JPS643337B2 - - Google Patents
Info
- Publication number
- JPS643337B2 JPS643337B2 JP879382A JP879382A JPS643337B2 JP S643337 B2 JPS643337 B2 JP S643337B2 JP 879382 A JP879382 A JP 879382A JP 879382 A JP879382 A JP 879382A JP S643337 B2 JPS643337 B2 JP S643337B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon oxide
- lift
- oxide film
- material layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 46
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 30
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000004544 sputter deposition Methods 0.000 claims description 10
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP879382A JPS58127330A (ja) | 1982-01-25 | 1982-01-25 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP879382A JPS58127330A (ja) | 1982-01-25 | 1982-01-25 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58127330A JPS58127330A (ja) | 1983-07-29 |
JPS643337B2 true JPS643337B2 (en, 2012) | 1989-01-20 |
Family
ID=11702740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP879382A Granted JPS58127330A (ja) | 1982-01-25 | 1982-01-25 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58127330A (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07191907A (ja) * | 1993-11-09 | 1995-07-28 | Internatl Business Mach Corp <Ibm> | キャッシュ・メモリ・アレイに記憶されるデータの有効ステータスを効率的に管理するための方法及びシステム |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679299A (en) * | 1986-08-11 | 1987-07-14 | Ncr Corporation | Formation of self-aligned stacked CMOS structures by lift-off |
JP2013165284A (ja) * | 2013-04-09 | 2013-08-22 | Panasonic Corp | 半導体装置の製造方法 |
-
1982
- 1982-01-25 JP JP879382A patent/JPS58127330A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07191907A (ja) * | 1993-11-09 | 1995-07-28 | Internatl Business Mach Corp <Ibm> | キャッシュ・メモリ・アレイに記憶されるデータの有効ステータスを効率的に管理するための方法及びシステム |
Also Published As
Publication number | Publication date |
---|---|
JPS58127330A (ja) | 1983-07-29 |
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