JPS6418294A - Flexible printed circuit board - Google Patents

Flexible printed circuit board

Info

Publication number
JPS6418294A
JPS6418294A JP17383187A JP17383187A JPS6418294A JP S6418294 A JPS6418294 A JP S6418294A JP 17383187 A JP17383187 A JP 17383187A JP 17383187 A JP17383187 A JP 17383187A JP S6418294 A JPS6418294 A JP S6418294A
Authority
JP
Japan
Prior art keywords
polyimide
heat
anhydride
copper foil
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17383187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0366825B2 (enrdf_load_stackoverflow
Inventor
Sumitoshi Asakuma
Akira Toko
Toshiro Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP17383187A priority Critical patent/JPS6418294A/ja
Publication of JPS6418294A publication Critical patent/JPS6418294A/ja
Publication of JPH0366825B2 publication Critical patent/JPH0366825B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP17383187A 1987-07-14 1987-07-14 Flexible printed circuit board Granted JPS6418294A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17383187A JPS6418294A (en) 1987-07-14 1987-07-14 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17383187A JPS6418294A (en) 1987-07-14 1987-07-14 Flexible printed circuit board

Publications (2)

Publication Number Publication Date
JPS6418294A true JPS6418294A (en) 1989-01-23
JPH0366825B2 JPH0366825B2 (enrdf_load_stackoverflow) 1991-10-18

Family

ID=15967963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17383187A Granted JPS6418294A (en) 1987-07-14 1987-07-14 Flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS6418294A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05105755A (ja) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd ポリイソイミドおよびそのフイルム
JPH05105777A (ja) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd ポリイソイミドフイルム及びこれを用いたフレキシブル印刷回路用基板の製造方法
JP2011014727A (ja) * 2009-07-02 2011-01-20 Mitsui Mining & Smelting Co Ltd 複合樹脂層付銅箔、複合樹脂層付銅箔の製造方法、フレキシブル両面銅張積層板及び立体成型プリント配線板の製造方法
JP2012522863A (ja) * 2009-04-03 2012-09-27 ドゥーサン コーポレイション ポリアミック酸溶液、ポリイミド樹脂及びこれを用いたフレキシブル金属箔張積層板
DE102021115741A1 (de) 2020-06-23 2021-12-23 Makita Corporation Befestigungswerkzeug

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05105755A (ja) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd ポリイソイミドおよびそのフイルム
JPH05105777A (ja) * 1991-10-15 1993-04-27 Sumitomo Bakelite Co Ltd ポリイソイミドフイルム及びこれを用いたフレキシブル印刷回路用基板の製造方法
JP2012522863A (ja) * 2009-04-03 2012-09-27 ドゥーサン コーポレイション ポリアミック酸溶液、ポリイミド樹脂及びこれを用いたフレキシブル金属箔張積層板
JP2011014727A (ja) * 2009-07-02 2011-01-20 Mitsui Mining & Smelting Co Ltd 複合樹脂層付銅箔、複合樹脂層付銅箔の製造方法、フレキシブル両面銅張積層板及び立体成型プリント配線板の製造方法
DE102021115741A1 (de) 2020-06-23 2021-12-23 Makita Corporation Befestigungswerkzeug

Also Published As

Publication number Publication date
JPH0366825B2 (enrdf_load_stackoverflow) 1991-10-18

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