JPS6428920A - Ashing device - Google Patents

Ashing device

Info

Publication number
JPS6428920A
JPS6428920A JP18476887A JP18476887A JPS6428920A JP S6428920 A JPS6428920 A JP S6428920A JP 18476887 A JP18476887 A JP 18476887A JP 18476887 A JP18476887 A JP 18476887A JP S6428920 A JPS6428920 A JP S6428920A
Authority
JP
Japan
Prior art keywords
ashing
treatment
wafer
holes
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18476887A
Other languages
Japanese (ja)
Inventor
Nobuaki Ooya
Hirotoshi Oshiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP18476887A priority Critical patent/JPS6428920A/en
Publication of JPS6428920A publication Critical patent/JPS6428920A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain an ashing device which can comply with a single-wafer treatment of a large-diameter semiconductor wafer or the like without damaging the wafer by a method wherein a diffusion plate which has two or more holes is installed at an exhaust port of an ashing gas at a nozzle and sidewalls of the holes are crossed obliquely with a face of a substrate to be treated so that the uniformity and a treatment speed of an ashing treatment can be enhanced. CONSTITUTION:The center of a semiconductor wafer 19 is aligned with the center of a mounting stage 18; the wafer is mounted on the stage; while an ashing gas is diffused, it is discharged from holes 24 of a diffusion plate 23 installed inside a nozzle 13 near a discharge part 15 which are tapered in such a way that they are crossed obliquely with a face of the water 19. A stream and a wind pressure of the gas which are suitable for an ashing treatment are realized; an irregularity in the ashing treatment is prevented; a treatment speed and the uniformity of the ashing treatment are enhanced.
JP18476887A 1987-07-24 1987-07-24 Ashing device Pending JPS6428920A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18476887A JPS6428920A (en) 1987-07-24 1987-07-24 Ashing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18476887A JPS6428920A (en) 1987-07-24 1987-07-24 Ashing device

Publications (1)

Publication Number Publication Date
JPS6428920A true JPS6428920A (en) 1989-01-31

Family

ID=16158984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18476887A Pending JPS6428920A (en) 1987-07-24 1987-07-24 Ashing device

Country Status (1)

Country Link
JP (1) JPS6428920A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009081457A (en) * 2008-11-25 2009-04-16 Hitachi Kokusai Electric Inc Substrate treating apparatus and manufacturing method of semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220766A (en) * 1975-08-04 1977-02-16 Texas Instruments Inc Method of removing phtoresist layer and processing apparatus thereof
JPS54128284A (en) * 1978-03-29 1979-10-04 Kokusai Electric Co Ltd Electrode structure for semiconductor wafer plasma etching stripping device
JPS6298728A (en) * 1985-10-25 1987-05-08 Matsushita Electric Ind Co Ltd Dryetching device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220766A (en) * 1975-08-04 1977-02-16 Texas Instruments Inc Method of removing phtoresist layer and processing apparatus thereof
JPS54128284A (en) * 1978-03-29 1979-10-04 Kokusai Electric Co Ltd Electrode structure for semiconductor wafer plasma etching stripping device
JPS6298728A (en) * 1985-10-25 1987-05-08 Matsushita Electric Ind Co Ltd Dryetching device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009081457A (en) * 2008-11-25 2009-04-16 Hitachi Kokusai Electric Inc Substrate treating apparatus and manufacturing method of semiconductor device

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