JPS6484626A - Semiconductor integrated circuit device using film carrier - Google Patents
Semiconductor integrated circuit device using film carrierInfo
- Publication number
- JPS6484626A JPS6484626A JP62240857A JP24085787A JPS6484626A JP S6484626 A JPS6484626 A JP S6484626A JP 62240857 A JP62240857 A JP 62240857A JP 24085787 A JP24085787 A JP 24085787A JP S6484626 A JPS6484626 A JP S6484626A
- Authority
- JP
- Japan
- Prior art keywords
- high speed
- film carrier
- integrated circuit
- grounding potential
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To stabilize the high speed actuation of a semiconductor integrated circuit by a method wherein both sides of high speed signal wirings are held by wiring patterns in grounding potential to connect the wiring patterns in the grounding potential commonly to the central part of a film carrier. CONSTITUTION:Out of the film carrier wiring patterns in a film carrier, high speed signal lines 4-1 held by the other wiring patterns 4-2 impressed with grounding potential to be controlled at a specified impedance. Likewise, high speed signal lines 3-1 held by outer leads 3-2 impressed with grounding potential are led out. All the patterns impressed with grounding potential on both sides of high speed signal lines are connected by a common patterns 5 provided on the central part of a film carrier. Thus, the reflection and crosstalk noise of high speed signals on the wiring in film carrier are restrained from occurring. Through these procedures, the high speed actuation of semiconductor integrated circuit can be stabilized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240857A JPS6484626A (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240857A JPS6484626A (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6484626A true JPS6484626A (en) | 1989-03-29 |
Family
ID=17065741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62240857A Pending JPS6484626A (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6484626A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4991001A (en) * | 1988-03-31 | 1991-02-05 | Kabushiki Kaisha Toshiba | IC packing device with impedance adjusting insulative layer |
DE4117761A1 (en) * | 1990-06-01 | 1991-12-05 | Toshiba Kawasaki Kk | Semiconductor chip with film carrier - has lead wires between chip terminals and external electrodes applied to surface of film |
DE10142483A1 (en) * | 2001-08-31 | 2003-04-03 | Infineon Technologies Ag | Electronic component with flat conductors and a method for its production |
DE10235788B4 (en) * | 2001-08-07 | 2006-11-30 | Yazaki Corp. | Electrical connection system for a motor vehicle |
JP2021103800A (en) * | 2019-08-27 | 2021-07-15 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
-
1987
- 1987-09-28 JP JP62240857A patent/JPS6484626A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4991001A (en) * | 1988-03-31 | 1991-02-05 | Kabushiki Kaisha Toshiba | IC packing device with impedance adjusting insulative layer |
DE4117761A1 (en) * | 1990-06-01 | 1991-12-05 | Toshiba Kawasaki Kk | Semiconductor chip with film carrier - has lead wires between chip terminals and external electrodes applied to surface of film |
DE10235788B4 (en) * | 2001-08-07 | 2006-11-30 | Yazaki Corp. | Electrical connection system for a motor vehicle |
DE10142483A1 (en) * | 2001-08-31 | 2003-04-03 | Infineon Technologies Ag | Electronic component with flat conductors and a method for its production |
US6825549B2 (en) | 2001-08-31 | 2004-11-30 | Infineon Technologies Ag | Electronic component with external flat conductors and a method for producing the electronic component |
DE10142483B4 (en) * | 2001-08-31 | 2006-12-14 | Infineon Technologies Ag | Electronic component with external flat conductors and a method for its production |
JP2021103800A (en) * | 2019-08-27 | 2021-07-15 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0353426A3 (en) | Semiconductor integrated circuit device comprising conductive layers | |
DE69334110D1 (en) | Integrated semiconductor circuit with input-output interface for small signal amplitudes | |
MY111907A (en) | Method for plating using nested plating buses and semiconductor device having the same. | |
EP0329133A3 (en) | Flip substrate for chip mount | |
EP0371696A3 (en) | Electronic system having a microprocessor and a coprocessor disposed on a circuit mounting board | |
CA2091956A1 (en) | Signal probe apparatus | |
EP0381383A3 (en) | Semiconductor device having insulating substrate adhered to conductive substrate | |
EP0304930A3 (en) | Semiconductor integrated circuit device having signal lines | |
JPS6484626A (en) | Semiconductor integrated circuit device using film carrier | |
JPS6484625A (en) | Semiconductor integrated circuit device using film carrier | |
EP0331289A3 (en) | Semiconductor device with impedance matching means | |
TW303141U (en) | Printed wiring board that is printed with bonding agent on the land for bonding chip | |
JPS6473669A (en) | Semiconductor integrated circuit | |
JPS6480094A (en) | Printed wiring board | |
EP0293838A3 (en) | Ic package for high-speed semiconductor integrated circuit device | |
EP0394878A3 (en) | Semiconductor device having multi-layered wiring structure | |
JPS57104243A (en) | Semiconductor device | |
JPS5779647A (en) | Master slice chip | |
EP0287274A3 (en) | Semiconductor hybrid device | |
JPS6467947A (en) | Ic package substrate | |
JPS6485402A (en) | Semiconductor integrated circuit package | |
JPS57204167A (en) | Semiconductor integrated circuit | |
JPS5797660A (en) | High density structure | |
JPS6489441A (en) | Semiconductor integrated circuit device | |
JPH0217692A (en) | Repair wiring |