JPS6424846U - - Google Patents
Info
- Publication number
- JPS6424846U JPS6424846U JP11986487U JP11986487U JPS6424846U JP S6424846 U JPS6424846 U JP S6424846U JP 11986487 U JP11986487 U JP 11986487U JP 11986487 U JP11986487 U JP 11986487U JP S6424846 U JPS6424846 U JP S6424846U
- Authority
- JP
- Japan
- Prior art keywords
- metallization
- ceramic
- brazing pad
- pad metallization
- conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001465 metallisation Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案を施してなる半導体容器の斜
視図、第２図はその引出し端子金具との接合部分
の断面斜視図、第３図はその他の実施例の部分斜
視図である。
１……半導体容器、２……セラミツク本体、３
……配線メタライズ、４……上下層導通用メタラ
イズ、５……端部、６……ろう付パツト用メタラ
イズ、７……ろう材、８……引出し端子用金具ピ
ン、９，９′……突設部、１０……リード線。
FIG. 1 is a perspective view of a semiconductor container to which this invention is applied, FIG. 2 is a cross-sectional perspective view of a joint portion with a lead-out terminal fitting, and FIG. 3 is a partial perspective view of another embodiment. 1... Semiconductor container, 2... Ceramic body, 3
... Wiring metallization, 4 ... Metallization for upper and lower layer conduction, 5 ... End, 6 ... Metalization for brazing parts, 7 ... Brazing metal, 8 ... Metal fitting pin for extraction terminal, 9, 9' ... Projection part, 10...Lead wire.
Claims (1)
ライズ端部に設ける連結用ろう付パツトメタライ
ズの周囲に、上記ろう付パツトメタライズの厚さ
よりも厚いセラミツク又はガラス等の絶縁材料の
突設部を周設してなる半導体容器の端子接合構造
。 A protruding part of an insulating material such as ceramic or glass, which is thicker than the thickness of the brazing pad metallization, is provided around the connecting brazing pad metallization provided at the end of the metallization for conduction between the upper and lower layers that conducts within the ceramic body. Terminal junction structure for semiconductor containers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11986487U JPS6424846U (en) | 1987-08-06 | 1987-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11986487U JPS6424846U (en) | 1987-08-06 | 1987-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424846U true JPS6424846U (en) | 1989-02-10 |
Family
ID=31365466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11986487U Pending JPS6424846U (en) | 1987-08-06 | 1987-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424846U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822749B2 (en) * | 1975-10-24 | 1983-05-11 | 株式会社日立製作所 | exciyou matrix panel |
| JPS599951A (en) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | Lead pin fixing structure of multilayer ceramic substrate |
-
1987
- 1987-08-06 JP JP11986487U patent/JPS6424846U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822749B2 (en) * | 1975-10-24 | 1983-05-11 | 株式会社日立製作所 | exciyou matrix panel |
| JPS599951A (en) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | Lead pin fixing structure of multilayer ceramic substrate |