JPS6442181A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6442181A
JPS6442181A JP62198894A JP19889487A JPS6442181A JP S6442181 A JPS6442181 A JP S6442181A JP 62198894 A JP62198894 A JP 62198894A JP 19889487 A JP19889487 A JP 19889487A JP S6442181 A JPS6442181 A JP S6442181A
Authority
JP
Japan
Prior art keywords
films
crystal layers
semiconductor crystal
photoresist
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62198894A
Other languages
Japanese (ja)
Inventor
Hiroyuki Tsuchida
Nobuyuki Kajiwara
Soichiro Hikita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62198894A priority Critical patent/JPS6442181A/en
Publication of JPS6442181A publication Critical patent/JPS6442181A/en
Pending legal-status Critical Current

Links

Landscapes

  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To protect the surfaces of mesa semiconductor crystal layers from contamination by photoresist films by a method wherein an insulating film is formed over the whole surface of the semiconductor crystal layers before the photoresist films is formed as a mask for mesa-etching of the semiconductor crystal layers which form a P-N junction. CONSTITUTION:After semiconductor crystal layers 12 and 13 which form a P-N junction are formed on a substrate 11, an insulating film 14 is formed over the whole surface of the crystal layers 12 and 13. After photoresist films 15 of required patterns are formed on the insulating film 14, the crystal layers 12 and 13 are etched with the photoresist films 15 as masks so as to expose the surface of the substrate 11. After metal films 16 are formed on the substrate to connect the isolated semiconductor crystal layers to each other with the metal films 16, anode sulfide films or anode oxide films 17 are formed on the side walls of the crystal layers and the photoresist films 15 are removed and, at the same time, the metal films 16 and the insulating films 17 on the resist films 15 are removed. With this constitution, the mesa semiconductor crystal layers with a P-N junction of an infrared sensor are protected from contamination caused by the photoresist films so that a high quality semiconductor device can be obtained.
JP62198894A 1987-08-08 1987-08-08 Manufacture of semiconductor device Pending JPS6442181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62198894A JPS6442181A (en) 1987-08-08 1987-08-08 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62198894A JPS6442181A (en) 1987-08-08 1987-08-08 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6442181A true JPS6442181A (en) 1989-02-14

Family

ID=16398705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62198894A Pending JPS6442181A (en) 1987-08-08 1987-08-08 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6442181A (en)

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