JPS6459942A - Formation of multilayer interconnection - Google Patents

Formation of multilayer interconnection

Info

Publication number
JPS6459942A
JPS6459942A JP21822087A JP21822087A JPS6459942A JP S6459942 A JPS6459942 A JP S6459942A JP 21822087 A JP21822087 A JP 21822087A JP 21822087 A JP21822087 A JP 21822087A JP S6459942 A JPS6459942 A JP S6459942A
Authority
JP
Japan
Prior art keywords
photoresist
photoresist patterns
film
condition
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21822087A
Other languages
Japanese (ja)
Other versions
JPH0622233B2 (en
Inventor
Hiroshi Kumamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21822087A priority Critical patent/JPH0622233B2/en
Publication of JPS6459942A publication Critical patent/JPS6459942A/en
Publication of JPH0622233B2 publication Critical patent/JPH0622233B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To make equal the diameters of contact holes with those of first photoresist patterns and to form a flat polyimide resin film by a method wherein the first photoresist patterns are removed on condition that the etching rate of the first photoresist patterns is quicker sufficiently than that of the first polyimide resin film. CONSTITUTION:Ohmic electrodes 2 and a gate electrode 3 are formed by processing on a semiconductor substrate 1. Then, first photoresist patterns 4 are processed in a size equal to that of a contact hole which is formed on each electrode 2. Then, a first polyimide resin film 5 and a second photoresist 6 are spin coated to flatten the whole surface. Then, the photoresist 6 and the film 5 are etched back on condition that the etching rate of the film 5 is equal to that of the photoresist 4 to expose part of each photoresist pattern 4. After that, the photoresist patterns 4 are removed on condition that the etching rate of the photoresist patterns 4 is quicker sufficiently than that of the film 5. Then, an upper wiring 7 is formed.
JP21822087A 1987-08-31 1987-08-31 Multilayer wiring formation method Expired - Lifetime JPH0622233B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21822087A JPH0622233B2 (en) 1987-08-31 1987-08-31 Multilayer wiring formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21822087A JPH0622233B2 (en) 1987-08-31 1987-08-31 Multilayer wiring formation method

Publications (2)

Publication Number Publication Date
JPS6459942A true JPS6459942A (en) 1989-03-07
JPH0622233B2 JPH0622233B2 (en) 1994-03-23

Family

ID=16716495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21822087A Expired - Lifetime JPH0622233B2 (en) 1987-08-31 1987-08-31 Multilayer wiring formation method

Country Status (1)

Country Link
JP (1) JPH0622233B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120839U (en) * 1989-03-16 1990-09-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02120839U (en) * 1989-03-16 1990-09-28

Also Published As

Publication number Publication date
JPH0622233B2 (en) 1994-03-23

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