JPS6489541A - Multilayer interconnection semiconductor device - Google Patents

Multilayer interconnection semiconductor device

Info

Publication number
JPS6489541A
JPS6489541A JP24832987A JP24832987A JPS6489541A JP S6489541 A JPS6489541 A JP S6489541A JP 24832987 A JP24832987 A JP 24832987A JP 24832987 A JP24832987 A JP 24832987A JP S6489541 A JPS6489541 A JP S6489541A
Authority
JP
Japan
Prior art keywords
interconnection
lower layer
layer interconnection
via hole
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24832987A
Other languages
English (en)
Inventor
Tsutomu Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24832987A priority Critical patent/JPS6489541A/ja
Publication of JPS6489541A publication Critical patent/JPS6489541A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP24832987A 1987-09-30 1987-09-30 Multilayer interconnection semiconductor device Pending JPS6489541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24832987A JPS6489541A (en) 1987-09-30 1987-09-30 Multilayer interconnection semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24832987A JPS6489541A (en) 1987-09-30 1987-09-30 Multilayer interconnection semiconductor device

Publications (1)

Publication Number Publication Date
JPS6489541A true JPS6489541A (en) 1989-04-04

Family

ID=17176462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24832987A Pending JPS6489541A (en) 1987-09-30 1987-09-30 Multilayer interconnection semiconductor device

Country Status (1)

Country Link
JP (1) JPS6489541A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619072A (en) * 1995-02-09 1997-04-08 Advanced Micro Devices, Inc. High density multi-level metallization and interconnection structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173857A (ja) * 1984-02-20 1985-09-07 Toshiba Corp 半導体装置の製造方法
JPS6148940A (ja) * 1984-08-16 1986-03-10 Matsushita Electronics Corp 半導体装置の電極形成方法
JPS62166546A (ja) * 1986-01-20 1987-07-23 Sanyo Electric Co Ltd 配線形成方法
JPS63172445A (ja) * 1987-01-10 1988-07-16 Fujitsu Ltd 多層配線の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173857A (ja) * 1984-02-20 1985-09-07 Toshiba Corp 半導体装置の製造方法
JPS6148940A (ja) * 1984-08-16 1986-03-10 Matsushita Electronics Corp 半導体装置の電極形成方法
JPS62166546A (ja) * 1986-01-20 1987-07-23 Sanyo Electric Co Ltd 配線形成方法
JPS63172445A (ja) * 1987-01-10 1988-07-16 Fujitsu Ltd 多層配線の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619072A (en) * 1995-02-09 1997-04-08 Advanced Micro Devices, Inc. High density multi-level metallization and interconnection structure

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