JPS6457654U - - Google Patents

Info

Publication number
JPS6457654U
JPS6457654U JP15166587U JP15166587U JPS6457654U JP S6457654 U JPS6457654 U JP S6457654U JP 15166587 U JP15166587 U JP 15166587U JP 15166587 U JP15166587 U JP 15166587U JP S6457654 U JPS6457654 U JP S6457654U
Authority
JP
Japan
Prior art keywords
external lead
edge
unconnected
narrow
wide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15166587U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528777Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987151665U priority Critical patent/JPH0528777Y2/ja
Publication of JPS6457654U publication Critical patent/JPS6457654U/ja
Application granted granted Critical
Publication of JPH0528777Y2 publication Critical patent/JPH0528777Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987151665U 1987-10-05 1987-10-05 Expired - Lifetime JPH0528777Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987151665U JPH0528777Y2 (enrdf_load_html_response) 1987-10-05 1987-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987151665U JPH0528777Y2 (enrdf_load_html_response) 1987-10-05 1987-10-05

Publications (2)

Publication Number Publication Date
JPS6457654U true JPS6457654U (enrdf_load_html_response) 1989-04-10
JPH0528777Y2 JPH0528777Y2 (enrdf_load_html_response) 1993-07-23

Family

ID=31425908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987151665U Expired - Lifetime JPH0528777Y2 (enrdf_load_html_response) 1987-10-05 1987-10-05

Country Status (1)

Country Link
JP (1) JPH0528777Y2 (enrdf_load_html_response)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115256U (enrdf_load_html_response) * 1981-01-09 1982-07-16
JPS59112954U (ja) * 1983-01-21 1984-07-30 サンケン電気株式会社 絶縁物封止半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115256U (enrdf_load_html_response) * 1981-01-09 1982-07-16
JPS59112954U (ja) * 1983-01-21 1984-07-30 サンケン電気株式会社 絶縁物封止半導体装置

Also Published As

Publication number Publication date
JPH0528777Y2 (enrdf_load_html_response) 1993-07-23

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