Yamazaki
Yuuji Yada
Original Assignee
Ntn Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ntn Toyo Bearing Co Ltd filed Critical Ntn Toyo Bearing Co Ltd
Publication of TW200732086A publication Critical patent/TW200732086A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention provides a tape abrasion method and a tape abrasion apparatus to perform a high precision abrasion process of protrusions both on a smooth surface of a substrate and a convex-concave surface of a back plate of a plasma display panel. The tape abrasion apparatus includes a table for supporting a substrate on an XY plane; and a tape abrasion unit including a head pin(10) and a sensor. The head pin has a front end contacting a back surface of an abrasion tape such that the head pin is movable in Z direction. The sensor detects measurement data which represent movement of the head pin moving in the direction getting far from the substrate along the Z direction or represent reception of force of the direction getting far from the substrate. The tape abrasion unit abrades a protrusion(22) formed on the surface of the substrate by the surface of the abrasion tape. A tape abrasion method includes a step of moving the tape abrasion unit toward a normal teeth surface and the protrusion of the substrate, detecting Z coordinates at the time of starting of the movement of the head pin in the direction getting far from the substrate or at the time of receiving force of the direction getting far from the substrate, setting Z coordinates on the normal teeth surface and Z coordinates on an apex(25) of the protrusion, and calculating the height of the protrusion based on the set Z coordinates; and a step of abrading the protrusion by using the abrasion tape based on the calculated height of the protrusion.
TW095136856A 2006-02-23 2006-10-04 Tape grinding method and device TW200732086A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006046877 2006-02-23
JP2006165033A JP2007253317A (en) 2006-02-23 2006-06-14 Tape grinding method and device

Publications (1)

Publication Number Publication Date
TW200732086A true TW200732086A (en) 2007-09-01

Family

ID=38613493

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136856A TW200732086A (en) 2006-02-23 2006-10-04 Tape grinding method and device

Country Status (3)

Country Link
JP (1) JP2007253317A (en)
KR (1) KR20070087480A (en)
TW (1) TW200732086A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413569B (en) * 2009-06-19 2013-11-01 Lasertec Corp Defect correction method and device
TWI725225B (en) * 2017-08-30 2021-04-21 日商荏原製作所股份有限公司 Grinding device and grinding method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008290166A (en) * 2007-05-23 2008-12-04 Lasertec Corp Tape grinding device and guide tool

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08229797A (en) * 1995-02-28 1996-09-10 Sanshin:Kk Foreign matter removing device for filter substrate
JPH09201760A (en) * 1996-01-30 1997-08-05 Matsushita Electric Ind Co Ltd Fine protrusion polishing device and method
JPH09309057A (en) * 1996-05-23 1997-12-02 Ntn Corp Foreign matter corrector device
JPH1071552A (en) * 1996-08-27 1998-03-17 Matsushita Electric Ind Co Ltd Minute projection grinding method and device
JP3446038B2 (en) * 1997-03-13 2003-09-16 シャープ株式会社 Method and apparatus for removing fine projections and method for manufacturing color filter
JP2002154041A (en) * 2000-11-17 2002-05-28 I M T Kk Polishing device
JP2002283206A (en) * 2001-03-28 2002-10-03 Toray Ind Inc Projected substance polishing method and polishing device
JP2003094312A (en) * 2001-09-20 2003-04-03 Sharp Corp Polishing device and method
JP3844705B2 (en) * 2002-03-13 2006-11-15 株式会社アクト・ブレイン Apparatus and method for repairing substrate defects
JP2005319576A (en) * 2004-04-06 2005-11-17 Opto One Kk Polishing device
JP4410042B2 (en) * 2004-06-28 2010-02-03 Ｎｔｎ株式会社 Fine pattern correction device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413569B (en) * 2009-06-19 2013-11-01 Lasertec Corp Defect correction method and device
TWI725225B (en) * 2017-08-30 2021-04-21 日商荏原製作所股份有限公司 Grinding device and grinding method

Also Published As

Publication number Publication date
KR20070087480A (en) 2007-08-28
JP2007253317A (en) 2007-10-04

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