JPS6484625A - Semiconductor integrated circuit device using film carrier - Google Patents
Semiconductor integrated circuit device using film carrierInfo
- Publication number
- JPS6484625A JPS6484625A JP62240856A JP24085687A JPS6484625A JP S6484625 A JPS6484625 A JP S6484625A JP 62240856 A JP62240856 A JP 62240856A JP 24085687 A JP24085687 A JP 24085687A JP S6484625 A JPS6484625 A JP S6484625A
- Authority
- JP
- Japan
- Prior art keywords
- high speed
- integrated circuit
- grounding potential
- semiconductor integrated
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240856A JPS6484625A (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240856A JPS6484625A (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6484625A true JPS6484625A (en) | 1989-03-29 |
Family
ID=17065727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62240856A Pending JPS6484625A (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6484625A (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02159013A (ja) * | 1988-12-13 | 1990-06-19 | Shinko Electric Ind Co Ltd | 高周波半導体デバイス用のtabテープ |
DE4117761A1 (de) * | 1990-06-01 | 1991-12-05 | Toshiba Kawasaki Kk | Halbleiteranordnung mit filmtraeger |
JPH05235109A (ja) * | 1992-02-19 | 1993-09-10 | Sumitomo Metal Mining Co Ltd | グラウンド金属プレーン付きコプレナー型テープキャリアおよびその製造方法 |
JPH05283487A (ja) * | 1992-04-03 | 1993-10-29 | Mitsubishi Electric Corp | 高周波信号用配線及びそのボンディング装置 |
DE10142483A1 (de) * | 2001-08-31 | 2003-04-03 | Infineon Technologies Ag | Elektronisches Bauteil mit Außenflachleitern und ein Verfahren zu seiner Herstellung |
JP2011023528A (ja) * | 2009-07-15 | 2011-02-03 | Renesas Electronics Corp | 半導体装置 |
JP2012160728A (ja) * | 2011-01-28 | 2012-08-23 | Lusem Co Ltd | 改善された放熱効率を有するcof型半導体パッケージ |
JP2013123069A (ja) * | 2013-01-25 | 2013-06-20 | Renesas Electronics Corp | 半導体装置 |
JP2021103800A (ja) * | 2019-08-27 | 2021-07-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
1987
- 1987-09-28 JP JP62240856A patent/JPS6484625A/ja active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02159013A (ja) * | 1988-12-13 | 1990-06-19 | Shinko Electric Ind Co Ltd | 高周波半導体デバイス用のtabテープ |
DE4117761A1 (de) * | 1990-06-01 | 1991-12-05 | Toshiba Kawasaki Kk | Halbleiteranordnung mit filmtraeger |
JPH05235109A (ja) * | 1992-02-19 | 1993-09-10 | Sumitomo Metal Mining Co Ltd | グラウンド金属プレーン付きコプレナー型テープキャリアおよびその製造方法 |
JPH05283487A (ja) * | 1992-04-03 | 1993-10-29 | Mitsubishi Electric Corp | 高周波信号用配線及びそのボンディング装置 |
DE10142483B4 (de) * | 2001-08-31 | 2006-12-14 | Infineon Technologies Ag | Elektronisches Bauteil mit Außenflachleitern und ein Verfahren zu seiner Herstellung |
US6825549B2 (en) | 2001-08-31 | 2004-11-30 | Infineon Technologies Ag | Electronic component with external flat conductors and a method for producing the electronic component |
DE10142483A1 (de) * | 2001-08-31 | 2003-04-03 | Infineon Technologies Ag | Elektronisches Bauteil mit Außenflachleitern und ein Verfahren zu seiner Herstellung |
JP2011023528A (ja) * | 2009-07-15 | 2011-02-03 | Renesas Electronics Corp | 半導体装置 |
US8384230B2 (en) | 2009-07-15 | 2013-02-26 | Renesas Electronics Corporation | Semiconductor device |
US8686574B2 (en) | 2009-07-15 | 2014-04-01 | Renesas Electronics Corporation | Semiconductor device |
US8975762B2 (en) | 2009-07-15 | 2015-03-10 | Renesas Electronics Corporation | Semiconductor device |
US11244883B2 (en) | 2009-07-15 | 2022-02-08 | Renesas Electronics Corporation | Semiconductor device |
JP2012160728A (ja) * | 2011-01-28 | 2012-08-23 | Lusem Co Ltd | 改善された放熱効率を有するcof型半導体パッケージ |
JP2013123069A (ja) * | 2013-01-25 | 2013-06-20 | Renesas Electronics Corp | 半導体装置 |
JP2021103800A (ja) * | 2019-08-27 | 2021-07-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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