JPS5698843A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5698843A
JPS5698843A JP116680A JP116680A JPS5698843A JP S5698843 A JPS5698843 A JP S5698843A JP 116680 A JP116680 A JP 116680A JP 116680 A JP116680 A JP 116680A JP S5698843 A JPS5698843 A JP S5698843A
Authority
JP
Japan
Prior art keywords
electrode
resist
mask
protruded
around
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP116680A
Other languages
Japanese (ja)
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP116680A priority Critical patent/JPS5698843A/en
Publication of JPS5698843A publication Critical patent/JPS5698843A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the fused metal with lower melting point from intruding around the base part of the electrode, by adhering closely the photoresist film around the protruded part of the electrode. CONSTITUTION:The part 3 can be obtained by covering with resist mask 11 and electroplating the wafer with Al electrode 7 and the barrier metal 9. Protrusion of the electrode is as high as possible with the mask as thin as possible. When the mask is removed, the resist 11 remains as the solution does not penetrate well enough to the lower part of the part 3. Therefore the resist can be adhered around the protruded part of the electrode without any additional process of manufacturing, and no fused metal intrude at the back part of the protruded electrode when lead wire is connected, preventing the peel-off of the electrode and obtaining higher reliability and better yield.
JP116680A 1980-01-09 1980-01-09 Preparation of semiconductor device Pending JPS5698843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP116680A JPS5698843A (en) 1980-01-09 1980-01-09 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP116680A JPS5698843A (en) 1980-01-09 1980-01-09 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5698843A true JPS5698843A (en) 1981-08-08

Family

ID=11493847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP116680A Pending JPS5698843A (en) 1980-01-09 1980-01-09 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5698843A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853853A (en) * 1981-09-26 1983-03-30 Nec Corp Electronic circuit structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853853A (en) * 1981-09-26 1983-03-30 Nec Corp Electronic circuit structure
JPS6347150B2 (en) * 1981-09-26 1988-09-20 Nippon Denki Kk

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