JPS64795A - Multilayer printed-interconnection board - Google Patents

Multilayer printed-interconnection board

Info

Publication number
JPS64795A
JPS64795A JP1171887A JP1171887A JPS64795A JP S64795 A JPS64795 A JP S64795A JP 1171887 A JP1171887 A JP 1171887A JP 1171887 A JP1171887 A JP 1171887A JP S64795 A JPS64795 A JP S64795A
Authority
JP
Japan
Prior art keywords
inner layer
pattern
connecting patterns
missing parts
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1171887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01795A (ja
JPH0519319B2 (cs
Inventor
Yoshiyasu Nishikawa
Hajime Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP1171887A priority Critical patent/JPS64795A/ja
Publication of JPH01795A publication Critical patent/JPH01795A/ja
Publication of JPS64795A publication Critical patent/JPS64795A/ja
Publication of JPH0519319B2 publication Critical patent/JPH0519319B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1171887A 1987-01-20 1987-01-20 Multilayer printed-interconnection board Granted JPS64795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1171887A JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1171887A JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Publications (3)

Publication Number Publication Date
JPH01795A JPH01795A (ja) 1989-01-05
JPS64795A true JPS64795A (en) 1989-01-05
JPH0519319B2 JPH0519319B2 (cs) 1993-03-16

Family

ID=11785822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1171887A Granted JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Country Status (1)

Country Link
JP (1) JPS64795A (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044577A (ja) * 1990-04-20 1992-01-09 Nec Kansai Ltd 気密端子及びその製造方法
EP0817548A4 (en) * 1996-01-11 1999-12-01 Ibiden Co Ltd PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
JP2005323288A (ja) * 2004-05-11 2005-11-17 Hosiden Corp デジタルマイクロホン
JP2007250697A (ja) * 2006-03-14 2007-09-27 Nec Corp サーマルランド付き配線基板及び該配線基板を備えた電子機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (ja) * 1983-03-22 1984-10-01 日本電気株式会社 多層プリント板
JPS60121674U (ja) * 1984-01-26 1985-08-16 株式会社明電舎 プリント基板
JPS6157565U (cs) * 1984-09-18 1986-04-17

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (ja) * 1983-03-22 1984-10-01 日本電気株式会社 多層プリント板
JPS60121674U (ja) * 1984-01-26 1985-08-16 株式会社明電舎 プリント基板
JPS6157565U (cs) * 1984-09-18 1986-04-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044577A (ja) * 1990-04-20 1992-01-09 Nec Kansai Ltd 気密端子及びその製造方法
EP0817548A4 (en) * 1996-01-11 1999-12-01 Ibiden Co Ltd PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
US6316738B1 (en) 1996-01-11 2001-11-13 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
US6342682B1 (en) 1996-01-11 2002-01-29 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
KR100485628B1 (ko) * 1996-01-11 2005-09-14 이비덴 가부시키가이샤 프린트배선판및그의제조방법
EP1677582A3 (en) * 1996-01-11 2007-04-11 Ibiden Co., Ltd. Printed wiring board and manufacturing method thereof
JP2005323288A (ja) * 2004-05-11 2005-11-17 Hosiden Corp デジタルマイクロホン
JP2007250697A (ja) * 2006-03-14 2007-09-27 Nec Corp サーマルランド付き配線基板及び該配線基板を備えた電子機器

Also Published As

Publication number Publication date
JPH0519319B2 (cs) 1993-03-16

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