JPS5635442A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5635442A
JPS5635442A JP11035379A JP11035379A JPS5635442A JP S5635442 A JPS5635442 A JP S5635442A JP 11035379 A JP11035379 A JP 11035379A JP 11035379 A JP11035379 A JP 11035379A JP S5635442 A JPS5635442 A JP S5635442A
Authority
JP
Japan
Prior art keywords
annular
cutout
electrode
lids
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11035379A
Other languages
Japanese (ja)
Other versions
JPS6043017B2 (en
Inventor
Kazuyuki Nakajima
Yoichi Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP54110353A priority Critical patent/JPS6043017B2/en
Publication of JPS5635442A publication Critical patent/JPS5635442A/en
Publication of JPS6043017B2 publication Critical patent/JPS6043017B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the durability of the semiconductor device by making a cutout on the flange part of an electrode and providing an elastic sealing member at the peripheral edge of a structure, when annular lids are provided on opposing surfaces of an insulating cylindrical outer enclosure, while a semiconductor element structure is accommodated in the outer enclosure, and the structure is clamped between a pair of electrodes. CONSTITUTION:Annular lids 2 and 2' such as Kovars or the like are sealed to the opposing surface of an insulating cylindrical housing 1 made of ceramics or the like and a pair of electrodes 3 and 13' are infiltrated into the through hole thereby to hold slidably therebetween a semiconductor element structure 14. In this construction, at the lower face of the flange of an electrode 13', an annular projection 13a is provided in correspondence to the annular cutout, and further a sealing body of a soft and elastic insulating heat-resisting material, consisting of an inner peripheral surface 16a contacting the outer periphery of the structure 14, and surfaces 16b and 16b' and an annular groove 16c fitted in the cutout of the electrode 13', is inserted in the space formed between the lids 2 and 2' and the housing 1 to fix the structure 14.
JP54110353A 1979-08-31 1979-08-31 semiconductor equipment Expired JPS6043017B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54110353A JPS6043017B2 (en) 1979-08-31 1979-08-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54110353A JPS6043017B2 (en) 1979-08-31 1979-08-31 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5635442A true JPS5635442A (en) 1981-04-08
JPS6043017B2 JPS6043017B2 (en) 1985-09-26

Family

ID=14533607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54110353A Expired JPS6043017B2 (en) 1979-08-31 1979-08-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6043017B2 (en)

Also Published As

Publication number Publication date
JPS6043017B2 (en) 1985-09-26

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