JPS6490588A - Manufacture of printed circuit board - Google Patents

Manufacture of printed circuit board

Info

Publication number
JPS6490588A
JPS6490588A JP24889387A JP24889387A JPS6490588A JP S6490588 A JPS6490588 A JP S6490588A JP 24889387 A JP24889387 A JP 24889387A JP 24889387 A JP24889387 A JP 24889387A JP S6490588 A JPS6490588 A JP S6490588A
Authority
JP
Japan
Prior art keywords
layer
resin
circuit board
printed circuit
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24889387A
Other languages
Japanese (ja)
Inventor
Hideo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AIRETSUKUSU KK
IREX CORP
Original Assignee
AIRETSUKUSU KK
IREX CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AIRETSUKUSU KK, IREX CORP filed Critical AIRETSUKUSU KK
Priority to JP24889387A priority Critical patent/JPS6490588A/en
Publication of JPS6490588A publication Critical patent/JPS6490588A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)

Abstract

PURPOSE:To facilitate plating of a conductor layer in a later step and to improve heat resistance by removing resin presented on the surface of an uneven glass cloth by the injection of ultrahigh pressure water when a recess for placing a semiconductor bare chip is formed. CONSTITUTION:Recesses 4 for placing semiconductor bare chips are individually spot faced in a predetermined depth on a plurality of printed circuit board 1. In this case, a resin 3 layer adhered to the glass cloth 2 on the surface 6 of the recess is exfoliated by injecting ultrahigh pressure water to the resin 3 layer by means of an ultrahigh pressure working unit 7. Then, after the resin 3 layer is removed from the surface 6 and hence the cloth 2 layer, a conductor layer D is formed by plating on the surface 6. Then, a semiconductor bare chip is positioned in the recess 4, and placed by bonding on the printed circuit board 1.
JP24889387A 1987-10-01 1987-10-01 Manufacture of printed circuit board Pending JPS6490588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24889387A JPS6490588A (en) 1987-10-01 1987-10-01 Manufacture of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24889387A JPS6490588A (en) 1987-10-01 1987-10-01 Manufacture of printed circuit board

Publications (1)

Publication Number Publication Date
JPS6490588A true JPS6490588A (en) 1989-04-07

Family

ID=17185007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24889387A Pending JPS6490588A (en) 1987-10-01 1987-10-01 Manufacture of printed circuit board

Country Status (1)

Country Link
JP (1) JPS6490588A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01192144A (en) * 1988-01-28 1989-08-02 Ngk Spark Plug Co Ltd Device and method for removing foreign substance of ceramic package
JP2014067919A (en) * 2012-09-26 2014-04-17 Ibiden Co Ltd Conductive foreign matter removal method and manufacturing method of wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01192144A (en) * 1988-01-28 1989-08-02 Ngk Spark Plug Co Ltd Device and method for removing foreign substance of ceramic package
JP2014067919A (en) * 2012-09-26 2014-04-17 Ibiden Co Ltd Conductive foreign matter removal method and manufacturing method of wiring board

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