JPS6437006A - Chip-like sold electrolytic capacitor - Google Patents
Chip-like sold electrolytic capacitorInfo
- Publication number
- JPS6437006A JPS6437006A JP62192923A JP19292387A JPS6437006A JP S6437006 A JPS6437006 A JP S6437006A JP 62192923 A JP62192923 A JP 62192923A JP 19292387 A JP19292387 A JP 19292387A JP S6437006 A JPS6437006 A JP S6437006A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- cathode
- anode
- cathode terminal
- roughened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title abstract 4
- 238000000465 moulding Methods 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 230000008602 contraction Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE:To prevent the occurrence of insufficient opening even when a temperature cycle test and the like is conducted on the finished product on which an external covering is provided using molding resin by a method wherein the surface of the capacitor element side of a cathode terminal board is roughened. CONSTITUTION:An anode terminal is connected to the anode lead-out wire and the anode layer of a capacitor element respectively, and a cathode terminal 9, on which a roughing (11) treatment is conducted, is connected to the surface contacting to the cathode layer, and they are covered with molding. At this point, it is desirable that the area of the recessed part becomes 1/5-4/5, and its depth of 5-25mum is roughened. As a result, complete soldering or connection with a conductive bonding agent of the cathode layer and the cathode terminal 9 of the capacitor element can be accomplished, the abovementioned soldering or connection can sufficiently withstand the expansion and contraction of the clad resin, and no insufficient opening takes place.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62192923A JPS6437006A (en) | 1987-07-31 | 1987-07-31 | Chip-like sold electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62192923A JPS6437006A (en) | 1987-07-31 | 1987-07-31 | Chip-like sold electrolytic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437006A true JPS6437006A (en) | 1989-02-07 |
Family
ID=16299231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62192923A Pending JPS6437006A (en) | 1987-07-31 | 1987-07-31 | Chip-like sold electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437006A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100271758A1 (en) * | 2009-04-22 | 2010-10-28 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor |
US20120162852A1 (en) * | 2010-12-28 | 2012-06-28 | Industrial Technology Research Institute | Decoupling device |
US20120229957A1 (en) * | 2011-03-11 | 2012-09-13 | Avx Corporation | Solid Electrolytic Capacitor Containing a Cathode Termination with a Slot for an Adhesive |
CN103107021A (en) * | 2011-11-10 | 2013-05-15 | 财团法人工业技术研究院 | Decoupling element and manufacturing method thereof |
US20140071591A1 (en) * | 2012-09-13 | 2014-03-13 | Industrial Technology Research Institute | Decoupling device with three-dimensional lead frame and fabricating method thereof |
US20150194269A1 (en) * | 2012-09-28 | 2015-07-09 | Panasonic Intellectual Property Management Co., Ltd. | Solid electrolytic capacitor and production method therefor |
WO2024203049A1 (en) * | 2023-03-24 | 2024-10-03 | パナソニックIpマネジメント株式会社 | Solid electrolytic capacitor and method for manufacturing same |
-
1987
- 1987-07-31 JP JP62192923A patent/JPS6437006A/en active Pending
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8390990B2 (en) * | 2009-04-22 | 2013-03-05 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor having a cathode lead frame |
US20100271758A1 (en) * | 2009-04-22 | 2010-10-28 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor |
US8773844B2 (en) * | 2010-12-28 | 2014-07-08 | Industrial Technology Research Institute | Solid electrolytic capacitor |
US20120162852A1 (en) * | 2010-12-28 | 2012-06-28 | Industrial Technology Research Institute | Decoupling device |
CN102543445A (en) * | 2010-12-28 | 2012-07-04 | 财团法人工业技术研究院 | Decoupling component |
US9058933B2 (en) | 2010-12-28 | 2015-06-16 | Industrial Technology Research Institute | Decoupling device including a plurality of capacitor unit arrayed in a same plane |
CN104103427A (en) * | 2010-12-28 | 2014-10-15 | 财团法人工业技术研究院 | Decoupling component |
US8514550B2 (en) * | 2011-03-11 | 2013-08-20 | Avx Corporation | Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive |
US20120229957A1 (en) * | 2011-03-11 | 2012-09-13 | Avx Corporation | Solid Electrolytic Capacitor Containing a Cathode Termination with a Slot for an Adhesive |
US8922976B2 (en) | 2011-11-10 | 2014-12-30 | Industrial Technology Research Institute | Decoupling device and fabricating method thereof |
CN103107021A (en) * | 2011-11-10 | 2013-05-15 | 财团法人工业技术研究院 | Decoupling element and manufacturing method thereof |
TWI511172B (en) * | 2011-11-10 | 2015-12-01 | 財團法人工業技術研究院 | Decoupling device and fabricating method thereof |
US20140071591A1 (en) * | 2012-09-13 | 2014-03-13 | Industrial Technology Research Institute | Decoupling device with three-dimensional lead frame and fabricating method thereof |
US9214284B2 (en) * | 2012-09-13 | 2015-12-15 | Industrial Technology Research Institute | Decoupling device with three-dimensional lead frame and fabricating method thereof |
US20150194269A1 (en) * | 2012-09-28 | 2015-07-09 | Panasonic Intellectual Property Management Co., Ltd. | Solid electrolytic capacitor and production method therefor |
US9741495B2 (en) * | 2012-09-28 | 2017-08-22 | Panasonic Intellectual Property Management Co., Ltd. | Solid electrolytic capacitor including pillow member having edge overlapping recessed portion or through hole, and production method therefor |
US10014119B2 (en) | 2012-09-28 | 2018-07-03 | Panasonic Intellectual Property Management Co., Ltd. | Solid electrolytic capacitor including positive electrode connection member having recessed portion, and production method therefor |
WO2024203049A1 (en) * | 2023-03-24 | 2024-10-03 | パナソニックIpマネジメント株式会社 | Solid electrolytic capacitor and method for manufacturing same |
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