JPS60121642U - Etching equipment for forming wiring in semiconductor devices - Google Patents
Etching equipment for forming wiring in semiconductor devicesInfo
- Publication number
- JPS60121642U JPS60121642U JP833384U JP833384U JPS60121642U JP S60121642 U JPS60121642 U JP S60121642U JP 833384 U JP833384 U JP 833384U JP 833384 U JP833384 U JP 833384U JP S60121642 U JPS60121642 U JP S60121642U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- etching equipment
- forming wiring
- wafer
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のエツチング装置の断面図、第２図は１実
施例のエツチング装置の断面図、第３図は１実施例の構
成と効果とを説明する線図、第４、図はウェーハの測定
点を示すウェーハのｉ図である。FIG. 1 is a cross-sectional view of a conventional etching apparatus, FIG. 2 is a cross-sectional view of an etching apparatus according to one embodiment, FIG. 3 is a diagram explaining the configuration and effects of one embodiment, and FIG. FIG. 3 is an i diagram of the wafer showing measurement points.
Claims (1)
ミニウム層が形成された半導体ウェーハを支持するウェ
ーハ２支持機構と、前記ウェー７％支持機構を駆動して
エツチング液中に漬浸された半導体ウェーハに対するア
ルミニウム層に光照射するための光照射部を具備してな
る半導体装置の配線形成用エツチング装置。An aluminum etching solution container, a wafer 2 support mechanism that supports a semiconductor wafer having an aluminum layer formed thereon as a wiring layer, and an aluminum etching solution for the semiconductor wafer immersed in the etching solution by driving the wafer 7% support mechanism. An etching device for forming interconnects in a semiconductor device, comprising a light irradiation section for irradiating a layer with light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP833384U JPS60121642U (en) | 1984-01-26 | 1984-01-26 | Etching equipment for forming wiring in semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP833384U JPS60121642U (en) | 1984-01-26 | 1984-01-26 | Etching equipment for forming wiring in semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60121642U true JPS60121642U (en) | 1985-08-16 |
Family
ID=30487513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP833384U Pending JPS60121642U (en) | 1984-01-26 | 1984-01-26 | Etching equipment for forming wiring in semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121642U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210000345A (en) * | 2019-06-24 | 2021-01-05 | 세메스 주식회사 | Substrate treatment apparatus |
-
1984
- 1984-01-26 JP JP833384U patent/JPS60121642U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210000345A (en) * | 2019-06-24 | 2021-01-05 | 세메스 주식회사 | Substrate treatment apparatus |
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