JPS6450537A - Compression bonded type semiconductor device - Google Patents

Compression bonded type semiconductor device

Info

Publication number
JPS6450537A
JPS6450537A JP20858587A JP20858587A JPS6450537A JP S6450537 A JPS6450537 A JP S6450537A JP 20858587 A JP20858587 A JP 20858587A JP 20858587 A JP20858587 A JP 20858587A JP S6450537 A JPS6450537 A JP S6450537A
Authority
JP
Japan
Prior art keywords
guide ring
semiconductor device
aperture
compression bonded
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20858587A
Other languages
Japanese (ja)
Other versions
JPH0758721B2 (en
Inventor
Tokumitsu Sakamoto
Yuzuru Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62208585A priority Critical patent/JPH0758721B2/en
Publication of JPS6450537A publication Critical patent/JPS6450537A/en
Publication of JPH0758721B2 publication Critical patent/JPH0758721B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To make it possible to change polarities of a semiconductor device by mounting a semiconductor element reversed in position, by providing a guide ring for covering the periphery of the semiconductor element, the guide ring having an aperture through which first and second main electrodes are inserted and being totally formed of an insulating material. CONSTITUTION:A compression bonded semiconductor device, in which a second main electrode 4 is pressure-contacted with a semiconductor element 2 received in a case 1a of a first main electrode 1, is provided with a guide ring 11 having an aperture into which said first and second main electrodes 1, 2 are inserted and formed totally of an insulating material. For example, the guide ring 11 comprises a cylinder 11a fitted in the case 1a and a projection 11c covering the periphery of the element 2 while forming an aperture 11b into which the electrode face 1b of an anode 1 and the electrode face 4a of a cathode rod 4 are inserted. The guide ring 11 is formed integrally of fluororesin, fluororubber, silicon rubber, mica or the like and divided axially into two halves so as to facilitate mounting of the element 2.
JP62208585A 1987-08-21 1987-08-21 Pressure contact type semiconductor device Expired - Lifetime JPH0758721B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62208585A JPH0758721B2 (en) 1987-08-21 1987-08-21 Pressure contact type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62208585A JPH0758721B2 (en) 1987-08-21 1987-08-21 Pressure contact type semiconductor device

Publications (2)

Publication Number Publication Date
JPS6450537A true JPS6450537A (en) 1989-02-27
JPH0758721B2 JPH0758721B2 (en) 1995-06-21

Family

ID=16558625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62208585A Expired - Lifetime JPH0758721B2 (en) 1987-08-21 1987-08-21 Pressure contact type semiconductor device

Country Status (1)

Country Link
JP (1) JPH0758721B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005300810A (en) * 2004-04-09 2005-10-27 Matsushita Electric Works Ltd Light emitting device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132945U (en) * 1979-03-13 1980-09-20
JPS56149449U (en) * 1980-04-04 1981-11-10
JPS57201842U (en) * 1981-06-17 1982-12-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132945U (en) * 1979-03-13 1980-09-20
JPS56149449U (en) * 1980-04-04 1981-11-10
JPS57201842U (en) * 1981-06-17 1982-12-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005300810A (en) * 2004-04-09 2005-10-27 Matsushita Electric Works Ltd Light emitting device

Also Published As

Publication number Publication date
JPH0758721B2 (en) 1995-06-21

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