JPS6414995A - Manufacture of multilayered substrate - Google Patents

Manufacture of multilayered substrate

Info

Publication number
JPS6414995A
JPS6414995A JP16963887A JP16963887A JPS6414995A JP S6414995 A JPS6414995 A JP S6414995A JP 16963887 A JP16963887 A JP 16963887A JP 16963887 A JP16963887 A JP 16963887A JP S6414995 A JPS6414995 A JP S6414995A
Authority
JP
Japan
Prior art keywords
film
thickness
multilayered substrate
pentene
1mum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16963887A
Other languages
Japanese (ja)
Other versions
JPH088418B2 (en
Inventor
Akira Niitsuma
Takeshi Miyagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16963887A priority Critical patent/JPH088418B2/en
Publication of JPS6414995A publication Critical patent/JPS6414995A/en
Publication of JPH088418B2 publication Critical patent/JPH088418B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To simplify the manufacturing process of a multilayered substrate and to lessen the delay of signal propagation by a method wherein a polymethyl pentene film is used as an organic film. CONSTITUTION:A first wiring layer 2 is formed on an alumina substrate 1 using a Cu deposited film of a thickness of 1mum, then a polymethyl pentene polymerized film of a thickness of 3mum is formed by plasma polymerization using 1-methyl-4 pentene as a monomer to use as an insulating layer 3. A KrF excimer laser is irradiated locally on the polymethyl pentene film to form a through hole 4 of a size of 10mum and a second wiring layer 5 is formed using an Au deposited film of a thickness of 1mum to complete a multilayered substrate.
JP16963887A 1987-07-09 1987-07-09 Multilayer substrate and manufacturing method thereof Expired - Lifetime JPH088418B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16963887A JPH088418B2 (en) 1987-07-09 1987-07-09 Multilayer substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16963887A JPH088418B2 (en) 1987-07-09 1987-07-09 Multilayer substrate and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS6414995A true JPS6414995A (en) 1989-01-19
JPH088418B2 JPH088418B2 (en) 1996-01-29

Family

ID=15890202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16963887A Expired - Lifetime JPH088418B2 (en) 1987-07-09 1987-07-09 Multilayer substrate and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPH088418B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009191519A (en) * 2008-02-14 2009-08-27 Hitachi Constr Mach Co Ltd Coupler device for construction machine
CN107619264A (en) * 2017-10-16 2018-01-23 深圳市商德先进陶瓷股份有限公司 Aluminium oxide ceramic substrate and its preparation method and application

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009191519A (en) * 2008-02-14 2009-08-27 Hitachi Constr Mach Co Ltd Coupler device for construction machine
CN107619264A (en) * 2017-10-16 2018-01-23 深圳市商德先进陶瓷股份有限公司 Aluminium oxide ceramic substrate and its preparation method and application

Also Published As

Publication number Publication date
JPH088418B2 (en) 1996-01-29

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