JPS6424432A - Manufacture of resin-sealed electric component - Google Patents
Manufacture of resin-sealed electric componentInfo
- Publication number
- JPS6424432A JPS6424432A JP18068987A JP18068987A JPS6424432A JP S6424432 A JPS6424432 A JP S6424432A JP 18068987 A JP18068987 A JP 18068987A JP 18068987 A JP18068987 A JP 18068987A JP S6424432 A JPS6424432 A JP S6424432A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding
- external leads
- mold
- sealed body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To form a resin-sealed body using a transfer mold as well as to make it possible to accurately position an external lead by a method wherein anauxiliary molding mold is used. CONSTITUTION:When a resin-sealed body 26 is formed, the main body part 1 is surrounded in such a manner that a desired molding space 33 can be obtained using at least two main molding molds 28 and 29 and at least one auxiliary molding mold 30. Then, resin is pressinjected into the molding space 33 in the state wherein the auxiliary molding mold 30 is arranged between the first tubular external leads 18-20 and the second external leads 21-23, and a resin-sealed body 26 is formed. Not only the above-mentioned auxiliary molding mold 30 forms the molding space 33 but also it contributes to the mutual positioning of the first and the second tabular external leads 18-23. Accordingly, the supporting of the first and the second tabular external leads 18-23 by a resin block or a terminal strip and the like is unnecessitated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18068987A JPH0831489B2 (en) | 1987-07-20 | 1987-07-20 | Method for manufacturing resin-sealed electric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18068987A JPH0831489B2 (en) | 1987-07-20 | 1987-07-20 | Method for manufacturing resin-sealed electric component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6424432A true JPS6424432A (en) | 1989-01-26 |
| JPH0831489B2 JPH0831489B2 (en) | 1996-03-27 |
Family
ID=16087588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18068987A Expired - Fee Related JPH0831489B2 (en) | 1987-07-20 | 1987-07-20 | Method for manufacturing resin-sealed electric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831489B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012099628A (en) * | 2010-11-02 | 2012-05-24 | Towa Corp | Resin seal molding method and device of electric circuit component |
-
1987
- 1987-07-20 JP JP18068987A patent/JPH0831489B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012099628A (en) * | 2010-11-02 | 2012-05-24 | Towa Corp | Resin seal molding method and device of electric circuit component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831489B2 (en) | 1996-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |