JPS5465477A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5465477A
JPS5465477A JP13264277A JP13264277A JPS5465477A JP S5465477 A JPS5465477 A JP S5465477A JP 13264277 A JP13264277 A JP 13264277A JP 13264277 A JP13264277 A JP 13264277A JP S5465477 A JPS5465477 A JP S5465477A
Authority
JP
Japan
Prior art keywords
pellet
base
resin
mesa groove
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13264277A
Other languages
Japanese (ja)
Other versions
JPS5951741B2 (en
Inventor
Masahiro Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13264277A priority Critical patent/JPS5951741B2/en
Publication of JPS5465477A publication Critical patent/JPS5465477A/en
Publication of JPS5951741B2 publication Critical patent/JPS5951741B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent occurrence of short circuit between the pellet and the base at the area outside the mesa groove as well as to avoid the breakdown of the pellet, by providing an easy-to-stick layer to the solder only at the base part opposing to the region surrounded by the mesa groove of the pellet.
CONSTITUTION: Electrode 2a is surrounded by mesa groove 3 of the pellet. Layer 15 of silver or the like which is easy to stick to the solder is coated selectively at the area opposing to electrode 2a of base 4 and at a little more inside than the periphery of electrode 2a. Solder 6 does not flow out to the areas except for the part where silver 15 of base 4 exists, so no short circuit is caused between the pellet and the base owing to occurrence of gap 13. Furthermore, the amount of resin 9 entering the gap is small, so the expansion and compression of resin 9 caused by sudden cooling is reduced. Thus, the pellet cracking is prevented at the mesa groove area.
COPYRIGHT: (C)1979,JPO&Japio
JP13264277A 1977-11-04 1977-11-04 Resin-encapsulated semiconductor device Expired JPS5951741B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13264277A JPS5951741B2 (en) 1977-11-04 1977-11-04 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13264277A JPS5951741B2 (en) 1977-11-04 1977-11-04 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS5465477A true JPS5465477A (en) 1979-05-26
JPS5951741B2 JPS5951741B2 (en) 1984-12-15

Family

ID=15086090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13264277A Expired JPS5951741B2 (en) 1977-11-04 1977-11-04 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS5951741B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016105508A (en) * 2016-02-29 2016-06-09 株式会社三社電機製作所 Semiconductor device
WO2017099122A1 (en) * 2015-12-11 2017-06-15 ローム株式会社 Semiconductor device
US10892319B2 (en) 2016-08-19 2021-01-12 Rohm Co., Ltd. Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0581038U (en) * 1992-03-31 1993-11-02 トッパン・ムーア株式会社 Envelope with card

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099122A1 (en) * 2015-12-11 2017-06-15 ローム株式会社 Semiconductor device
JPWO2017099122A1 (en) * 2015-12-11 2018-09-27 ローム株式会社 Semiconductor device
US10366905B2 (en) 2015-12-11 2019-07-30 Rohm Co., Ltd. Semiconductor device
US10832922B2 (en) 2015-12-11 2020-11-10 Rohm Co., Ltd. Semiconductor device
JP2016105508A (en) * 2016-02-29 2016-06-09 株式会社三社電機製作所 Semiconductor device
US10892319B2 (en) 2016-08-19 2021-01-12 Rohm Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPS5951741B2 (en) 1984-12-15

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