JPWO2008081593A1 - 発光素子用積層体、及び発光素子 - Google Patents

発光素子用積層体、及び発光素子 Download PDF

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Publication number
JPWO2008081593A1
JPWO2008081593A1 JP2008552027A JP2008552027A JPWO2008081593A1 JP WO2008081593 A1 JPWO2008081593 A1 JP WO2008081593A1 JP 2008552027 A JP2008552027 A JP 2008552027A JP 2008552027 A JP2008552027 A JP 2008552027A JP WO2008081593 A1 JPWO2008081593 A1 JP WO2008081593A1
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JP
Japan
Prior art keywords
light emitting
resin
layer
oxygen
conjugated diene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008552027A
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English (en)
Japanese (ja)
Inventor
田中　明
明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Publication of JPWO2008081593A1 publication Critical patent/JPWO2008081593A1/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
JP2008552027A 2006-12-28 2007-12-27 発光素子用積層体、及び発光素子 Pending JPWO2008081593A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006355494 2006-12-28
JP2006355494 2006-12-28
PCT/JP2007/001484 WO2008081593A1 (fr) 2006-12-28 2007-12-27 Corps laminé pour élément émetteur de lumière et cet élément

Publications (1)

Publication Number Publication Date
JPWO2008081593A1 true JPWO2008081593A1 (ja) 2010-04-30

Family

ID=39588282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008552027A Pending JPWO2008081593A1 (ja) 2006-12-28 2007-12-27 発光素子用積層体、及び発光素子

Country Status (3)

Country Link
JP (1) JPWO2008081593A1 (fr)
TW (1) TW200847838A (fr)
WO (1) WO2008081593A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472109B2 (ja) * 2008-08-26 2014-04-16 三菱瓦斯化学株式会社 脱酸素性多層体
KR101464813B1 (ko) 2009-05-18 2014-11-24 미츠비시 가스 가가쿠 가부시키가이샤 탈산소성 다층체
US9000442B2 (en) * 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
JP2011222334A (ja) * 2010-04-09 2011-11-04 Dainippon Printing Co Ltd 熱伝導性封止部材および素子
JP5679507B2 (ja) * 2010-07-16 2015-03-04 住友ベークライト株式会社 積層フィルムおよび包装体
JP2013069480A (ja) * 2011-09-21 2013-04-18 Semiconductor Energy Lab Co Ltd 発光装置、電子機器、及び照明装置
JP2016066607A (ja) * 2014-09-18 2016-04-28 株式会社半導体エネルギー研究所 剥離方法、発光装置、モジュール、及び電子機器
JP6655403B2 (ja) * 2016-01-26 2020-02-26 住友化学株式会社 発光装置
CN111952484B (zh) * 2020-06-29 2022-06-28 南京冠石科技股份有限公司 一种柔性oled器件的加工工艺
JP7444309B2 (ja) 2022-04-26 2024-03-06 大日本印刷株式会社 自発光型表示体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004781A (ja) * 2004-06-17 2006-01-05 Tohoku Pioneer Corp 有機ｅｌ素子および有機ｅｌ表示パネル
WO2006080526A1 (fr) * 2005-01-31 2006-08-03 Zeon Corporation Réservoir d’étanchéité pour élément luminescent et corps lumineux
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004650A (ja) * 2004-06-15 2006-01-05 Toshiba Matsushita Display Technology Co Ltd 表示素子及び光学デバイス
TWI381765B (zh) * 2005-01-28 2013-01-01 Zeon Corp And a light-emitting element for a light-emitting element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006004781A (ja) * 2004-06-17 2006-01-05 Tohoku Pioneer Corp 有機ｅｌ素子および有機ｅｌ表示パネル
WO2006080526A1 (fr) * 2005-01-31 2006-08-03 Zeon Corporation Réservoir d’étanchéité pour élément luminescent et corps lumineux
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法

Also Published As

Publication number Publication date
WO2008081593A1 (fr) 2008-07-10
TW200847838A (en) 2008-12-01

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