JPS6425929A - Copper alloy for electronic equipment - Google Patents
Copper alloy for electronic equipmentInfo
- Publication number
- JPS6425929A JPS6425929A JP18083787A JP18083787A JPS6425929A JP S6425929 A JPS6425929 A JP S6425929A JP 18083787 A JP18083787 A JP 18083787A JP 18083787 A JP18083787 A JP 18083787A JP S6425929 A JPS6425929 A JP S6425929A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- contents
- electronic equipment
- precipitate
- regulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18083787A JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18083787A JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6425929A true JPS6425929A (en) | 1989-01-27 |
| JPH0425338B2 JPH0425338B2 (cs) | 1992-04-30 |
Family
ID=16090224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18083787A Granted JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425929A (cs) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115538A (ja) * | 1989-09-29 | 1991-05-16 | Tsuneaki Mikawa | 粒子分散強化特殊銅合金 |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| CN1063801C (zh) * | 1998-01-14 | 2001-03-28 | 浙江大学 | 一种高强度高软化温度铜基弹性材料 |
| US6379478B1 (en) * | 1998-08-21 | 2002-04-30 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
| FR2838454A1 (fr) * | 2002-04-10 | 2003-10-17 | Clal Msx | Alliages cuivreux durcissables sans beryllium a hautes caracteristiques mecaniques pour le decolletage |
| CN1327017C (zh) * | 2004-07-22 | 2007-07-18 | 同济大学 | 一种弹性导电合金的制备方法 |
| WO2007124915A3 (de) * | 2006-04-28 | 2008-03-13 | Wieland Werke Ag | Kupfer-nickel-zinn-legierung und deren verwendung |
| JP4725688B2 (ja) * | 2008-04-25 | 2011-07-13 | 三菱マテリアル株式会社 | 太陽電池用インターコネクタ用材料及び太陽電池用インターコネクタ |
| CN107858551A (zh) * | 2017-11-06 | 2018-03-30 | 江苏科技大学 | 电阻焊电极用高强高导耐磨无毒铜合金及其制备方法 |
| CN110527860A (zh) * | 2019-09-23 | 2019-12-03 | 四川博鑫铜业有限公司 | 一种废紫杂铜精炼剂及其制备方法和应用 |
| CN111471888A (zh) * | 2020-05-09 | 2020-07-31 | 南京工程学院 | 纳米金属间化合物弥散强化高导电耐磨铜合金及其制造方法和应用 |
| CN111519061A (zh) * | 2019-02-01 | 2020-08-11 | 内蒙金属材料研究所 | 一种稀土掺杂的Cu-Cr-Zr合金材料及其制备方法和应用 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2514502B (en) | 2012-01-27 | 2019-07-03 | The Sure Chill Company Ltd | Refrigeration apparatus |
| US10704822B2 (en) | 2015-09-11 | 2020-07-07 | The Sure Chill Company Limited | Portable refrigeration apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362833A (ja) * | 1986-09-02 | 1988-03-19 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS6369933A (ja) * | 1986-09-11 | 1988-03-30 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金とその製造法 |
| JPS6386838A (ja) * | 1986-09-30 | 1988-04-18 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS63130739A (ja) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
| JPS63274729A (ja) * | 1987-04-30 | 1988-11-11 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金 |
-
1987
- 1987-07-20 JP JP18083787A patent/JPS6425929A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362833A (ja) * | 1986-09-02 | 1988-03-19 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS6369933A (ja) * | 1986-09-11 | 1988-03-30 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金とその製造法 |
| JPS6386838A (ja) * | 1986-09-30 | 1988-04-18 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS63130739A (ja) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
| JPS63274729A (ja) * | 1987-04-30 | 1988-11-11 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金 |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115538A (ja) * | 1989-09-29 | 1991-05-16 | Tsuneaki Mikawa | 粒子分散強化特殊銅合金 |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| CN1063801C (zh) * | 1998-01-14 | 2001-03-28 | 浙江大学 | 一种高强度高软化温度铜基弹性材料 |
| US6379478B1 (en) * | 1998-08-21 | 2002-04-30 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
| FR2838454A1 (fr) * | 2002-04-10 | 2003-10-17 | Clal Msx | Alliages cuivreux durcissables sans beryllium a hautes caracteristiques mecaniques pour le decolletage |
| CN1327017C (zh) * | 2004-07-22 | 2007-07-18 | 同济大学 | 一种弹性导电合金的制备方法 |
| WO2007124915A3 (de) * | 2006-04-28 | 2008-03-13 | Wieland Werke Ag | Kupfer-nickel-zinn-legierung und deren verwendung |
| JP4725688B2 (ja) * | 2008-04-25 | 2011-07-13 | 三菱マテリアル株式会社 | 太陽電池用インターコネクタ用材料及び太陽電池用インターコネクタ |
| CN107858551A (zh) * | 2017-11-06 | 2018-03-30 | 江苏科技大学 | 电阻焊电极用高强高导耐磨无毒铜合金及其制备方法 |
| CN111519061A (zh) * | 2019-02-01 | 2020-08-11 | 内蒙金属材料研究所 | 一种稀土掺杂的Cu-Cr-Zr合金材料及其制备方法和应用 |
| CN110527860A (zh) * | 2019-09-23 | 2019-12-03 | 四川博鑫铜业有限公司 | 一种废紫杂铜精炼剂及其制备方法和应用 |
| CN110527860B (zh) * | 2019-09-23 | 2021-09-07 | 四川博鑫铜业有限公司 | 一种废紫杂铜精炼剂及其制备方法和应用 |
| CN111471888A (zh) * | 2020-05-09 | 2020-07-31 | 南京工程学院 | 纳米金属间化合物弥散强化高导电耐磨铜合金及其制造方法和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0425338B2 (cs) | 1992-04-30 |
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