JPS6457650A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6457650A
JPS6457650A JP62214570A JP21457087A JPS6457650A JP S6457650 A JPS6457650 A JP S6457650A JP 62214570 A JP62214570 A JP 62214570A JP 21457087 A JP21457087 A JP 21457087A JP S6457650 A JPS6457650 A JP S6457650A
Authority
JP
Japan
Prior art keywords
salient
semiconductor chip
electrodes
ray
coating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62214570A
Other languages
Japanese (ja)
Inventor
Takayuki Uda
Yoshiaki Emoto
Tamotsu Tanaka
Shigeo Kuroda
Shuichi Miyaoka
Nobuo Tanba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62214570A priority Critical patent/JPS6457650A/en
Publication of JPS6457650A publication Critical patent/JPS6457650A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the soft error in a semiconductor device of salient electrode mounting system, and lengthen the connecting life of the salient electrode, by arranging a coating film for shielding alpha-ray on a semiconductor chip or a specified part of a mounting substrate surface excepting salient electrode parts. CONSTITUTION:A coating film 3 for shielding alpha-ray is arranged on a semiconductor chip 1 or a specified part of a mounting substrate surface excepting salient electrode parts 4 for face down bonding. For example, only the surface of a memory mat region 2, which is especially weak for soft error in the semiconductor chip 1 of a semiconductor device having an element in which both bipolar transistors and COMS's exist, is coated with a coating film 3 for shielding alpha-ray which is composed of polyimide resin. The part of the salient electrodes 4 composed of solder bump and the like are not coated. The semiconductor chip 1 is mounted on the mounting substrate 5 via the salient electrodes 4. As a result, difference of thermal expansion coefficient between the protruding electrodes and the resin does not exert influence upon the salient electrodes. Thereby lengthening connection of life of the salient electrode.
JP62214570A 1987-08-27 1987-08-27 Semiconductor device Pending JPS6457650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62214570A JPS6457650A (en) 1987-08-27 1987-08-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214570A JPS6457650A (en) 1987-08-27 1987-08-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6457650A true JPS6457650A (en) 1989-03-03

Family

ID=16657902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214570A Pending JPS6457650A (en) 1987-08-27 1987-08-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6457650A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10916508B2 (en) 2018-03-15 2021-02-09 Toshiba Memory Corporation Semiconductor device package with radiation shield

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10916508B2 (en) 2018-03-15 2021-02-09 Toshiba Memory Corporation Semiconductor device package with radiation shield

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