JPS6477924A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6477924A JPS6477924A JP23551387A JP23551387A JPS6477924A JP S6477924 A JPS6477924 A JP S6477924A JP 23551387 A JP23551387 A JP 23551387A JP 23551387 A JP23551387 A JP 23551387A JP S6477924 A JPS6477924 A JP S6477924A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- substrate
- layer
- film
- whole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23551387A JPS6477924A (en) | 1987-09-18 | 1987-09-18 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23551387A JPS6477924A (en) | 1987-09-18 | 1987-09-18 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6477924A true JPS6477924A (en) | 1989-03-23 |
Family
ID=16987101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23551387A Pending JPS6477924A (en) | 1987-09-18 | 1987-09-18 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6477924A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015041707A (ja) * | 2013-08-22 | 2015-03-02 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
JP2016092051A (ja) * | 2014-10-30 | 2016-05-23 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
JP2016092029A (ja) * | 2014-10-29 | 2016-05-23 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
JP2016150879A (ja) * | 2015-02-18 | 2016-08-22 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
-
1987
- 1987-09-18 JP JP23551387A patent/JPS6477924A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015041707A (ja) * | 2013-08-22 | 2015-03-02 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
JP2016092029A (ja) * | 2014-10-29 | 2016-05-23 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
JP2016092051A (ja) * | 2014-10-30 | 2016-05-23 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
JP2016150879A (ja) * | 2015-02-18 | 2016-08-22 | 東京エレクトロン株式会社 | 凹部を充填する方法及び処理装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW325601B (en) | Process of manufacturing thin film semiconductor | |
KR920003291B1 (ko) | 반도체 장치 제조방법 | |
EP0845803A4 (en) | SiC ELEMENT AND PROCESS FOR PRODUCING THE SAME | |
KR960002873A (ko) | 박막 트랜지스터 및 그 제조 방법 | |
JPS58130517A (ja) | 単結晶薄膜の製造方法 | |
KR910016056A (ko) | 반도체의 단결정 에피택셜 성장용의 다결정성 cvd 다이아몬드 기판 | |
KR20010023407A (ko) | 단결정 실리콘층의 형성 방법 및 반도체 장치의 제조방법, 및 반도체 장치 | |
JPS6432622A (en) | Formation of soi film | |
GB2035687A (en) | Method of forming layers on a semiconductor device | |
JPS6477924A (en) | Manufacture of semiconductor device | |
JPS54157779A (en) | Production of silicon single crystal | |
EP0193298A2 (en) | Method for the formation of epitaxial layers for integrated circuits | |
JPS6414926A (en) | Manufacture of semiconductor device | |
JPH01134912A (ja) | 半導体薄膜の製造方法 | |
JPS617622A (ja) | 半導体装置の製造方法 | |
JPS57196542A (en) | Semiconductor integrated circuit device and manufacture thereof | |
JPS61256732A (ja) | 選択エピタキシアル成長方法 | |
JPH01313974A (ja) | 珪素基体上の珪素の多結晶半導体抵抗層の製造方法及びこれにより製造する珪素圧力センサ | |
KR100341059B1 (ko) | 다결정실리콘박막형성방법 | |
JPS57159017A (en) | Manufacture of semiconductor single crystal film | |
JP2668836B2 (ja) | シリコン結晶の選択成長法 | |
JPS6425517A (en) | Method for forming thin film single crystal silicon layer | |
JPH0736389B2 (ja) | 半導体装置の電極配線の形成方法 | |
JP2003528443A5 (ja) | ||
JPS6451620A (en) | Vapor growth method |