JPS6457789A - Electronic component mounting structure - Google Patents

Electronic component mounting structure

Info

Publication number
JPS6457789A
JPS6457789A JP62214508A JP21450887A JPS6457789A JP S6457789 A JPS6457789 A JP S6457789A JP 62214508 A JP62214508 A JP 62214508A JP 21450887 A JP21450887 A JP 21450887A JP S6457789 A JPS6457789 A JP S6457789A
Authority
JP
Japan
Prior art keywords
substrate
component mounting
wiring pattern
electronic components
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62214508A
Other languages
English (en)
Japanese (ja)
Inventor
Chiharu Wakamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62214508A priority Critical patent/JPS6457789A/ja
Priority to CN88102819A priority patent/CN1031236C/zh
Priority to KR1019880009902A priority patent/KR890004595A/ko
Priority to DE3829153A priority patent/DE3829153A1/de
Publication of JPS6457789A publication Critical patent/JPS6457789A/ja
Priority to US07/505,573 priority patent/US5048166A/en
Priority to KR2019910006884U priority patent/KR910007302Y1/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP62214508A 1987-08-28 1987-08-28 Electronic component mounting structure Pending JPS6457789A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP62214508A JPS6457789A (en) 1987-08-28 1987-08-28 Electronic component mounting structure
CN88102819A CN1031236C (zh) 1987-08-28 1988-05-17 电子元件的安装结构
KR1019880009902A KR890004595A (ko) 1987-08-28 1988-08-03 전자 부품 내장 구조
DE3829153A DE3829153A1 (de) 1987-08-28 1988-08-27 System zum anordnen elektronischer bauelemente
US07/505,573 US5048166A (en) 1987-08-28 1990-04-06 Method of making rigid-flexible multilayer board system
KR2019910006884U KR910007302Y1 (ko) 1987-08-28 1991-05-15 전자부품 내장구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214508A JPS6457789A (en) 1987-08-28 1987-08-28 Electronic component mounting structure

Publications (1)

Publication Number Publication Date
JPS6457789A true JPS6457789A (en) 1989-03-06

Family

ID=16656877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214508A Pending JPS6457789A (en) 1987-08-28 1987-08-28 Electronic component mounting structure

Country Status (5)

Country Link
US (1) US5048166A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6457789A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR890004595A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN1031236C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3829153A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06270824A (ja) * 1993-03-23 1994-09-27 Mitsubishi Electric Corp 電動式パワーステアリング回路装置
JPH0750454A (ja) * 1993-06-03 1995-02-21 Internatl Business Mach Corp <Ibm> フレキシブル回路ボード
JP2010186848A (ja) * 2009-02-12 2010-08-26 Fujitsu Ltd 電子部品ユニットの製造方法
JPWO2015151292A1 (ja) * 2014-04-04 2017-04-13 三菱電機株式会社 プリント配線板ユニット

Families Citing this family (30)

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Publication number Priority date Publication date Assignee Title
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
DE4015788C2 (de) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Baugruppe
US5065227A (en) * 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5178318A (en) * 1990-10-12 1993-01-12 Compaq Computer Corp. Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
JP3209772B2 (ja) * 1991-07-08 2001-09-17 株式会社フジクラ リジッドフレックス配線板の製造方法
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
US5210683A (en) * 1991-08-22 1993-05-11 Lsi Logic Corporation Recessed chip capacitor wells with cleaning channels on integrated circuit packages
US5214000A (en) * 1991-12-19 1993-05-25 Raychem Corporation Thermal transfer posts for high density multichip substrates and formation method
US5241454A (en) * 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5644839A (en) * 1994-06-10 1997-07-08 Xetel Corporation Surface mountable substrate edge terminal
DE19605966A1 (de) * 1996-02-17 1997-08-21 Bosch Gmbh Robert Vorrichtung, insbesondere zur Verwendung in einem elektronischen Steuergerät
US6400575B1 (en) * 1996-10-21 2002-06-04 Alpine Microsystems, Llc Integrated circuits packaging system and method
WO1998020557A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Method for reducing via inductance in an electronic assembly and device
DE69725689T2 (de) * 1996-12-26 2004-04-29 Matsushita Electric Industrial Co., Ltd., Kadoma Gedruckte Leiterplatte und elektronische Bauteile
US6299055B1 (en) * 1997-05-09 2001-10-09 Lear Automotive Dearborn, Inc. Manufacturing processes of service boxes and their parts
US6026564A (en) * 1998-04-10 2000-02-22 Ang Technologies Inc. Method of making a high density multilayer wiring board
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6175088B1 (en) * 1998-10-05 2001-01-16 Avaya Technology Corp. Multi-layer printed-wiring boards with inner power and ground layers
US6264093B1 (en) * 1998-11-02 2001-07-24 Raymond W. Pilukaitis Lead-free solder process for printed wiring boards
US6595405B2 (en) * 2000-02-23 2003-07-22 Fujikura, Ltd. Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween
US6580031B2 (en) 2000-03-14 2003-06-17 Amerasia International Technology, Inc. Method for making a flexible circuit interposer having high-aspect ratio conductors
JP2001345549A (ja) * 2000-06-01 2001-12-14 Fujitsu Ltd 実装用基板の製造方法及び部品実装方法並びに実装用基板製造装置
JP4583581B2 (ja) * 2000-11-07 2010-11-17 ルネサスエレクトロニクス株式会社 固体撮像装置の製造方法
TW201611675A (zh) * 2014-09-01 2016-03-16 廣達電腦股份有限公司 電路板結構之改良方法
WO2020214148A1 (en) * 2019-04-15 2020-10-22 Hewlett-Packard Development Company, L.P. Printed circuit boards with electrical contacts and solder joints of higher melting temperatures

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
DE1591513A1 (de) * 1967-07-10 1970-02-12 Siemens Ag Anordnung zur Verbindung gedruckter Schaltungsplatten
FR2212740B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-12-28 1977-02-25 Honeywell Bull
ATA25474A (de) * 1974-01-14 1977-03-15 Kopera Adalbert Schaltungsanordnung
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
US3971127A (en) * 1975-09-10 1976-07-27 Bell Telephone Laboratories, Incorporated Method of fabricating a printed wiring board assembly
DE7631817U1 (de) * 1976-10-12 1977-02-17 Prenosil, Wolfgang Guenter, 6200 Wiesbaden Anordnung von gedruckten schaltungen (platinen)
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
US4506443A (en) * 1982-05-28 1985-03-26 Clarion Co., Ltd. Method of mounting electric part onto a substrate
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
JPS59207689A (ja) * 1983-05-11 1984-11-24 株式会社日立製作所 プリント板の両面はんだ付方法
DE3442803A1 (de) * 1984-11-23 1986-06-05 Wilhelm Ruf KG, 8000 München Hybridschaltung auf einem flexiblen traegermaterial sowie verfahren zu deren herstellung
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
DE8713168U1 (de) * 1987-09-30 1988-01-07 Siemens AG, 1000 Berlin und 8000 München Elektrische Steckbaugruppe
DE8806029U1 (de) * 1988-05-06 1988-06-30 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektrische Schaltungsplatte mit gedruckten Leitungszügen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06270824A (ja) * 1993-03-23 1994-09-27 Mitsubishi Electric Corp 電動式パワーステアリング回路装置
JPH0750454A (ja) * 1993-06-03 1995-02-21 Internatl Business Mach Corp <Ibm> フレキシブル回路ボード
JP2010186848A (ja) * 2009-02-12 2010-08-26 Fujitsu Ltd 電子部品ユニットの製造方法
KR101145076B1 (ko) * 2009-02-12 2012-05-11 후지쯔 가부시끼가이샤 전자 부품 유닛의 제조 방법
JPWO2015151292A1 (ja) * 2014-04-04 2017-04-13 三菱電機株式会社 プリント配線板ユニット

Also Published As

Publication number Publication date
DE3829153C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-15
US5048166A (en) 1991-09-17
DE3829153A1 (de) 1989-03-16
CN1031236C (zh) 1996-03-06
KR890004595A (ko) 1989-04-22
CN1031636A (zh) 1989-03-08

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