JPS6468945A - Manufacture of semiconductor integrated circuit device - Google Patents
Manufacture of semiconductor integrated circuit deviceInfo
- Publication number
- JPS6468945A JPS6468945A JP22740287A JP22740287A JPS6468945A JP S6468945 A JPS6468945 A JP S6468945A JP 22740287 A JP22740287 A JP 22740287A JP 22740287 A JP22740287 A JP 22740287A JP S6468945 A JPS6468945 A JP S6468945A
- Authority
- JP
- Japan
- Prior art keywords
- film
- deposited
- mask
- manufacture
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent the decrease in step coverage and the occurrence of poor conduction when an Al wiring film is deposited and formed, by forming a contact hole in an interlayer insulating film, with the Al film as a mask. CONSTITUTION:A field oxide film 13 is formed on a silicon substrate 11, on which an impurity diffused layer 14 is formed. As an insulating film, a silicon nitride film 12 is deposited on the entire surface. An Al film 15 is deposited thereon. A photoresist film 16 is deposited, and an etching mask for the Al film 15 is formed. A hole is formed in the Al film 15 by using said mask, and the photoresist film 16 is released. With the Al film 15 as an etching mask, a contact hole 17 is formed in the silicon film 12. Thus, the decrease in step coverage and the occurrence of poor conduction when the Al wiring film is deposited can be eliminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22740287A JPS6468945A (en) | 1987-09-09 | 1987-09-09 | Manufacture of semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22740287A JPS6468945A (en) | 1987-09-09 | 1987-09-09 | Manufacture of semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6468945A true JPS6468945A (en) | 1989-03-15 |
Family
ID=16860268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22740287A Pending JPS6468945A (en) | 1987-09-09 | 1987-09-09 | Manufacture of semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6468945A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5529195A (en) * | 1978-08-21 | 1980-03-01 | Ibm | Method of forming thin film mutual connecting system |
-
1987
- 1987-09-09 JP JP22740287A patent/JPS6468945A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5529195A (en) * | 1978-08-21 | 1980-03-01 | Ibm | Method of forming thin film mutual connecting system |
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