JPWO2008023776A1 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JPWO2008023776A1 JPWO2008023776A1 JP2008530957A JP2008530957A JPWO2008023776A1 JP WO2008023776 A1 JPWO2008023776 A1 JP WO2008023776A1 JP 2008530957 A JP2008530957 A JP 2008530957A JP 2008530957 A JP2008530957 A JP 2008530957A JP WO2008023776 A1 JPWO2008023776 A1 JP WO2008023776A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 149
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000004020 conductor Substances 0.000 claims abstract description 43
- 239000012212 insulator Substances 0.000 claims description 40
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 131
- 239000010408 film Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 13
- 230000010354 integration Effects 0.000 description 10
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
Abstract
Description
2a、2b、2c;半導体層
3a、3b;ソース・ドレイン領域
4;ゲート絶縁膜
5a、5b、5c、5d;ゲート電極
7a、7b;導体
11、12;半導体層
13、14;絶縁体
Claims (9)
- 基板と、この基板上に形成されたソース領域及びドレイン領域と、前記基板上の前記ソース領域及びドレイン領域間に相互に離隔して積層された複数個のチャネル形成領域と、前記各チャネル形成領域を挟むように形成された複数個のゲート電極と、前記各チャネル形成領域とこれに隣接する1対の前記ゲート電極の少なくとも一方との間に形成されたゲート絶縁膜と、を有し、前記各チャネル形成領域は前記ゲート電極のいずれかによって相互に離間され、前記各チャネル形成領域に隣接する前記ゲート電極同士は相互に短絡されていないことを特徴とする半導体装置。
- 前記各チャネル形成領域とこれに隣接する1対の前記ゲート電極の双方との間に前記ゲート絶縁膜が形成されていることを特徴とする請求項1に記載の半導体装置。
- 前記ソース領域と前記ドレイン領域とが、前記複数個のチャネル形成領域に亘って夫々連続した半導体領域であることを特徴とする請求項1に記載の半導体装置。
- 相互に隣接する1対の前記チャネル形成領域の間に配置された前記ゲート電極は、前記1対のチャネル形成領域の双方に対して共通のゲート電極であることを特徴とする請求項1に記載の半導体装置。
- 前記基板側から奇数番目の前記ゲート電極は、第1の共通配線に接続された第1の導体に短絡され、前記基板側から偶数番目の前記ゲート電極は、第2の共通配線に接続された第2の導体に短絡されていることを特徴とする請求項1に記載の半導体装置。
- 前記基板側から奇数番目の前記ゲート電極を相互に短絡する前記第1の導体は、前記基板に立設された第1の絶縁体側壁によって偶数番目の前記ゲート電極から絶縁され、前記基板側から偶数番目の前記ゲート電極を相互に短絡する前記第2の導体は、前記基板に立設された第2の絶縁体側壁によって奇数番目の前記ゲート電極から絶縁されていることを特徴とする請求項5に記載の半導体装置。
- 前記チャネル形成領域が単結晶の半導体層からなることを特徴とする請求項1に記載の半導体装置。
- 第1の材料からなる第1の半導体層と第2の材料からなる第2の半導体層とを基板上に交互に積層する工程と、前記第1及び第2の半導体層を絶縁体内に埋設する工程と、前記第1の半導体層を選択的に除去して前記絶縁体内に空洞を形成する工程と、前記空洞内にゲート電極を埋め込む工程と、前記基板側から奇数番目の前記ゲート電極に接続する第1の導体を形成する工程と、前記基板側から偶数番目の前記ゲート電極に接続する第2の導体を形成する工程と、を有することを特徴とする半導体装置の製造方法。
- 前記第1の半導体層と前記第2の半導体層とを前記基板上に交互に積層する工程は、前記基板上に形成された単結晶の前記第1の半導体層上に、前記第2の半導体層と前記第1の半導体層とを交互に順次エピタキシャル成長させるものであることを特徴とする請求項8に記載の半導体装置の製造方法。
Priority Applications (1)
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JP2008530957A JP5544715B2 (ja) | 2006-08-23 | 2007-08-23 | 半導体装置及びその製造方法 |
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JP2006226821 | 2006-08-23 | ||
JP2006226821 | 2006-08-23 | ||
JP2008530957A JP5544715B2 (ja) | 2006-08-23 | 2007-08-23 | 半導体装置及びその製造方法 |
PCT/JP2007/066397 WO2008023776A1 (fr) | 2006-08-23 | 2007-08-23 | Dispositif à semi-conducteur et son procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
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JPWO2008023776A1 true JPWO2008023776A1 (ja) | 2010-01-14 |
JP5544715B2 JP5544715B2 (ja) | 2014-07-09 |
Family
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JP2008530957A Expired - Fee Related JP5544715B2 (ja) | 2006-08-23 | 2007-08-23 | 半導体装置及びその製造方法 |
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JP (1) | JP5544715B2 (ja) |
WO (1) | WO2008023776A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013138191A (ja) * | 2011-12-01 | 2013-07-11 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102196949B1 (ko) * | 2013-03-29 | 2020-12-30 | 엘지디스플레이 주식회사 | 박막 트랜지스터, 박막 트랜지스터 제조 방법 및 박막 트랜지스터를 포함하는 표시 장치 |
CN109716533A (zh) * | 2016-09-20 | 2019-05-03 | 夏普株式会社 | 半导体装置和显示装置 |
TWI791078B (zh) | 2018-01-30 | 2023-02-01 | 日商索尼半導體解決方案公司 | 半導體裝置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63102264A (ja) * | 1986-10-20 | 1988-05-07 | Nissan Motor Co Ltd | 薄膜半導体装置 |
JPH0465868A (ja) * | 1990-07-06 | 1992-03-02 | Kawasaki Steel Corp | Mos形トランジスタ |
JPH0548108A (ja) * | 1991-08-08 | 1993-02-26 | Fujitsu Ltd | 半導体装置およびその製造方法 |
JP3312409B2 (ja) * | 1993-01-13 | 2002-08-05 | ソニー株式会社 | 多層配線構造の半導体装置 |
JPH06291269A (ja) * | 1993-04-06 | 1994-10-18 | Sony Corp | 電界効果トランジスタ |
JP2003008008A (ja) * | 2001-06-22 | 2003-01-10 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置およびその製造方法 |
JP3793808B2 (ja) * | 2002-05-02 | 2006-07-05 | 国立大学法人東京工業大学 | 電界効果トランジスタの製造方法 |
-
2007
- 2007-08-23 JP JP2008530957A patent/JP5544715B2/ja not_active Expired - Fee Related
- 2007-08-23 WO PCT/JP2007/066397 patent/WO2008023776A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013138191A (ja) * | 2011-12-01 | 2013-07-11 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
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WO2008023776A1 (fr) | 2008-02-28 |
JP5544715B2 (ja) | 2014-07-09 |
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