JPS6416611A - Dicing device for semiconductive wafer - Google Patents

Dicing device for semiconductive wafer

Info

Publication number
JPS6416611A
JPS6416611A JP17218487A JP17218487A JPS6416611A JP S6416611 A JPS6416611 A JP S6416611A JP 17218487 A JP17218487 A JP 17218487A JP 17218487 A JP17218487 A JP 17218487A JP S6416611 A JPS6416611 A JP S6416611A
Authority
JP
Japan
Prior art keywords
wafer
cooling
dicing stage
diamond blade
semiconductive wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17218487A
Other languages
Japanese (ja)
Inventor
Masato Ujiie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17218487A priority Critical patent/JPS6416611A/en
Publication of JPS6416611A publication Critical patent/JPS6416611A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent the temperature rising of a diamond blade, while the friction heat between the diamond blade and a wafer sheet is easily diffused by providing the mechanism for cooling the semiconductive wafer in a dicing stage. CONSTITUTION:The ejecting nozzle 2 ejecting cooling wafer adjacently to a diamond blade 1 in contact with the part to be cut of a semiconductive wafer 3, is provided in a dicing stage 5. The dicing stage 5 includes the cooling pipe 6 for cooling the semiconductive wafer 3. For the cooling medium flowing in this cooling pipe 6, wafer or the oil cooled at most to 0 deg.C, etc., is used. In order to cool uniformly the total surface of the dicing stage 5, the high heat conductive material such as SiC ceramic or copper, etc., is used as the material of the dicing stage 5, and its surface is polished as flatly as possible. Thus, by providing the mechanism for cooling the semiconductive wafer 3 in the dicing stage 5, the friction heat built up in the wafer sheet 7, etc., is removed, whereby the life of the diamond blade 1 can be extended.
JP17218487A 1987-07-10 1987-07-10 Dicing device for semiconductive wafer Pending JPS6416611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17218487A JPS6416611A (en) 1987-07-10 1987-07-10 Dicing device for semiconductive wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17218487A JPS6416611A (en) 1987-07-10 1987-07-10 Dicing device for semiconductive wafer

Publications (1)

Publication Number Publication Date
JPS6416611A true JPS6416611A (en) 1989-01-20

Family

ID=15937134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17218487A Pending JPS6416611A (en) 1987-07-10 1987-07-10 Dicing device for semiconductive wafer

Country Status (1)

Country Link
JP (1) JPS6416611A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132396A (en) * 1992-10-19 1994-05-13 Rohm Co Ltd Dicing method
US6105567A (en) * 1997-05-29 2000-08-22 Samsung Electronics Co., Ltd. Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation
KR100699542B1 (en) * 2006-07-31 2007-03-23 신성공업주식회사 Device for manufacturing of transformer
JP2010093005A (en) * 2008-10-07 2010-04-22 Disco Abrasive Syst Ltd Processing method of wafer
US8049018B2 (en) 2006-03-13 2011-11-01 Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo Methine dyes and uses of the same
KR200470836Y1 (en) * 2011-12-29 2014-01-13 세메스 주식회사 Work table for sawing a electronic component
JP2015061016A (en) * 2013-09-20 2015-03-30 Ｔｏｗａ株式会社 Cutting device and cutting method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132396A (en) * 1992-10-19 1994-05-13 Rohm Co Ltd Dicing method
US6105567A (en) * 1997-05-29 2000-08-22 Samsung Electronics Co., Ltd. Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation
US8049018B2 (en) 2006-03-13 2011-11-01 Kabushiki Kaisha Hayashibara Seibutsu Kagaku Kenkyujo Methine dyes and uses of the same
KR100699542B1 (en) * 2006-07-31 2007-03-23 신성공업주식회사 Device for manufacturing of transformer
JP2010093005A (en) * 2008-10-07 2010-04-22 Disco Abrasive Syst Ltd Processing method of wafer
KR200470836Y1 (en) * 2011-12-29 2014-01-13 세메스 주식회사 Work table for sawing a electronic component
JP2015061016A (en) * 2013-09-20 2015-03-30 Ｔｏｗａ株式会社 Cutting device and cutting method

Similar Documents

Publication Publication Date Title
SE8206555D0 (en) THERMOELECTRIC COLD SUND
JPS5364890A (en) Method of producing silicon nitride grinding wheel
JPS6416611A (en) Dicing device for semiconductive wafer
FR2338565A1 (en) Overcurrent protection with thermomechanical transducer - provides form changes of transducer under increased current conditions
SE8103502L (en) ROTATING LEATHER FOR ROTOR SHEETS
ATE55761T1 (en) SURFACE MELTING WITH THERMAL PROTECTION.
JPS5611281A (en) Thermal head
JPS56131930A (en) Controlling device of wafer temperature
JPH06126733A (en) Method for cutting using wire saw
JPS5524476A (en) Laser oscillator
Dalal Machining of ceramics for bearing applications
FR2414256A1 (en) Matched high power UHF load - is formed on pyramid shaped mandrel by absorbent layer covered with layer of copper
JPS643202A (en) Cooling device for steam turbine
JPS6446930A (en) Base plate for sample
JPS53138677A (en) Vapor cooling type semiconductor device
JPS6428944A (en) Cooling structure of integrated circuit
SE8201466L (en) WATER-COOLED ELECTRIC BUILDING KIT AND SET FOR MANUFACTURING THIS
JPS57182461A (en) Heat dissipating substrate
JPS6489498A (en) Liquid cooling of large computer and liquid cooling device therefor
JPS5595320A (en) Cvd device
JPS5662718A (en) Bow saw for cutting hard substance or metal
JPS5558822A (en) Magnetic head
JPS5354384A (en) Method for slicing semi-conductor ingots
JPS6423527A (en) Cantilever paddle
West Grinding Advanced Ceramics