JPS6469035A - Connecting structure of bump electrode - Google Patents

Connecting structure of bump electrode

Info

Publication number
JPS6469035A
JPS6469035A JP62227391A JP22739187A JPS6469035A JP S6469035 A JPS6469035 A JP S6469035A JP 62227391 A JP62227391 A JP 62227391A JP 22739187 A JP22739187 A JP 22739187A JP S6469035 A JPS6469035 A JP S6469035A
Authority
JP
Japan
Prior art keywords
contact hole
wiring electrode
layer
bump electrode
connecting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62227391A
Other languages
Japanese (ja)
Inventor
Hitoshi Tsubone
Takao Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62227391A priority Critical patent/JPS6469035A/en
Publication of JPS6469035A publication Critical patent/JPS6469035A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain the connecting structure of a bump electrode capable of preventing the isolation of a flip chip and a wiring electrode by forming a first contact hole outside the disposing region of a second contact hole when the first and second contact holes are viewed in a plane and composing the wiring electrode of a soft material. CONSTITUTION:A first contact hole 68 is shaped outside the disposing region of a second contact hole 70 when the first contact hole 68 formed in a first layer 50 such as a ring-shaped groove 68 and the second contact hole 70 shaped in a second layer 54 are viewed in a plane. The contact holes 68, 70 are separated and arranged. An N-type semiconductor diffusion layer 48 in a semiconductor chip 44 and a wiring electrode 52 are connected electrically through the contact hole 68 and the wiring electrode 52 and an Al-Ni alloy layer 62 in a bump electrode 56 through the contact hole 70.
JP62227391A 1987-09-10 1987-09-10 Connecting structure of bump electrode Pending JPS6469035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227391A JPS6469035A (en) 1987-09-10 1987-09-10 Connecting structure of bump electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227391A JPS6469035A (en) 1987-09-10 1987-09-10 Connecting structure of bump electrode

Publications (1)

Publication Number Publication Date
JPS6469035A true JPS6469035A (en) 1989-03-15

Family

ID=16860086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227391A Pending JPS6469035A (en) 1987-09-10 1987-09-10 Connecting structure of bump electrode

Country Status (1)

Country Link
JP (1) JPS6469035A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7230338B2 (en) 2004-06-04 2007-06-12 Seiko Epson Corporation Semiconductor device that improves electrical connection reliability
JP2007281521A (en) * 2007-07-13 2007-10-25 Seiko Epson Corp Method of manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7230338B2 (en) 2004-06-04 2007-06-12 Seiko Epson Corporation Semiconductor device that improves electrical connection reliability
US7560814B2 (en) 2004-06-04 2009-07-14 Seiko Epson Corporation Semiconductor device that improves electrical connection reliability
JP2007281521A (en) * 2007-07-13 2007-10-25 Seiko Epson Corp Method of manufacturing semiconductor device

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