JPS6457655U - - Google Patents
Info
- Publication number
- JPS6457655U JPS6457655U JP15259487U JP15259487U JPS6457655U JP S6457655 U JPS6457655 U JP S6457655U JP 15259487 U JP15259487 U JP 15259487U JP 15259487 U JP15259487 U JP 15259487U JP S6457655 U JPS6457655 U JP S6457655U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- metal
- semiconductor
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15259487U JPS6457655U (enrdf_load_stackoverflow) | 1987-10-05 | 1987-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15259487U JPS6457655U (enrdf_load_stackoverflow) | 1987-10-05 | 1987-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457655U true JPS6457655U (enrdf_load_stackoverflow) | 1989-04-10 |
Family
ID=31427663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15259487U Pending JPS6457655U (enrdf_load_stackoverflow) | 1987-10-05 | 1987-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457655U (enrdf_load_stackoverflow) |
-
1987
- 1987-10-05 JP JP15259487U patent/JPS6457655U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0725437A3 (en) | Semiconductor device, method of fabricating the same and copper leads | |
| JPS62232948A (ja) | リ−ドフレ−ム | |
| JPS6457655U (enrdf_load_stackoverflow) | ||
| JPS63102326A (ja) | クラツド材 | |
| JPS6097654A (ja) | 封止型半導体装置 | |
| JPS638136Y2 (enrdf_load_stackoverflow) | ||
| JPS6211784B2 (enrdf_load_stackoverflow) | ||
| JPS63250163A (ja) | 半導体集積回路装置 | |
| JP2848373B2 (ja) | 半導体装置 | |
| JPS63311732A (ja) | 半導体素子の実装方法 | |
| JPS6022827B2 (ja) | ボンデイングワイヤ | |
| JP2705297B2 (ja) | 高強度ｔａｂ用テープキャリア | |
| JPS61128551A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS62213270A (ja) | 半導体装置用リ−ドフレ−ム | |
| JP2658545B2 (ja) | 高強度ｔａｂ用テープキャリア | |
| JPS62208654A (ja) | リ−ドフレ−ム | |
| JPH02100356A (ja) | 半導体リードフレーム | |
| JPH0265266A (ja) | リードフレーム | |
| JPH0519820B2 (enrdf_load_stackoverflow) | ||
| JP2001015666A (ja) | 半導体装置及びその製造方法 | |
| JPS6169842U (enrdf_load_stackoverflow) | ||
| JPH01104738U (enrdf_load_stackoverflow) | ||
| JPS58196863U (ja) | 半導体レ−ザ用サブマウント | |
| JPH01187958A (ja) | リードフレーム | |
| JPS60113161U (ja) | 二部材の銀ロウ付け構体 |