JPS6448025U - - Google Patents
Info
- Publication number
- JPS6448025U JPS6448025U JP14339487U JP14339487U JPS6448025U JP S6448025 U JPS6448025 U JP S6448025U JP 14339487 U JP14339487 U JP 14339487U JP 14339487 U JP14339487 U JP 14339487U JP S6448025 U JPS6448025 U JP S6448025U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- aluminum
- etching equipment
- workpiece
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は本実施の説明図、第２図は本実施の原
理の説明図、第３図は従来例の説明図、第４図は
従来工法の説明図である。
１……エツチング液、２……ワーク、４……保
持治具。
FIG. 1 is an explanatory diagram of the present implementation, FIG. 2 is an explanatory diagram of the principle of the present implementation, FIG. 3 is an explanatory diagram of a conventional example, and FIG. 4 is an explanatory diagram of the conventional method. 1...Etching liquid, 2...Workpiece, 4...Holding jig.
Claims (1)
装置に於いて、エツチング液内で前記ワークを保
持するウエハ保持治具が底面に対して一定の傾斜
を有する構造で、エツチング反応時の水素気泡の
離脱を促進させるアルミエツチング装置。 In aluminum etching equipment for integrated circuit devices, which are workpieces, the wafer holding jig that holds the workpiece in the etching solution has a structure that has a certain inclination with respect to the bottom surface, promoting the release of hydrogen bubbles during the etching reaction. aluminum etching equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14339487U JPS6448025U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14339487U JPS6448025U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448025U true JPS6448025U (en) | 1989-03-24 |
Family
ID=31410178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14339487U Pending JPS6448025U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448025U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011054731A (en) * | 2009-09-01 | 2011-03-17 | Renesas Electronics Corp | Method of manufacturing semiconductor device |
-
1987
- 1987-09-18 JP JP14339487U patent/JPS6448025U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011054731A (en) * | 2009-09-01 | 2011-03-17 | Renesas Electronics Corp | Method of manufacturing semiconductor device |
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