JPS56120148A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS56120148A JPS56120148A JP2307980A JP2307980A JPS56120148A JP S56120148 A JPS56120148 A JP S56120148A JP 2307980 A JP2307980 A JP 2307980A JP 2307980 A JP2307980 A JP 2307980A JP S56120148 A JPS56120148 A JP S56120148A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- columnar part
- small diameter
- semiconductor element
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To arrange so that the face and side of an electrode may be freely connected by holding a semiconductor element between electrodes which are formed with a columnar part of large diameter and a columnar part of small diameter in a single block and providing airtight sealing with a glass tube across the small diameter parts of electrodes. CONSTITUTION:A semiconductor element 1 is held by an electrode 21 and the electrode 21 is formed with a columnar part 21 of large diameter and a columnar part 23 of small diameter in one body. In addition, a glass tube 3 is provided across the small diameter parts to keep the element 1 airtight. With this constitution, it is possible to freely use the face 26 and side 25 of the electrode 21 for connection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2307980A JPS56120148A (en) | 1980-02-26 | 1980-02-26 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2307980A JPS56120148A (en) | 1980-02-26 | 1980-02-26 | Semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56120148A true JPS56120148A (en) | 1981-09-21 |
Family
ID=12100401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2307980A Pending JPS56120148A (en) | 1980-02-26 | 1980-02-26 | Semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56120148A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100151U (en) * | 1984-12-05 | 1986-06-26 | ||
US7832418B2 (en) | 2004-02-18 | 2010-11-16 | Hoshizaki Denki Kabushiki Kaisha | Dish washing machine |
-
1980
- 1980-02-26 JP JP2307980A patent/JPS56120148A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61100151U (en) * | 1984-12-05 | 1986-06-26 | ||
US7832418B2 (en) | 2004-02-18 | 2010-11-16 | Hoshizaki Denki Kabushiki Kaisha | Dish washing machine |
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