JPS64745A - Wiring structure of semiconductor device - Google Patents
Wiring structure of semiconductor deviceInfo
- Publication number
- JPS64745A JPS64745A JP15569687A JP15569687A JPS64745A JP S64745 A JPS64745 A JP S64745A JP 15569687 A JP15569687 A JP 15569687A JP 15569687 A JP15569687 A JP 15569687A JP S64745 A JPS64745 A JP S64745A
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- wirings
- layer
- insulating layer
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve the coatability of an insulating layer without reducing the sectional area of a wiring by forming a second conductive material consisting of the material of the same kind as or a different kind from a first conductive material only to the periphery or side face of the wiring formed by the first conductive material.
CONSTITUTION: An insulating layer 102, a first conductive material layer 103 and a photo-resist layer 104 are shaped onto a wafer 101. One parts of the conductive material layer 103 are removed through a photoetching process, thus forming wirings 105. A second conductive material layer 106 is shaped onto the insulating layer 102 to which the wirings 105 are formed, and the second conductive material layer 106 is etched until the insulating layer 102 is exposed between the wirings 105 without through the photoetching process, thus leaving second conductive material layers 107 only around the wirings 105. Accordingly, the wirings having larger sectional areas can be formed, thus improving electro-migration resistance, then enhancing the reliability of a semiconductor device.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15569687A JPS64745A (en) | 1987-06-23 | 1987-06-23 | Wiring structure of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15569687A JPS64745A (en) | 1987-06-23 | 1987-06-23 | Wiring structure of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01745A JPH01745A (en) | 1989-01-05 |
JPS64745A true JPS64745A (en) | 1989-01-05 |
Family
ID=15611530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15569687A Pending JPS64745A (en) | 1987-06-23 | 1987-06-23 | Wiring structure of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS64745A (en) |
-
1987
- 1987-06-23 JP JP15569687A patent/JPS64745A/en active Pending
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