JPS6490588A - Manufacture of printed circuit board - Google Patents
Manufacture of printed circuit boardInfo
- Publication number
- JPS6490588A JPS6490588A JP24889387A JP24889387A JPS6490588A JP S6490588 A JPS6490588 A JP S6490588A JP 24889387 A JP24889387 A JP 24889387A JP 24889387 A JP24889387 A JP 24889387A JP S6490588 A JPS6490588 A JP S6490588A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resin
- circuit board
- printed circuit
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
PURPOSE:To facilitate plating of a conductor layer in a later step and to improve heat resistance by removing resin presented on the surface of an uneven glass cloth by the injection of ultrahigh pressure water when a recess for placing a semiconductor bare chip is formed. CONSTITUTION:Recesses 4 for placing semiconductor bare chips are individually spot faced in a predetermined depth on a plurality of printed circuit board 1. In this case, a resin 3 layer adhered to the glass cloth 2 on the surface 6 of the recess is exfoliated by injecting ultrahigh pressure water to the resin 3 layer by means of an ultrahigh pressure working unit 7. Then, after the resin 3 layer is removed from the surface 6 and hence the cloth 2 layer, a conductor layer D is formed by plating on the surface 6. Then, a semiconductor bare chip is positioned in the recess 4, and placed by bonding on the printed circuit board 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24889387A JPS6490588A (en) | 1987-10-01 | 1987-10-01 | Manufacture of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24889387A JPS6490588A (en) | 1987-10-01 | 1987-10-01 | Manufacture of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6490588A true JPS6490588A (en) | 1989-04-07 |
Family
ID=17185007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24889387A Pending JPS6490588A (en) | 1987-10-01 | 1987-10-01 | Manufacture of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6490588A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01192144A (en) * | 1988-01-28 | 1989-08-02 | Ngk Spark Plug Co Ltd | Device and method for removing foreign substance of ceramic package |
JP2014067919A (en) * | 2012-09-26 | 2014-04-17 | Ibiden Co Ltd | Conductive foreign matter removal method and manufacturing method of wiring board |
-
1987
- 1987-10-01 JP JP24889387A patent/JPS6490588A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01192144A (en) * | 1988-01-28 | 1989-08-02 | Ngk Spark Plug Co Ltd | Device and method for removing foreign substance of ceramic package |
JP2014067919A (en) * | 2012-09-26 | 2014-04-17 | Ibiden Co Ltd | Conductive foreign matter removal method and manufacturing method of wiring board |
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