JPH1071552A - Minute projection grinding method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out the grinding of a minute projection surely, by preventing the remaining of the projection owing to the reduction of the sharpness of a grinding tape, in a minute projection grinding method to grind a minute projection on the surface of a substrate by contacting the grinding tape. SOLUTION: A minute projection 10 on the surface of a substrate 2 is detected in noncontacting condition, the unused part of a grinding tape 11 is fed to the grinding position of a grinding head 9, and at the same time, the grinding head 9 is moved to the position of the minute projection, and it is reciprocated to grind the minute projection 10, while the grinding resistance in the grinding operation is measured by an elasticity maintaining means 16 and a displacement gage 15. When the grinding resistance is large, the feeding of the grinding tape 11 and the process of grinding are repeated, so as to carry out the grinding surely without making the reduction of the sharpness owing to a clogging of the grinding tape 11, and the generation of a residual projection is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for polishing fine projections for polishing and removing fine projections on a substrate such as a liquid crystal color filter.

[0002]

2. Description of the Related Art For example, in the case of a liquid crystal color filter, if fine projections having a height of about 10 .mu.m are formed on the surface thereof, the liquid crystal sealing portion is not uniform in thickness, so that the image quality of the liquid crystal display device is deteriorated.

Conventionally, in order to improve the image quality of a liquid crystal display device by making the thickness of a liquid crystal enclosing portion uniform, a method of polishing by bringing a polishing tape into contact with minute projections on the surface of a liquid crystal color filter has been adopted. Specifically, the non-contact detection means detects the micro projections on the substrate surface in a non-contact manner, supplies an unused portion of the polishing tape to the polishing position of the polishing head, moves the polishing head to the position of the micro projections, and moves the polishing head to the position. The polishing head is reciprocated to grind the minute projections.

Referring to FIG. 4, the detailed structure of the polishing head will be described. A polishing head 21 is used to supply a polishing tape 22 supplied to a contact wheel 25 by a supply reel 23 and a take-up reel 24 to a tape lock 26. The polishing tape 22 is pressed and fixed to the contact wheel 25 through the contact wheel 25 by the pressing means 27.
0, and in this state, the polishing head 21 is reciprocated by reciprocating means (not shown) so that the fine protrusions 10 are formed.
Is configured to be polished.

[0005]

However, the microprojection polishing apparatus having the above configuration has the following problems. That is, there is a problem that the sharpness of the polishing tape 22 is reduced due to the clogging of the polishing tape 22, the processing amount is reduced, and the protrusion residue is increased. Further, when the hardness of the foreign matter in the projection is large, there is a problem that the foreign matter may be damaged when the foreign matter is forcibly removed.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a method and an apparatus for polishing microprojections, which can prevent the projections from remaining due to a decrease in sharpness of the polishing tape and can reliably polish the microprojections. And

[0007]

According to the present invention, there is provided a method for polishing fine projections, which comprises polishing a fine projection on a surface of a substrate by bringing a polishing tape into contact therewith. Detecting step, a supplying step of supplying an unused portion of the polishing tape to the polishing position of the polishing head, a moving step of moving the polishing head to the position of the fine projection, and reciprocating the polishing head to remove the fine projection. A polishing step of polishing, and a step of repeating the supply step and the polishing step as necessary based on information obtained by measuring the polishing resistance during polishing, and when the polishing resistance is large, a polishing tape is used. By repeating the process of supplying and polishing, the polishing of the fine projections is surely performed without lowering the sharpness due to the clogging of the polishing tape, and the occurrence of the projection remaining is prevented, and And to prevent damage to the substrate surface also securely polished is large hardness of the object.

Further, the microprojection polishing apparatus of the present invention comprises a non-contact detecting means for detecting the microprojections without contacting the surface of the substrate, and a reciprocating motion with the polishing tape held at the polishing position to detect the microprojections. A polishing head for polishing, a polishing tape supply means for supplying an unused portion of the polishing tape to the polishing position of the polishing head, a moving means for moving the polishing head to the fine projection position, and a reciprocating polishing head for polishing the fine projections It is provided with a means for moving and a means for detecting the polishing resistance, so that the above-mentioned polishing method is carried out.

The means for detecting the polishing resistance comprises means for elastically displacing the polishing head and means for detecting the displacement of the polishing head, so that the polishing resistance can be detected simply and reliably. Can be.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the fine projection polishing apparatus of the present invention will be described below with reference to FIGS.

In FIG. 1 and FIG. 2, reference numeral 1 denotes a fine projection polishing apparatus which reciprocates while a polishing tape 11 is in contact with a fine projection 10 on the surface of a liquid crystal color filter 2 as a substrate. 10 is an apparatus for polishing. The liquid crystal color filter 2 is suction-fixed by a suction stage 7. Reference numeral 3 denotes a camera for observing the polishing state of the minute projections 10 and the like, which is disposed on the side of the polishing head 9. An X stage 4 moves the Z stage 6 in the X axis direction, and the Z stage 6 moves the polishing head 9 and the camera 3 in the Z axis direction. Reference numeral 5 denotes a Y stage, which moves the suction stage 7 in the Y axis direction. 8 is a polishing head 9
Air microsensors arranged on both sides of the microprotrusions. The microprobes are configured to measure the distance between opposing measurement portions at minute intervals by a change in air pressure. It is used as a detecting means.

The polishing tape 11 is a tape composed of abrasive grains for actually polishing the minute projections 10 and a tape base material. As a specific example, the abrasive grains have an average particle diameter of 0.1 to 10 μm.
m of aluminum oxide, and the tape substrate has a thickness of 25
It is made of a polyester tape having a thickness of 2.8 mm and a width of 2.8 mm, and the abrasive grains are fixed to the tape base with sufficient strength so as not to fall off with an adhesive.

The polishing head 9 has a function of holding the polishing tape 11 and pressing the polishing tape 11 against the minute projections 10 during polishing. The specific configuration of the polishing head 9 is basically the same as that of the conventional example described with reference to FIG. 4, and the description thereof will be omitted here. This polishing head 9
As shown in FIG. 3, it is attached to the lower end of a swinging rod 18 supported swingably at a fulcrum 17, and the upper part of the swinging rod 18 is held by an elastic holding means 16 so as to be elastically displaceable. Further, a displacement gauge 15 for detecting the displacement of the swinging rod 18 is provided. In FIG. 3, 19a to 19d are polishing tapes 1
1 is a guide roller for guiding 1 to the polishing head 9.

The means for supplying the polishing tape 11 includes a polishing tape cassette 12 disposed above the polishing head 9. The polishing tape cassette 12 includes a supply reel 13 and a take-up reel 14, and is configured to pass the polishing tape 11 coming out of the supply reel 13 through the polishing head 9 and take up the same on the take-up reel 14. Further, although not shown,
The polishing tape supply means is provided with a tape intermittent feeding means, and stops the polishing tape 11 when an unused portion of the polishing tape 11 is supplied to the polishing position of the polishing head 9.

The operation of polishing the minute projections 10 on the surface of the liquid crystal color filter 2 in the above configuration will be described.
Air micro sensor 8 with X stage 4 and Y stage 5
Is moved along the surface of the liquid crystal color filter 2 to detect the position of the minute projection 10, and the polishing head 9 is moved by the X stage 4 and the Y stage 5 based on the information obtained by the air microsensor 8. Move to position 10. Then, the Z stage 6 is lowered, the polishing tape 9 is brought into contact with the fine projections 10 by the polishing head 9, and the fine projections 10 are polished by reciprocating the polishing head 9 by reciprocating means (not shown). Also, during polishing, the Y stage 5
The entire width of the polishing tape 11 can be used for polishing by moving the liquid crystal color filter 2, that is, the minute projections 10.

If the polishing tape 11 becomes clogged during the polishing operation and the polishing resistance increases, the elastic holding means 16
Is displaced and the swinging rod 18 is displaced.
It is detected by. In this way, when the displacement gauge 15 detects that the polishing resistance has increased, the polishing is interrupted, the portion used for polishing the polishing tape 11 is moved from the polishing position, and the unused portion of the polishing tape 11 is polished. It is supplied to the polishing position of the head 9. Then, the operation of performing the polishing operation again is repeated, and the fine protrusions 10 are surely polished by preventing the sharpness of the polishing tape 11 from decreasing due to clogging of the polishing tape 11 or the like.

When the polishing of one microprojection 10 is completed, the portion of the polishing tape 11 used for polishing is moved from the polishing position, and the unused portion of the polishing tape 11 is supplied to the polishing position of the polishing head 9. The above-mentioned polishing operation is performed on the minute projections 10, and the above operation is repeated.

According to this embodiment, when the polishing resistance is high as described above, the operation of interrupting the polishing, supplying an unused portion of the polishing tape and performing the repolishing is repeated. The sharpness of the polishing tape 11 can be prevented from lowering due to clogging of the polishing tape 11, and the fine protrusions 10 can be surely polished without generating polishing residue. Further, even when the hardness of the foreign matter in the minute projections 10 is large, the polishing can be performed without damaging the surface.

[0019]

According to the method for polishing microprojections of the present invention, as is apparent from the above description, the step of detecting microprojections,
A polishing step of supplying a polishing tape to a polishing position of the polishing head, a step of moving the polishing head, and a polishing step of polishing the micro projections by reciprocating the polishing head; It has a step of repeating the step of supplying and polishing the polishing tape as needed based on the information obtained by measuring the polishing resistance of,
If the polishing resistance is large, the process of supplying and polishing the polishing tape is repeated, so that the fine protrusions can be reliably polished without lowering the sharpness due to clogging of the polishing tape, and the protrusion remaining Can be prevented, and even when the hardness of the foreign matter in the protrusion is large, the polishing can be surely performed to prevent the substrate surface from being damaged.

According to the fine projection polishing apparatus of the present invention, the non-contact detecting means for detecting the fine projection without contacting the surface of the substrate, and the fine projection by reciprocating while holding the polishing tape at the polishing position. A polishing head for polishing projections, a polishing tape supply means for supplying an unused portion of the polishing tape to a polishing position of the polishing head, a moving means for moving the polishing head to the fine projection position, and a polishing head for polishing the fine projections And a means for detecting the polishing resistance, so that the above-mentioned polishing method can be carried out.

Further, if the means for detecting the polishing resistance is constituted by means for elastically displacing the polishing head and means for detecting the displacement of the polishing head, the polishing resistance can be detected simply and reliably. Can be.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of one embodiment of a microprojection polishing apparatus of the present invention.

FIG. 2 is a perspective view of a main part of the embodiment.

FIG. 3 is a schematic configuration diagram of a polishing head unit of the embodiment.

FIG. 4 is a schematic configuration diagram of a polishing head section in a conventional fine projection polishing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Microprojection polishing apparatus 2 Liquid crystal color filter (substrate) 4 X stage (moving means) 5 Y stage (moving means) 8 Air microsensor (non-contact detecting means) 9 Polishing head 10 Microprojection 11 Polishing tape 12 Polishing tape cassette ( Polishing tape supply means) 15 displacement meter 16 elastic holding means

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideyuki Ishimaru 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] A method for polishing a micro-projection by bringing a polishing tape into contact with a micro-projection on a surface of a substrate; and detecting a micro-projection without contacting the substrate surface.
A supply step of supplying an unused portion of the polishing tape to a polishing position of the polishing head, a moving step of moving the polishing head to the position of the fine projection, a polishing step of reciprocating the polishing head to polish the fine projection, and polishing. A polishing method for fine projections, comprising a step of repeating a supply step and a polishing step as necessary based on information obtained by measuring a polishing resistance in the fine projections. 2. A non-contact detecting means for detecting fine projections without contacting the surface of a substrate, a polishing head for reciprocating and polishing the fine projections while holding the polishing tape at a polishing position, and a polishing tape. Polishing tape supply means for supplying an unused portion to the polishing position of the polishing head, moving means for moving the polishing head to the fine projection position, means for reciprocating the polishing head for polishing the fine projection, and detecting the polishing resistance And a means for polishing the fine projections. 3. The polishing apparatus according to claim 2, wherein the means for detecting the polishing resistance comprises means for elastically displacing the polishing head and means for detecting the displacement of the polishing head. apparatus.