JPS6447053A - Formation of multilayer interconnection - Google Patents

Formation of multilayer interconnection

Info

Publication number
JPS6447053A
JPS6447053A JP20352187A JP20352187A JPS6447053A JP S6447053 A JPS6447053 A JP S6447053A JP 20352187 A JP20352187 A JP 20352187A JP 20352187 A JP20352187 A JP 20352187A JP S6447053 A JPS6447053 A JP S6447053A
Authority
JP
Japan
Prior art keywords
glass
insulating film
coated film
film
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20352187A
Other languages
English (en)
Inventor
Kimihisa Fushimi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP20352187A priority Critical patent/JPS6447053A/ja
Publication of JPS6447053A publication Critical patent/JPS6447053A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP20352187A 1987-08-18 1987-08-18 Formation of multilayer interconnection Pending JPS6447053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20352187A JPS6447053A (en) 1987-08-18 1987-08-18 Formation of multilayer interconnection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20352187A JPS6447053A (en) 1987-08-18 1987-08-18 Formation of multilayer interconnection

Publications (1)

Publication Number Publication Date
JPS6447053A true JPS6447053A (en) 1989-02-21

Family

ID=16475526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20352187A Pending JPS6447053A (en) 1987-08-18 1987-08-18 Formation of multilayer interconnection

Country Status (1)

Country Link
JP (1) JPS6447053A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474431A (ja) * 1990-07-16 1992-03-09 Matsushita Electron Corp 半導体装置およびその製造方法
JPH04122026A (ja) * 1990-09-13 1992-04-22 Nec Corp 半導体装置の製造方法
US5405805A (en) * 1991-09-13 1995-04-11 Nec Corporation Method for forming interconnect structure, insulating films and surface protective films of semiconductor device
US5444023A (en) * 1993-01-11 1995-08-22 Nec Corporation Method of fabricating a semiconductor device having a multilayer wiring structure and using a fluorine compound-containing gas
US5620919A (en) * 1990-01-12 1997-04-15 Paradigm Technology, Inc. Methods for fabricating integrated circuits including openings to transistor regions
US5656861A (en) * 1990-01-12 1997-08-12 Paradigm Technology, Inc. Self-aligning contact and interconnect structure
JP2007294932A (ja) * 2006-03-28 2007-11-08 Furukawa Electric Co Ltd:The メタルコアプリント配線板及びその製造方法
US11473481B2 (en) 2020-11-20 2022-10-18 Caterpillar Inc. Exhaust manifold having turbine connector with turbine foot

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5620919A (en) * 1990-01-12 1997-04-15 Paradigm Technology, Inc. Methods for fabricating integrated circuits including openings to transistor regions
US5656861A (en) * 1990-01-12 1997-08-12 Paradigm Technology, Inc. Self-aligning contact and interconnect structure
JPH0474431A (ja) * 1990-07-16 1992-03-09 Matsushita Electron Corp 半導体装置およびその製造方法
JPH04122026A (ja) * 1990-09-13 1992-04-22 Nec Corp 半導体装置の製造方法
US5405805A (en) * 1991-09-13 1995-04-11 Nec Corporation Method for forming interconnect structure, insulating films and surface protective films of semiconductor device
US5444023A (en) * 1993-01-11 1995-08-22 Nec Corporation Method of fabricating a semiconductor device having a multilayer wiring structure and using a fluorine compound-containing gas
JP2007294932A (ja) * 2006-03-28 2007-11-08 Furukawa Electric Co Ltd:The メタルコアプリント配線板及びその製造方法
US11473481B2 (en) 2020-11-20 2022-10-18 Caterpillar Inc. Exhaust manifold having turbine connector with turbine foot
US11988126B2 (en) 2020-11-20 2024-05-21 Caterpillar Inc. Exhaust manifold having turbine connector with turbine foot

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