JPS6461208A - Cutting method of wafer - Google Patents

Cutting method of wafer

Info

Publication number
JPS6461208A
JPS6461208A JP21864087A JP21864087A JPS6461208A JP S6461208 A JPS6461208 A JP S6461208A JP 21864087 A JP21864087 A JP 21864087A JP 21864087 A JP21864087 A JP 21864087A JP S6461208 A JPS6461208 A JP S6461208A
Authority
JP
Japan
Prior art keywords
wafer
state
protective film
film
stuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21864087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH057168B2 (enrdf_load_stackoverflow
Inventor
Katsuhisa Taguchi
Kazuyoshi Ebe
Toshio Minagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP21864087A priority Critical patent/JPS6461208A/ja
Publication of JPS6461208A publication Critical patent/JPS6461208A/ja
Publication of JPH057168B2 publication Critical patent/JPH057168B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP21864087A 1987-09-01 1987-09-01 Cutting method of wafer Granted JPS6461208A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21864087A JPS6461208A (en) 1987-09-01 1987-09-01 Cutting method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21864087A JPS6461208A (en) 1987-09-01 1987-09-01 Cutting method of wafer

Publications (2)

Publication Number Publication Date
JPS6461208A true JPS6461208A (en) 1989-03-08
JPH057168B2 JPH057168B2 (enrdf_load_stackoverflow) 1993-01-28

Family

ID=16723116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21864087A Granted JPS6461208A (en) 1987-09-01 1987-09-01 Cutting method of wafer

Country Status (1)

Country Link
JP (1) JPS6461208A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0365249U (enrdf_load_stackoverflow) * 1989-10-30 1991-06-25
US20080121335A1 (en) * 2006-11-29 2008-05-29 Nitto Denko Corporation Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet
CN115178884A (zh) * 2022-09-13 2022-10-14 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种晶片热分离方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054641A (ja) * 2009-08-31 2011-03-17 Nitto Denko Corp 被切断体からのダイシング表面保護テープの剥離除去方法
JP5597422B2 (ja) * 2010-01-19 2014-10-01 デクセリアルズ株式会社 接着フィルム付き電子部品の製造方法および実装体の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116504A (ja) * 1984-11-13 1986-06-04 山形日本電気株式会社 ダイシング方法
JPS6279649A (ja) * 1985-10-03 1987-04-13 Mitsui Toatsu Chem Inc 半導体ダイシング方法
JPS62153376A (ja) * 1985-12-27 1987-07-08 F S K Kk ウェハダイシング用粘着シート
JPS62153375A (ja) * 1985-12-27 1987-07-08 F S K Kk ウエハダイシング用粘着シート
JPS62216244A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116504A (ja) * 1984-11-13 1986-06-04 山形日本電気株式会社 ダイシング方法
JPS6279649A (ja) * 1985-10-03 1987-04-13 Mitsui Toatsu Chem Inc 半導体ダイシング方法
JPS62153376A (ja) * 1985-12-27 1987-07-08 F S K Kk ウェハダイシング用粘着シート
JPS62153375A (ja) * 1985-12-27 1987-07-08 F S K Kk ウエハダイシング用粘着シート
JPS62216244A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0365249U (enrdf_load_stackoverflow) * 1989-10-30 1991-06-25
US20080121335A1 (en) * 2006-11-29 2008-05-29 Nitto Denko Corporation Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet
CN115178884A (zh) * 2022-09-13 2022-10-14 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种晶片热分离方法

Also Published As

Publication number Publication date
JPH057168B2 (enrdf_load_stackoverflow) 1993-01-28

Similar Documents

Publication Publication Date Title
PH21462A (en) Removal of semiconductor wafers from dicing film
MY122256A (en) Process for producing chip and pressure sensitive adhesive sheet therefor
EP0802234A3 (en) Silicone die attach adhesive and method for fabrication of semiconductor devices
CA2031522A1 (en) Irradiation of blood products
KR940022799A (ko) 디엠디(dmd)를 절단한 후의 웨이퍼 처리방법
DE69533136D1 (de) Diffundierung mit feldverstärkung und optischer aktivierung
EP0486047A3 (en) Thin film semiconductor device, process for fabricating the same, and silicon film
HUT53544A (en) Method for producing device containing self-adhesive melt glue suitable for passing the agent
ATE203047T1 (de) Klebeelement
JPS6461208A (en) Cutting method of wafer
FI903628A0 (fi) Laitteisto kuumaliimafolion liimaamiseksi
DE69023432D1 (de) Ostomievorrichtung mit einer konvexen Klebe-Platte und Verfahren zu ihrer Herstellung.
ES2030002T3 (es) Dispositivo para granzar macarrones de termoplasticos.
NO172381C (no) Fremgangsmaate for dannelse av overflatepregede panelplater med en folie av termodeformerbart materiale og anordningfor utoevelse av fremgangsmaaten
EP0880954A4 (en) ARTICLE-PACKING COVER FOR LADIES 'BANDS AND LADIES' BAGS PACKED IN SAME COVER
TR26922A (tr) Ustüste konarak birlestirilmis iki eleman arasina yerlestirilmis yapistiricinin isitilarak polimerizasyonunun gerceklestirilmesi icin yöntem ve aygit.
JPS5543871A (en) Packaging of semiconductor device
DE3688384D1 (de) Selbstklebender absorptionsfaehiger formkoerper und verfahren zum herstellen eines dafuer geeigneten haftschmelzklebers.
FR2145998A5 (en) Heat shrinking plastic packages - using radiant heat
JPS56129121A (en) Manufacture of decorative material
KR840001879A (ko) 열회복성 판의 피복방법 및 장치
JPS6151418B2 (enrdf_load_stackoverflow)
JPS53106570A (en) Production of semiconductor device
JPS5541261A (en) Method of continuously manufacturing heat insulating foundation material and its device
JPS56114353A (en) Method of separating semiconductor wafer and wafer fixing plate

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080128

Year of fee payment: 15