JPS6489527A - Schottky diode - Google Patents

Schottky diode

Info

Publication number
JPS6489527A
JPS6489527A JP62248313A JP24831387A JPS6489527A JP S6489527 A JPS6489527 A JP S6489527A JP 62248313 A JP62248313 A JP 62248313A JP 24831387 A JP24831387 A JP 24831387A JP S6489527 A JPS6489527 A JP S6489527A
Authority
JP
Japan
Prior art keywords
ring
schottky
insulating film
shaped
schottky junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62248313A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0583179B2 (https=
Inventor
Takeshi Ogawa
Takeshi Kajimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62248313A priority Critical patent/JPS6489527A/ja
Publication of JPS6489527A publication Critical patent/JPS6489527A/ja
Publication of JPH0583179B2 publication Critical patent/JPH0583179B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
JP62248313A 1987-09-30 1987-09-30 Schottky diode Granted JPS6489527A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62248313A JPS6489527A (en) 1987-09-30 1987-09-30 Schottky diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62248313A JPS6489527A (en) 1987-09-30 1987-09-30 Schottky diode

Publications (2)

Publication Number Publication Date
JPS6489527A true JPS6489527A (en) 1989-04-04
JPH0583179B2 JPH0583179B2 (https=) 1993-11-25

Family

ID=17176216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62248313A Granted JPS6489527A (en) 1987-09-30 1987-09-30 Schottky diode

Country Status (1)

Country Link
JP (1) JPS6489527A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5746513A (en) * 1994-09-01 1998-05-05 Sensarray Corporation Temperature calibration substrate
JP2003007976A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp 半導体装置及びモジュール装置
CN113169224A (zh) * 2018-12-27 2021-07-23 京瓷株式会社 电路以及电气装置
CN113196502A (zh) * 2018-12-27 2021-07-30 京瓷株式会社 串联二极管、电路以及电气装置
DE102017103111B4 (de) 2017-02-16 2025-03-13 Semikron Elektronik Gmbh & Co. Kg Halbleiterdiode und elektronische Schaltungsanordnung hiermit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5746513A (en) * 1994-09-01 1998-05-05 Sensarray Corporation Temperature calibration substrate
JP2003007976A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp 半導体装置及びモジュール装置
DE102017103111B4 (de) 2017-02-16 2025-03-13 Semikron Elektronik Gmbh & Co. Kg Halbleiterdiode und elektronische Schaltungsanordnung hiermit
CN113169224A (zh) * 2018-12-27 2021-07-23 京瓷株式会社 电路以及电气装置
CN113196502A (zh) * 2018-12-27 2021-07-30 京瓷株式会社 串联二极管、电路以及电气装置
CN113169224B (zh) * 2018-12-27 2024-07-23 京瓷株式会社 电路以及电气装置
CN113196502B (zh) * 2018-12-27 2024-11-19 京瓷株式会社 串联二极管、电路以及电气装置

Also Published As

Publication number Publication date
JPH0583179B2 (https=) 1993-11-25

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