JPS6411343A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6411343A
JPS6411343A JP16719287A JP16719287A JPS6411343A JP S6411343 A JPS6411343 A JP S6411343A JP 16719287 A JP16719287 A JP 16719287A JP 16719287 A JP16719287 A JP 16719287A JP S6411343 A JPS6411343 A JP S6411343A
Authority
JP
Japan
Prior art keywords
sio2
film
films
polycrystal silicon
leakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16719287A
Other languages
Japanese (ja)
Inventor
Tadanaka Yoneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16719287A priority Critical patent/JPS6411343A/en
Publication of JPS6411343A publication Critical patent/JPS6411343A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the increase of a leakage of electricity due to concentration of electric fields in a low current region by making the height of an insulating film in an isolation region higher than that of the surface of an element formation region and further, by forming edge parts of the element formation region at an obtuse angle. CONSTITUTION:Grooves 34 are formed by etching a p-type silicon substrate 30 where SiO2 and polycrystal silicon films 31 and 32 are formed. Then a SiO2 film 35 is formed by treating with heat in an oxidized atmosphere. In such a case, bird's beaks develop below the polycrystal silicon films 32 and thick SiO2 films 36 are formed. The SiO2 films 37 are formed with a thermal decomposition process so as to fill up the grooves 34. And then a photoresist film is coated and the SiO2 films 37 are etched excessively to expose the polycrystal silicon film 32. And then, a gate oxide film 38 and a gate electrode 39 are formed after removing the polycrystal silicon film 32 and SiO2 film 31. As edge parts 40 of a MOS transistor formed in this way have smoothed angular parts, the increase of a leakage of electricity due to concentration of electric fields does not develop.
JP16719287A 1987-07-03 1987-07-03 Manufacture of semiconductor device Pending JPS6411343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16719287A JPS6411343A (en) 1987-07-03 1987-07-03 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16719287A JPS6411343A (en) 1987-07-03 1987-07-03 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6411343A true JPS6411343A (en) 1989-01-13

Family

ID=15845136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16719287A Pending JPS6411343A (en) 1987-07-03 1987-07-03 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6411343A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0560985A1 (en) * 1991-10-01 1993-09-22 Hitachi, Ltd. Semiconductor integrated circuit device and manufacture thereof
US5733383A (en) * 1992-12-10 1998-03-31 Micron Technology, Inc. Spacers used to form isolation trenches with improved corners
KR20000073736A (en) * 1999-05-13 2000-12-05 황인길 Method of isolating semiconductor elements using trench
EP1183687A1 (en) * 2000-02-23 2002-03-06 Havin Co., Ltd. Apparatus and method for recording digital audio data file

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0560985A1 (en) * 1991-10-01 1993-09-22 Hitachi, Ltd. Semiconductor integrated circuit device and manufacture thereof
US5455438A (en) * 1991-10-01 1995-10-03 Hitachi, Ltd. Semiconductor integrated circuit device in which kink current disturbances of MOS transistors are suppressed
US5733383A (en) * 1992-12-10 1998-03-31 Micron Technology, Inc. Spacers used to form isolation trenches with improved corners
US5868870A (en) * 1992-12-10 1999-02-09 Micron Technology, Inc. Isolation structure of a shallow semiconductor device trench
US5966615A (en) * 1992-12-10 1999-10-12 Micron Technology, Inc. Method of trench isolation using spacers to form isolation trenches with protected corners
KR20000073736A (en) * 1999-05-13 2000-12-05 황인길 Method of isolating semiconductor elements using trench
EP1183687A1 (en) * 2000-02-23 2002-03-06 Havin Co., Ltd. Apparatus and method for recording digital audio data file

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