JPS56120148A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS56120148A
JPS56120148A JP2307980A JP2307980A JPS56120148A JP S56120148 A JPS56120148 A JP S56120148A JP 2307980 A JP2307980 A JP 2307980A JP 2307980 A JP2307980 A JP 2307980A JP S56120148 A JPS56120148 A JP S56120148A
Authority
JP
Japan
Prior art keywords
electrode
columnar part
small diameter
semiconductor element
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2307980A
Other languages
Japanese (ja)
Inventor
Mitsuo Osawa
Toshio Takahashi
Hidefumi Hatagoshi
Yasuo Yamada
Mitsumasa Iwahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Sony Corp
Original Assignee
Fuji Electric Co Ltd
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Sony Corp filed Critical Fuji Electric Co Ltd
Priority to JP2307980A priority Critical patent/JPS56120148A/en
Publication of JPS56120148A publication Critical patent/JPS56120148A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To arrange so that the face and side of an electrode may be freely connected by holding a semiconductor element between electrodes which are formed with a columnar part of large diameter and a columnar part of small diameter in a single block and providing airtight sealing with a glass tube across the small diameter parts of electrodes. CONSTITUTION:A semiconductor element 1 is held by an electrode 21 and the electrode 21 is formed with a columnar part 21 of large diameter and a columnar part 23 of small diameter in one body. In addition, a glass tube 3 is provided across the small diameter parts to keep the element 1 airtight. With this constitution, it is possible to freely use the face 26 and side 25 of the electrode 21 for connection.
JP2307980A 1980-02-26 1980-02-26 Semiconductor element Pending JPS56120148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2307980A JPS56120148A (en) 1980-02-26 1980-02-26 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2307980A JPS56120148A (en) 1980-02-26 1980-02-26 Semiconductor element

Publications (1)

Publication Number Publication Date
JPS56120148A true JPS56120148A (en) 1981-09-21

Family

ID=12100401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2307980A Pending JPS56120148A (en) 1980-02-26 1980-02-26 Semiconductor element

Country Status (1)

Country Link
JP (1) JPS56120148A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61100151U (en) * 1984-12-05 1986-06-26
US7832418B2 (en) 2004-02-18 2010-11-16 Hoshizaki Denki Kabushiki Kaisha Dish washing machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61100151U (en) * 1984-12-05 1986-06-26
US7832418B2 (en) 2004-02-18 2010-11-16 Hoshizaki Denki Kabushiki Kaisha Dish washing machine

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