JPS6427221A - Manufacture of laminated type semiconductor device - Google Patents

Manufacture of laminated type semiconductor device

Info

Publication number
JPS6427221A
JPS6427221A JP18214287A JP18214287A JPS6427221A JP S6427221 A JPS6427221 A JP S6427221A JP 18214287 A JP18214287 A JP 18214287A JP 18214287 A JP18214287 A JP 18214287A JP S6427221 A JPS6427221 A JP S6427221A
Authority
JP
Japan
Prior art keywords
silicon
single crystalline
substrate
epitaxial growth
lateral epitaxial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18214287A
Other languages
Japanese (ja)
Other versions
JPH0573324B2 (en
Inventor
Kazuyuki Sugahara
Tadashi Nishimura
Shigeru Kusunoki
Yasuaki Inoue
Yasuo Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP18214287A priority Critical patent/JPS6427221A/en
Publication of JPS6427221A publication Critical patent/JPS6427221A/en
Publication of JPH0573324B2 publication Critical patent/JPH0573324B2/ja
Granted legal-status Critical Current

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  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To perform a preferably lateral epitaxial growth by reducing the area of an opening formed at part of an insulating layer smaller than 9mum<2>. CONSTITUTION:A polycrystalline silicon 79 for forming a third layer transistor is irradiated with laser light to be converted to a single crystal. Since a polycrystalline silicon 64 having 9mum<2> of less of area is buried into an opening 52, impurities of first and second layer MOS transistors A, B are not diffused and characteristics are not hence deteriorated. The silicon 79 is connected through a single crystalline silicon 75 and epitaxially grown silicon 61 to a single crystalline silicon substrate 11. Thus, solidification and recrystallization occur from the single crystalline silicon of the silicon 75, the silicon 61 and the substrate 11, the silicon 79 can be always formed to be single crystalline silicon having the same crystal axis as that of the substrate 11 by a lateral epitaxial growth, thereby facilitating a lateral epitaxial growth.
JP18214287A 1987-07-23 1987-07-23 Manufacture of laminated type semiconductor device Granted JPS6427221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18214287A JPS6427221A (en) 1987-07-23 1987-07-23 Manufacture of laminated type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18214287A JPS6427221A (en) 1987-07-23 1987-07-23 Manufacture of laminated type semiconductor device

Publications (2)

Publication Number Publication Date
JPS6427221A true JPS6427221A (en) 1989-01-30
JPH0573324B2 JPH0573324B2 (en) 1993-10-14

Family

ID=16113085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18214287A Granted JPS6427221A (en) 1987-07-23 1987-07-23 Manufacture of laminated type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6427221A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005333136A (en) * 2004-05-17 2005-12-02 Samsung Electronics Co Ltd Semiconductor device having field-effect transistor and its manufacturing method
JP2006080486A (en) * 2004-09-08 2006-03-23 Samsung Electronics Co Ltd Forming method of epitaxial film, thin film forming method using the same and manufacturing method of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005333136A (en) * 2004-05-17 2005-12-02 Samsung Electronics Co Ltd Semiconductor device having field-effect transistor and its manufacturing method
JP2006080486A (en) * 2004-09-08 2006-03-23 Samsung Electronics Co Ltd Forming method of epitaxial film, thin film forming method using the same and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JPH0573324B2 (en) 1993-10-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term