JPS6482595A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS6482595A
JPS6482595A JP23902787A JP23902787A JPS6482595A JP S6482595 A JPS6482595 A JP S6482595A JP 23902787 A JP23902787 A JP 23902787A JP 23902787 A JP23902787 A JP 23902787A JP S6482595 A JPS6482595 A JP S6482595A
Authority
JP
Japan
Prior art keywords
conductor
protruding edge
substrate
parts
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23902787A
Other languages
English (en)
Inventor
Takeshi Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Electronics Co Ltd
Original Assignee
Meiko Electronics Co Ltd
Meiko Denshi Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Electronics Co Ltd, Meiko Denshi Kogyo Co Ltd filed Critical Meiko Electronics Co Ltd
Priority to JP23902787A priority Critical patent/JPS6482595A/ja
Publication of JPS6482595A publication Critical patent/JPS6482595A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
JP23902787A 1987-09-25 1987-09-25 Printed wiring board Pending JPS6482595A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23902787A JPS6482595A (en) 1987-09-25 1987-09-25 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23902787A JPS6482595A (en) 1987-09-25 1987-09-25 Printed wiring board

Publications (1)

Publication Number Publication Date
JPS6482595A true JPS6482595A (en) 1989-03-28

Family

ID=17038794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23902787A Pending JPS6482595A (en) 1987-09-25 1987-09-25 Printed wiring board

Country Status (1)

Country Link
JP (1) JPS6482595A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002004077A (ja) * 2000-06-20 2002-01-09 Kyushu Hitachi Maxell Ltd 電鋳製品およびその製造方法
JP2012501551A (ja) * 2008-08-27 2012-01-19 アプライド マテリアルズ インコーポレイテッド バックコンタクト式太陽電池モジュール
JP2013041858A (ja) * 2011-08-11 2013-02-28 Fujikura Ltd プリント配線板
JP2013507777A (ja) * 2009-10-19 2013-03-04 巨擘科技股▲ふん▼有限公司 フレキシブル多層基板の金属層構造及びその製造方法
JP2017038044A (ja) * 2015-08-06 2017-02-16 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
WO2022019156A1 (ja) * 2020-07-21 2022-01-27 株式会社村田製作所 樹脂多層基板および樹脂多層基板の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002004077A (ja) * 2000-06-20 2002-01-09 Kyushu Hitachi Maxell Ltd 電鋳製品およびその製造方法
JP2012501551A (ja) * 2008-08-27 2012-01-19 アプライド マテリアルズ インコーポレイテッド バックコンタクト式太陽電池モジュール
JP2013507777A (ja) * 2009-10-19 2013-03-04 巨擘科技股▲ふん▼有限公司 フレキシブル多層基板の金属層構造及びその製造方法
JP2013041858A (ja) * 2011-08-11 2013-02-28 Fujikura Ltd プリント配線板
JP2017038044A (ja) * 2015-08-06 2017-02-16 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
WO2022019156A1 (ja) * 2020-07-21 2022-01-27 株式会社村田製作所 樹脂多層基板および樹脂多層基板の製造方法

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