JPS6448090U - - Google Patents
Info
- Publication number
- JPS6448090U JPS6448090U JP14281187U JP14281187U JPS6448090U JP S6448090 U JPS6448090 U JP S6448090U JP 14281187 U JP14281187 U JP 14281187U JP 14281187 U JP14281187 U JP 14281187U JP S6448090 U JPS6448090 U JP S6448090U
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- hole
- heat dissipation
- thermally conductive
- highly thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。 １……ガラスエポキシ基板、２……表面実装部
品、３……ケース、４……電極リード、５……放
熱フイン、６……高熱伝導性部材。
図は従来例を示す断面図である。 １……ガラスエポキシ基板、２……表面実装部
品、３……ケース、４……電極リード、５……放
熱フイン、６……高熱伝導性部材。
Claims (1)
- 表面実装部品を搭載した熱伝導率の小さい基板
に貫通孔を設け、前記貫通孔に高熱伝導性部材を
充填するとともに前記高熱伝導性部材に接して放
熱フインを設けたことを特徴とする基板の放熱構
造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14281187U JPS6448090U (ja) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14281187U JPS6448090U (ja) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448090U true JPS6448090U (ja) | 1989-03-24 |
Family
ID=31409071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14281187U Pending JPS6448090U (ja) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448090U (ja) |
-
1987
- 1987-09-18 JP JP14281187U patent/JPS6448090U/ja active Pending