JPS6457697A - Connection of flexible printed substrate - Google Patents

Connection of flexible printed substrate

Info

Publication number
JPS6457697A
JPS6457697A JP21307887A JP21307887A JPS6457697A JP S6457697 A JPS6457697 A JP S6457697A JP 21307887 A JP21307887 A JP 21307887A JP 21307887 A JP21307887 A JP 21307887A JP S6457697 A JPS6457697 A JP S6457697A
Authority
JP
Japan
Prior art keywords
flexible printed
printed substrate
connecting terminal
spherical metal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21307887A
Other languages
Japanese (ja)
Other versions
JPH0821774B2 (en
Inventor
Chiaki Tanuma
Masayuki Saito
Akira Niitsuma
Hiroshi Ohira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21307887A priority Critical patent/JPH0821774B2/en
Publication of JPS6457697A publication Critical patent/JPS6457697A/en
Publication of JPH0821774B2 publication Critical patent/JPH0821774B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To solve a trouble that the external connecting terminal of a flexible printed substrate is short-circuited after being soldered by a method wherein the surfaces of supporting bodies are electrified, a spherical metal is held in holes by an electrostatic force and after the spherical metal is attached to the external connecting terminal of the flexible printed substrate, a wiring board and the connecting terminal are bonded together. CONSTITUTION:In case a flexible printed substrate 7 mounted with an electronic component is mounted on a wiring board 10, supporting bodies 1-3, which respectively have a hole 4 at each position to correspond to an external connecting terminal 8 of the substrate 7 and whose surfaces other than the holes 4 are conductive, are used and after the bodies 1-3 are electrified in advance, a spherical metal 6 is held and buried in the holes 4 by an electrostatic force. Then, after the substrate 7 is made to oppose to the board 10 and the metal 6 is attached to the terminal 8, the board 10 is aligned to the terminal 8 add is bonded together. For example, a supporting body made by a method, wherein the ITO film 3 is formed on the polyimide resin film 2 and the perforated films 2 and 3 are laminated on a glass plate 1, is used, a solder ball is used as the spherical metal 6 and the attachment and the bonding are performed by heating.
JP21307887A 1987-08-28 1987-08-28 Flexible printed circuit board connection method Expired - Lifetime JPH0821774B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21307887A JPH0821774B2 (en) 1987-08-28 1987-08-28 Flexible printed circuit board connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21307887A JPH0821774B2 (en) 1987-08-28 1987-08-28 Flexible printed circuit board connection method

Publications (2)

Publication Number Publication Date
JPS6457697A true JPS6457697A (en) 1989-03-03
JPH0821774B2 JPH0821774B2 (en) 1996-03-04

Family

ID=16633181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21307887A Expired - Lifetime JPH0821774B2 (en) 1987-08-28 1987-08-28 Flexible printed circuit board connection method

Country Status (1)

Country Link
JP (1) JPH0821774B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127570A (en) * 1990-06-28 1992-07-07 Cray Research, Inc. Flexible automated bonding method and apparatus
KR100683704B1 (en) * 2004-11-17 2007-02-20 삼성에스디아이 주식회사 Plasma display apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127570A (en) * 1990-06-28 1992-07-07 Cray Research, Inc. Flexible automated bonding method and apparatus
KR100683704B1 (en) * 2004-11-17 2007-02-20 삼성에스디아이 주식회사 Plasma display apparatus

Also Published As

Publication number Publication date
JPH0821774B2 (en) 1996-03-04

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