JPS6413754A - Flat package ic - Google Patents
Flat package icInfo
- Publication number
- JPS6413754A JPS6413754A JP62170187A JP17018787A JPS6413754A JP S6413754 A JPS6413754 A JP S6413754A JP 62170187 A JP62170187 A JP 62170187A JP 17018787 A JP17018787 A JP 17018787A JP S6413754 A JPS6413754 A JP S6413754A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- fic
- lead terminals
- holes
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170187A JPS6413754A (en) | 1987-07-07 | 1987-07-07 | Flat package ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62170187A JPS6413754A (en) | 1987-07-07 | 1987-07-07 | Flat package ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413754A true JPS6413754A (en) | 1989-01-18 |
Family
ID=15900296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62170187A Pending JPS6413754A (en) | 1987-07-07 | 1987-07-07 | Flat package ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413754A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1067508C (zh) * | 1996-08-22 | 2001-06-20 | 英群企业股份有限公司 | 电路板上芯片保护层固定方法及其装置 |
EP3544394A1 (en) * | 2018-03-24 | 2019-09-25 | Melexis Technologies SA | Integrated circuit lead frame design and method |
CN114252820A (zh) * | 2020-09-24 | 2022-03-29 | 迈来芯电子科技有限公司 | 磁传感器部件和组件 |
US11543466B2 (en) | 2018-03-24 | 2023-01-03 | Melexis Technologies Sa | Magnetic sensor component and assembly |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5471571A (en) * | 1977-11-17 | 1979-06-08 | Nec Corp | Semiconductor device and production of the same |
JPS57106061A (en) * | 1980-12-24 | 1982-07-01 | Toshiba Corp | Semiconductor integrated circuit device |
-
1987
- 1987-07-07 JP JP62170187A patent/JPS6413754A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5471571A (en) * | 1977-11-17 | 1979-06-08 | Nec Corp | Semiconductor device and production of the same |
JPS57106061A (en) * | 1980-12-24 | 1982-07-01 | Toshiba Corp | Semiconductor integrated circuit device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1067508C (zh) * | 1996-08-22 | 2001-06-20 | 英群企业股份有限公司 | 电路板上芯片保护层固定方法及其装置 |
EP3544394A1 (en) * | 2018-03-24 | 2019-09-25 | Melexis Technologies SA | Integrated circuit lead frame design and method |
US11067645B2 (en) | 2018-03-24 | 2021-07-20 | Melexis Technologies Sa | Magnetic sensor component and assembly |
US11474165B2 (en) | 2018-03-24 | 2022-10-18 | Melexis Technologies Sa | Magnetic sensor component and assembly |
US11543466B2 (en) | 2018-03-24 | 2023-01-03 | Melexis Technologies Sa | Magnetic sensor component and assembly |
CN114252820A (zh) * | 2020-09-24 | 2022-03-29 | 迈来芯电子科技有限公司 | 磁传感器部件和组件 |
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