JPS6411526B2 - - Google Patents
Info
- Publication number
- JPS6411526B2 JPS6411526B2 JP5200682A JP5200682A JPS6411526B2 JP S6411526 B2 JPS6411526 B2 JP S6411526B2 JP 5200682 A JP5200682 A JP 5200682A JP 5200682 A JP5200682 A JP 5200682A JP S6411526 B2 JPS6411526 B2 JP S6411526B2
- Authority
- JP
- Japan
- Prior art keywords
- chute
- air cylinder
- semiconductor device
- pen air
- pen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 109
- 239000013307 optical fiber Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 56
- 230000007246 mechanism Effects 0.000 description 16
- 230000002950 deficient Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chutes (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5200682A JPS58168251A (ja) | 1982-03-30 | 1982-03-30 | 供給シユ−ト装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5200682A JPS58168251A (ja) | 1982-03-30 | 1982-03-30 | 供給シユ−ト装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58168251A JPS58168251A (ja) | 1983-10-04 |
| JPS6411526B2 true JPS6411526B2 (enExample) | 1989-02-27 |
Family
ID=12902731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5200682A Granted JPS58168251A (ja) | 1982-03-30 | 1982-03-30 | 供給シユ−ト装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168251A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60213041A (ja) * | 1984-04-09 | 1985-10-25 | Sanwa Electron Kk | Icのピンの状態検出装置 |
| JPH0644100Y2 (ja) * | 1986-03-19 | 1994-11-14 | 旭化成工業株式会社 | 半導体素子の位置決め装置 |
| JPS6335712U (enExample) * | 1986-08-25 | 1988-03-08 | ||
| JPH0680930B2 (ja) * | 1987-02-02 | 1994-10-12 | 株式会社日立製作所 | 部品供給装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511884U (enExample) * | 1978-07-11 | 1980-01-25 |
-
1982
- 1982-03-30 JP JP5200682A patent/JPS58168251A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58168251A (ja) | 1983-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE19523969C2 (de) | Bausteintransportvorrichtung und Verfahren zum wiederholten Testen von Bausteinen für IC-Handhabungseinrichtung | |
| JPS633781A (ja) | 不完全煙草排除装置 | |
| EP3909872A1 (de) | Verfahren und anordnung zum übergeben von produkten | |
| JPS6411526B2 (enExample) | ||
| JPH02242715A (ja) | 製品位置決め方法及びその装置 | |
| JPS5857735A (ja) | 選別装置 | |
| CN221039326U (zh) | 一种芯片串测平台 | |
| JPS58168247A (ja) | 選別シュ−ト装置 | |
| JPS6227541B2 (enExample) | ||
| KR101460962B1 (ko) | 비전검사장비의 로더장치 | |
| JPS628938B2 (enExample) | ||
| KR100500917B1 (ko) | 반도체패키지 튜브적재장치 | |
| KR101084606B1 (ko) | 발광 다이오드 검사 및 포장 통합장치를 이용한 발광 다이오드 포장방법 | |
| US4222488A (en) | Methods and apparatus for sorting articles | |
| JPS6229902B2 (enExample) | ||
| JPS6230695B2 (enExample) | ||
| JPH02131178A (ja) | 環状ワークの選別装置 | |
| KR100247382B1 (ko) | Bga 반도체패키지용 검사장치 | |
| JPH0610046B2 (ja) | 半導体装置の移送装置 | |
| CN219378049U (zh) | 一种汽车线圈骨架生产装置 | |
| JPS6167239A (ja) | Icハンドラの多連型搬出機構 | |
| JPH0717025Y2 (ja) | Ic試験装置 | |
| JPS6130981Y2 (enExample) | ||
| DE102007048397B3 (de) | Halbleiter-Chip-Zuführung über mehrere Wafer-Bereitstellungsebenen | |
| JPS59105332A (ja) | 半導体装置用自動測定機 |